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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05093of a plurality of vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
- Patent number 11,908,809
- Issue date Feb 20, 2024
- STMicroelectronics (Crolles 2) SAS
- Eric Sabouret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 11,876,063
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,854,873
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance element and its manufacturing method
- Patent number 11,626,221
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Taichi Karino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,569,125
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Allen Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient redistribution layer topology
- Patent number 11,380,637
- Issue date Jul 5, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,195,750
- Issue date Dec 7, 2021
- Tawiwan Semiconductor Manufacturing Co., Ltd.
- Allen Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving wire bonding strength of an image sensor
- Patent number 11,133,275
- Issue date Sep 28, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Yunlong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
- Patent number 11,018,096
- Issue date May 25, 2021
- STMicroelectronics (Crolles 2) SAS
- Eric Sabouret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,950,524
- Issue date Mar 16, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 10,910,491
- Issue date Feb 2, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and integrated circuit die using the same
- Patent number 10,910,330
- Issue date Feb 2, 2021
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad architecture using capacitive deep trench isolation (CD...
- Patent number 10,892,291
- Issue date Jan 12, 2021
- STMicroelectronics (Crolles 2) SAS
- Sonarith Chhun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device having source and drain pads wi...
- Patent number 10,833,185
- Issue date Nov 10, 2020
- Delta Electronics, Inc.
- Wen-Chia Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing architecture of circuits integrated on a wafer
- Patent number 10,746,787
- Issue date Aug 18, 2020
- STMicroelectronics S.R.L.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 10,707,123
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Allen Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device integrated with ESD protection circuit u...
- Patent number 10,665,709
- Issue date May 26, 2020
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having stacking structure of silicon-metallic con...
- Patent number 10,644,121
- Issue date May 5, 2020
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 10,636,703
- Issue date Apr 28, 2020
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 10,622,397
- Issue date Apr 14, 2020
- Canon Kabushiki Kaisha
- Hideaki Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment of a pad and ground in an image sensor
- Patent number 10,586,825
- Issue date Mar 10, 2020
- OmniVision Technologies, Inc.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,573,736
- Issue date Feb 25, 2020
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,573,602
- Issue date Feb 25, 2020
- NANYA TECHNOLOGY CORPORATION
- Mao-Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387418
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...
- Publication number 20240363462
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240332258
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Da Il RIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240047394
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20230377963
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Lun KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230060355
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTANCE ELEMENT AND ITS MANUFACTURING METHOD
- Publication number 20220406494
- Publication date Dec 22, 2022
- Fuji Electric Co., Ltd.
- Taichi KARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Profile Control of Interconnect Structures
- Publication number 20220093457
- Publication date Mar 24, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Allen KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20210384150
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK SENSOR FOR SENSING CRACKS IN A SOLDER PAD, AND METHOD FOR PRO...
- Publication number 20210272915
- Publication date Sep 2, 2021
- STMicroelectronics (Crolles 2) SAS
- Eric SABOURET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098617
- Publication date Apr 1, 2021
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20200328113
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Allen KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20200020791
- Publication date Jan 16, 2020
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190393160
- Publication date Dec 26, 2019
- NANYA TECHNOLOGY CORPORATION
- MAO-YING WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190386128
- Publication date Dec 19, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING STACKING STRUCTURE OF SILICON-METALLIC CON...
- Publication number 20190207005
- Publication date Jul 4, 2019
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT OF A PAD AND GROUND IN AN IMAGE SENSOR
- Publication number 20190165033
- Publication date May 30, 2019
- OMNIVISION TECHNOLOGIES, INC.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190131214
- Publication date May 2, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING ARCHITECTURE OF CIRCUITS INTEGRATED ON A WAFER
- Publication number 20190107575
- Publication date Apr 11, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20190096754
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Allen KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING STACKING STRUCTURE OF SILICON-METALLIC CON...
- Publication number 20190019871
- Publication date Jan 17, 2019
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20190006504
- Publication date Jan 3, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20180315648
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Allen KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180026125
- Publication date Jan 25, 2018
- Delta Electronics, Inc.
- Wen-Chia LIAO
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Efficient redistribution layer topology

Semiconductor device including source pad region and drain pad regi...

Crack sensor for sensing cracks in a solder pad, and method for pro...

Semiconductor package structure and method for preparing the same

Etch profile control of interconnect structures

Semiconductor device having reduced capacitance between source and...

Devices and methods related to stack structures including passivati...

Resistance element and its manufacturing method

Etch profile control of interconnect structures

Efficient redistribution layer topology

Stack structures in electronic devices including passivation layers...

Etch profile control of interconnect structures

Bond pad structure for bonding improvement

Method for improving wire bonding strength of an image sensor

Crack sensor for sensing cracks in a solder pad, and method for pro...

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor device having reduced capacitance between source and...

Pad structure and integrated circuit die using the same

Bonding pad architecture using capacitive deep trench isolation (CD...

Heterojunction semiconductor device having source and drain pads wi...

Testing architecture of circuits integrated on a wafer

Bond pad structure for bonding improvement

Etch profile control of interconnect structures

Power semiconductor device integrated with ESD protection circuit u...

Semiconductor die having stacking structure of silicon-metallic con...

Semiconductor device for preventing crack in pad region and fabrica...

Semiconductor apparatus and equipment

Self-alignment of a pad and ground in an image sensor

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor device and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

RESISTANCE ELEMENT AND ITS MANUFACTURING METHOD

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

Etch Profile Control of Interconnect Structures

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

CRACK SENSOR FOR SENSING CRACKS IN A SOLDER PAD, AND METHOD FOR PRO...

SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE HAVING STACKING STRUCTURE OF SILICON-METALLIC CON...

SELF-ALIGNMENT OF A PAD AND GROUND IN AN IMAGE SENSOR

SEMICONDUCTOR DEVICE

TESTING ARCHITECTURE OF CIRCUITS INTEGRATED ON A WAFER

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

SEMICONDUCTOR DIE HAVING STACKING STRUCTURE OF SILICON-METALLIC CON...

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE