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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,652
- Issue date Nov 5, 2024
- Sumitomo Electric Industries, Ltd.
- Taku Horii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having at least one die with a plurality of taper...
- Patent number 11,990,383
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method therefor
- Patent number 11,967,571
- Issue date Apr 23, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yi-Wang Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,935,852
- Issue date Mar 19, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
- Patent number 11,908,809
- Issue date Feb 20, 2024
- STMicroelectronics (Crolles 2) SAS
- Eric Sabouret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 11,876,063
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,854,873
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure
- Patent number 11,837,564
- Issue date Dec 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 11,769,704
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 11,729,973
- Issue date Aug 15, 2023
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,728,299
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance element and its manufacturing method
- Patent number 11,626,221
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Taichi Karino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 11,581,250
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,569,125
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Allen Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having taper-shaped conductive pillar and method...
- Patent number 11,508,633
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,469,195
- Issue date Oct 11, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,431,378
- Issue date Aug 30, 2022
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP TESTING STRUCTURE AND CHIP TESTING METHOD
- Publication number 20240418771
- Publication date Dec 19, 2024
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240397722
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387418
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...
- Publication number 20240363462
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240332258
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Da Il RIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240282653
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240222297
- Publication date Jul 4, 2024
- FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
- Yi-Wang JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240213194
- Publication date Jun 27, 2024
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240047394
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20230377963
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Lun KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
- Publication number 20230360986
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230060355
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20230054148
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20230056579
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS
- Publication number 20230056520
- Publication date Feb 23, 2023
- Macronix International Co., Ltd.
- Su-Chueh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor bonding structure
- Publication number 20230018214
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTANCE ELEMENT AND ITS MANUFACTURING METHOD
- Publication number 20220406494
- Publication date Dec 22, 2022
- Fuji Electric Co., Ltd.
- Taichi KARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375887
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328433
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE
- Publication number 20220326301
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220278025
- Publication date Sep 1, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

of a single via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Efficient redistribution layer topology

Semiconductor device

Semiconductor chip with redundant thru-silicon-vias

Semiconductor memory

Detection pad structure for analysis in a semiconductor device

Semiconductor device including source pad region and drain pad regi...

Package structure having at least one die with a plurality of taper...

Semiconductor structure and forming method therefor

Semiconductor package and manufacturing method thereof

Method for fabricating semiconductor device with slanted conductive...

Crack sensor for sensing cracks in a solder pad, and method for pro...

Bond pad layout including floating conductive sections

Semiconductor package structure and method for preparing the same

Etch profile control of interconnect structures

Semiconductor bonding structure

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor device having reduced capacitance between source and...

Devices and methods related to stack structures including passivati...

Semiconductor structure having an anti-arcing pattern disposed on a...

Semiconductor memory

Semiconductor device with tilted insulating layers and method for f...

Resistance element and its manufacturing method

Package with metal-insulator-metal capacitor and method of manufact...

Etch profile control of interconnect structures

Package structure having taper-shaped conductive pillar and method...

Semiconductor chip with redundant thru-silicon-vias

Semiconductor device with tilted insulating layers and method for f...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor apparatus

Patents Applicationslast 30 patents

CHIP TESTING STRUCTURE AND CHIP TESTING METHOD

SEMICONDUCTOR MEMORY

SEMICONDUCTOR DEVICE

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BONDING-TYPE INTERCONNECTION MEMBER

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

Semiconductor bonding structure

DISPLAY DEVICE

RESISTANCE ELEMENT AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...