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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/08of an individual bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for face bonded semiconductor device
- Patent number 12,327,776
- Issue date Jun 10, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Rui Tze Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 12,322,717
- Issue date Jun 3, 2025
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display panel including opaque encapsulation and doped planarizatio...
- Patent number 12,322,735
- Issue date Jun 3, 2025
- Au Optronics Corporation
- Fu-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a bit-line-bias vertical...
- Patent number 12,322,452
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Naoto Norizuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,322,718
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,317,494
- Issue date May 27, 2025
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,859
- Issue date May 27, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus manufacturing m...
- Patent number 12,317,627
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED based display panel
- Patent number 12,315,852
- Issue date May 27, 2025
- Apple Inc.
- Dmitry S. Sizov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 12,308,332
- Issue date May 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- G01 - MEASURING TESTING
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, related electronic systems, and methods of...
- Patent number 12,308,333
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194110
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jihye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194113
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250192100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192109
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20250193997
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250191644
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sang-Hoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250192108
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192112
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250192122
- Publication date Jun 12, 2025
- TXC Corporation
- Shih-Yung Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...
- Publication number 20250194091
- Publication date Jun 12, 2025
- SANDISK TECHNOLOGIES, INC.
- Kazuki Isozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS
- Publication number 20250192082
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sangmin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192085
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ARCHITECTURES FOR HYBRID SOLDER AND SOLDERLESS DIE STAC...
- Publication number 20250194109
- Publication date Jun 12, 2025
- Intel Corporation
- Aditya Surendra Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20250194112
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE
- Publication number 20250192127
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Dong Joo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP, INTEGRATED CIRCUIT ASSEMBLY, AND PROCESSING METHOD...
- Publication number 20250192130
- Publication date Jun 12, 2025
- Alibaba Innovation Private Limited
- Yijin Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...
- Publication number 20250192099
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Ashish Alawani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192103
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES
- Publication number 20250194078
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Heonjun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and manufacturing method thereof

Integrated circuit package and method of forming the same

Heat sink for face bonded semiconductor device

Memory devices having vertical transistors and methods for forming...

Fluid channel geometry optimizations to improve cooling efficiency

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor device and method for manufacturing a semiconductor d...

Display panel including opaque encapsulation and doped planarizatio...

Three-dimensional memory device including a bit-line-bias vertical...

Method of forming integrated chip structure having slotted bond pad...

Method of manufacturing die stack structure

Shifted via-chain electrical-test measurements for hybrid bonding a...

Bonded structure with interconnect structure

Semiconductor storage device

Semiconductor memory device

Semiconductor device with redistribution plugs

Conductive buffer layers for semiconductor die assemblies and assoc...

Semiconductor memory device

Semiconductor apparatus and semiconductor apparatus manufacturing m...

Interconnection structure of a semiconductor chip having pads of di...

Micro LED based display panel

Semiconductor device and semiconductor module

Circuitry for electrical redundancy in bonded structures

Packaging architecture for disaggregated integrated voltage regulators

Microelectronic devices, related electronic systems, and methods of...

Semiconductor package

Semiconductor die, manufacturing method thereof, and semiconductor...

Electronic package

Package-on-package device

Multi-chip package having stress relief structure

Patents Applicationslast 30 patents

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

SYSTEM ON INTEGRATED CIRCUIT STRUCTURE

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

MEMORY DEVICE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS

SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

METHODS AND ARCHITECTURES FOR HYBRID SOLDER AND SOLDERLESS DIE STAC...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE

SYSTEM-ON-CHIP, INTEGRATED CIRCUIT ASSEMBLY, AND PROCESSING METHOD...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...