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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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last 30 patents
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Semiconductor device and data storage system including the same
Patent number
11,943,926
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Wonseok Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,942,463
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Hyun Mog Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor interconnect structures with vertically offset bondin...
Patent number
11,942,444
Issue date
Mar 26, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device having multiple chips and method for manufacturing th...
Patent number
11,942,466
Issue date
Mar 26, 2024
Kioxia Corporation
Mutsumi Okajima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device having pixels with the same active layer and method...
Patent number
11,942,025
Issue date
Mar 26, 2024
Samsung Display Co., Ltd.
Jin Wan Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package and manufacturing method thereof
Patent number
11,942,454
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Three-dimensional memory device containing self-aligned bit line co...
Patent number
11,935,784
Issue date
Mar 19, 2024
SanDisk Technologies LLC
Fumitaka Amano
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor memory device having transistors between bonding pads...
Patent number
11,929,352
Issue date
Mar 12, 2024
Kioxia Corporation
Hiroshi Maejima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D memory devices and structures with metal layers
Patent number
11,930,648
Issue date
Mar 12, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multilevel semiconductor device and structure with image sensors an...
Patent number
11,929,372
Issue date
Mar 12, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Vertically mounted die groups
Patent number
11,929,348
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor photodetector array sensor integrated with optical-wa...
Patent number
11,927,814
Issue date
Mar 12, 2024
SCIDATEK INC.
Tomoyuki Izuhara
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, semiconductor testing device, and semiconduct...
Patent number
11,927,622
Issue date
Mar 12, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Masashi Tokunaga
G01 - MEASURING TESTING
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Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
Patent number
11,929,335
Issue date
Mar 12, 2024
United Microelectronics Corp.
Chien-Ming Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including resistor element
Patent number
11,929,336
Issue date
Mar 12, 2024
SK hynix Inc.
Chan Ho Yoon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with capacitor and method for forming the same
Patent number
11,923,352
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Hsin-Li Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Three-dimensional memory device including dielectric rails for warp...
Patent number
11,923,321
Issue date
Mar 5, 2024
SanDisk Technologies LLC
Shin Sakiyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Via connection to wiring in a semiconductor device
Patent number
11,923,291
Issue date
Mar 5, 2024
Kioxia Corporation
Atsushi Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device including sense amplifiers having a...
Patent number
11,925,027
Issue date
Mar 5, 2024
SanDisk Technologies LLC
Takuma Takimoto
G11 - INFORMATION STORAGE
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Patent Grant
Stacked-chip packages having through vias
Patent number
11,923,351
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Daeho Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,923,279
Issue date
Mar 5, 2024
Sony Group Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
Patent number
11,916,038
Issue date
Feb 27, 2024
Canon Anelva Corporation
Takayuki Saitoh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Manufacturing method of semiconductor structure
Patent number
11,916,012
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,916,031
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Microelectronic devices, related electronic systems, and methods of...
Patent number
11,916,032
Issue date
Feb 27, 2024
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,916,002
Issue date
Feb 27, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of reducing reliability degradation of nonvolatile memory de...
Patent number
11,915,770
Issue date
Feb 27, 2024
Samsung Electronics Co., Ltd.
Minseok Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structures and methods for electrically connecting printed horizont...
Patent number
11,916,179
Issue date
Feb 27, 2024
X Display Company Technology Limited
Christopher Andrew Bower
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
Patent number
11,915,742
Issue date
Feb 27, 2024
Micron Technology, Inc.
Sean S. Eilert
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240105541
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
YONGHWAN KWON
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
Publication number
20240105680
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHANNEL LAYER AND METHOD...
Publication number
20240107745
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240105689
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES
Publication number
20240105700
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
Publication number
20240105527
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
Publication number
20240105549
Publication date
Mar 28, 2024
Cisco Technology, Inc.
Yongguo CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE MEMORY DEVICE
Publication number
20240105267
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Inho Kang
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE
Publication number
20240105677
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
Publication number
20240105526
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
Publication number
20240105545
Publication date
Mar 28, 2024
Apple Inc.
Jiongxin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
Publication number
20240105622
Publication date
Mar 28, 2024
SANDISK TECHNOLOGIES LLC
Ramy Nashed Bassely SAID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Publication number
20240105644
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Hao YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240105679
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
YOUNG KUN JEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
Publication number
20240105702
Publication date
Mar 28, 2024
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
Publication number
20240105704
Publication date
Mar 28, 2024
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
Publication number
20240107740
Publication date
Mar 28, 2024
ChangXin Memory Technologies, Inc.
Huihui GUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY SYSTEM, SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
Publication number
20240107759
Publication date
Mar 28, 2024
Yangtze Memory Technologies Co., Ltd.
LinChun WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE
Publication number
20240107765
Publication date
Mar 28, 2024
KIOXIA Corporation
Shinya FUJISE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
Publication number
20240105623
Publication date
Mar 28, 2024
SANDISK TECHNOLOGIES LLC
Ramy Nashed Bassely SAID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240105578
Publication date
Mar 28, 2024
ROHM CO., LTD.
Kohei TANIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
Publication number
20240105674
Publication date
Mar 28, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
Publication number
20240105688
Publication date
Mar 28, 2024
QUALCOMM Incorporated
Xia LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
Publication number
20240105699
Publication date
Mar 28, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHANNEL LAYER AND METHOD...
Publication number
20240107744
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
Publication number
20240096745
Publication date
Mar 21, 2024
Mayank Mayukh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
Publication number
20240098999
Publication date
Mar 21, 2024
KIOXIA Corporation
Junichi HASHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20240099033
Publication date
Mar 21, 2024
KIOXIA Corporation
Toshiaki SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACT...
Publication number
20240096828
Publication date
Mar 21, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS