of an individual connector

Follow

Industry

CPC
H01L2224/66

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/66of an individual connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Cap for a chip device having a groove, device provided with said ca...
- Patent number 9,888,573
- Issue date Feb 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Dominique Vicard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO BONDING DEVICE, BONDING BACKPLANE AND DISPLAY DEVICE
- Publication number 20250054903
- Publication date Feb 13, 2025
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Gang MA
- H01 - BASIC ELECTRIC ELEMENTS