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  • CPC
  • H01L2224/69
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/69of an individual connector
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PACKAGING METHOD
    • Publication number 20190139952
    • Publication date May 9, 2019
    • Shanghai Zhaoxin Semiconductor Co., Ltd.
    • Wen-Yuan Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
    • Publication number 20180344245
    • Publication date Dec 6, 2018
    • International Business Machines Corporation
    • John U. Knickerbocker
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH
    • Publication number 20180012829
    • Publication date Jan 11, 2018
    • Amkor Technology, Inc.
    • Marc Alan Mangrum
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
    • Publication number 20180005982
    • Publication date Jan 4, 2018
    • International Business Machines Corporation
    • John U. Knickerbocker
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20170275453
    • Publication date Sep 28, 2017
    • Fuji Electric Co., Ltd.
    • Yuko Nakamata
    • H01 - BASIC ELECTRIC ELEMENTS