of an individual layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29of an individual layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,308,350
- Issue date May 20, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with metal silicide layer
- Patent number 12,300,654
- Issue date May 13, 2025
- Infineon Technologies AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging stacking flip chip
- Patent number 12,293,984
- Issue date May 6, 2025
- Hebei Beixin Semiconductor Technology Co., Ltd.
- Honglei Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alumina-based thermally conductive oxide and method for producing same
- Patent number 12,281,254
- Issue date Apr 22, 2025
- Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Akira Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method therefor
- Patent number 12,278,320
- Issue date Apr 15, 2025
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,278,218
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
- Patent number 12,278,206
- Issue date Apr 15, 2025
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 12,272,672
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250157873
- Publication date May 15, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20250157997
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
- Publication number 20250157976
- Publication date May 15, 2025
- Resonac Corporation
- Tomoyo KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH ADHESIVES WITH TAILORABLE CHARACTERISTICS USING SELECTIV...
- Publication number 20250154378
- Publication date May 15, 2025
- Micron Technology, Inc.
- Ankur Harish Shah
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20250157975
- Publication date May 15, 2025
- NITTO DENKO CORPORATION
- Tsubasa OMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
- Publication number 20250157998
- Publication date May 15, 2025
- ROBERT BOSCH GmbH
- Dorothea Papathanassiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
- Publication number 20250149493
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Dae Keun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20250149510
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20250149492
- Publication date May 8, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140686
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
- Publication number 20250140732
- Publication date May 1, 2025
- Resonac Corporation
- Tomoya MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF
- Publication number 20250140437
- Publication date May 1, 2025
- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
- Yunhui Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR
- Publication number 20250140764
- Publication date May 1, 2025
- Linhai Qinghui Light Electricity Lamp Co., Ltd.
- Yongfu ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20250140670
- Publication date May 1, 2025
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Solder material

Semiconductor device with metal silicide layer

Solid metal foam thermal interface material

Method of forming a packaged semiconductor device having enhanced w...

Fabrication method for package structure

Adhesive and thermal interface material on a plurality of dies cove...

Method of forming a bonded semiconductor structure

Semiconductor package and method of forming thereof

Semiconductor packages and methods of forming same

Method for packaging stacking flip chip

Semiconductor device and method for manufacturing the same

Adhesive composition for semiconductor circuit connection, adhesive...

Semiconductor packages

Flexible electronic structure

Method for manufacturing semiconductor device

Alumina-based thermally conductive oxide and method for producing same

Light emitting device and manufacturing method therefor

Method for producing nitride mesas each intended to form an electro...

Hybrid embedded packaging structure and manufacturing method thereof

Semiconductor device

Semiconductor package with conductive adhesive that overflows for r...

Integrated fan-out package with 3D magnetic core inductor

Semiconductor device with hollow interconnectors

Capacitive coupling in a direct-bonded interface for microelectroni...

Thermal structure for semiconductor device and method of forming th...

Heat-dissipating structures for semiconductor devices and methods o...

Adhesive member, display device, and manufacturing method of displa...

Low warpage high density trench capacitor

Substrate bonding method

Patents Applicationslast 30 patents

DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...

DIE ATTACH ADHESIVES WITH TAILORABLE CHARACTERISTICS USING SELECTIV...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

POWER MODULE AND POWER CONVERSION APPARATUS

INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS

SEMICONDUCTOR PACKAGE AND METHODS

HETEROGENEOUS ANNEALING METHOD AND DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...

Integrated Circuit with Enhanced Thermal Dissipation Structure

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF

Semiconductor Device and Method of Forming Fan-Out Package Structur...

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR

SEMICONDUCTOR DEVICE

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...