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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
Patent number
12,368,136
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Hyunsu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
Patent number
12,368,144
Issue date
Jul 22, 2025
BOE Technology Group Co., Ltd.
Zhijun Lv
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid integrated circuit packages
Patent number
12,368,146
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic structure having a protrusion structure disposed in a ga...
Patent number
12,362,316
Issue date
Jul 15, 2025
Advanced Semiconductor Engineering, Inc.
Po-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) and electronic apparatus
Patent number
12,362,265
Issue date
Jul 15, 2025
Nuvoton Technology Corporation
Uri Trichter
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Bonding apparatus and bonding method
Patent number
12,362,314
Issue date
Jul 15, 2025
Tokyo Electron Limited
Yuhei Matsuo
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Light emitting diodes and methods
Patent number
12,364,074
Issue date
Jul 15, 2025
CreeLED, Inc.
Christopher P. Hussell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
Patent number
12,362,310
Issue date
Jul 15, 2025
Nagase Chemtex Corporation
Daisuke Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film with carbon-based conductive regions ha...
Patent number
12,362,311
Issue date
Jul 15, 2025
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,354,981
Issue date
Jul 8, 2025
Rohm Co., Ltd.
Koshun Saito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
Patent number
12,347,800
Issue date
Jul 1, 2025
PRAGMATIC SEMICONDUCTOR LIMITED
Ken Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,347,739
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Tip connection portion of terminal member and associated semiconduc...
Patent number
12,347,750
Issue date
Jul 1, 2025
Shindengen Electric Manufacturing Co., Ltd.
Soichiro Umeda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and semiconductor device
Patent number
12,347,814
Issue date
Jul 1, 2025
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device
Patent number
12,340,759
Issue date
Jun 24, 2025
Samsung Display Co., Ltd.
Sujeong Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
Patent number
12,341,120
Issue date
Jun 24, 2025
Rohm Co., Ltd.
Shoji Takei
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semifinished product for populating with components and, method for...
Patent number
12,341,127
Issue date
Jun 24, 2025
Siemens Aktiengesellschaft
Nora Jeske
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
12,341,105
Issue date
Jun 24, 2025
Shinko Electric Industries Co., Ltd.
Kenichi Koi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor module
Patent number
12,334,466
Issue date
Jun 17, 2025
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package including package substrate with dummy via an...
Patent number
12,334,451
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Micro light-emitting diode
Patent number
12,334,481
Issue date
Jun 17, 2025
PlayNitride Display Co., Ltd.
Chi-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming an intermetallic phase layer with a plurality of...
Patent number
12,330,243
Issue date
Jun 17, 2025
Infineon Technologies AG
Alexander Heinrich
B22 - CASTING POWDER METALLURGY
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Patent Grant
Display panel, display device, and manufacturing method of display...
Patent number
12,336,413
Issue date
Jun 17, 2025
Chengdu BOE Optoelectronics Technology Co., Ltd.
Ping Wen
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor device including a lead and a sealing resin
Patent number
12,327,780
Issue date
Jun 10, 2025
Rohm Co., Ltd.
Tomonori Tanioka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
12,327,808
Issue date
Jun 10, 2025
Hitachi Power Semiconductor Device, Ltd.
Naoki Takeda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing a pre-mold substrate
Patent number
12,327,728
Issue date
Jun 10, 2025
HAESUNG DS CO., LTD
Jong Hoe Ku
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip package and manufacturing method thereof
Patent number
12,322,705
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Local interconnect for cross coupling
Patent number
12,322,652
Issue date
Jun 3, 2025
International Business Machines Corporation
Heng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC with heat dissipation structure and warpage control
Patent number
12,322,673
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
Publication number
20250233082
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
LIANG-SHIUAN PENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS AND METHODS FOR REDUCING STRESS AND IMPROVING SURFACE ADHES...
Publication number
20250233097
Publication date
Jul 17, 2025
SK Hynix NAND Product Solutions Corp. (dba Solidigm)
Zhijun Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250233083
Publication date
Jul 17, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Young Do KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250226296
Publication date
Jul 10, 2025
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
Publication number
20250226347
Publication date
Jul 10, 2025
Resonac Corporation
Takaaki NIWA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
Publication number
20250226348
Publication date
Jul 10, 2025
Resonac Corporation
Takahiro KURODA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
PACKAGING STRUCTURE OF RF FRONT-END MODULE
Publication number
20250226350
Publication date
Jul 10, 2025
RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.
Jianxing Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...
Publication number
20250226359
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Zheng-Yong LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
Publication number
20250226302
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Yeoil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250226276
Publication date
Jul 10, 2025
Fuji Electric Co., Ltd.
Takashi SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR, MOLDED MODULE, AND METHOD
Publication number
20250226346
Publication date
Jul 10, 2025
ROBERT BOSCH GmbH
Martin Fleischmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
Publication number
20250218953
Publication date
Jul 3, 2025
Intel Corporation
Zhixin Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
Publication number
20250218990
Publication date
Jul 3, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRUCTURE
Publication number
20250219004
Publication date
Jul 3, 2025
NITTO DENKO CORPORATION
Masatoshi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
Publication number
20250218904
Publication date
Jul 3, 2025
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
Publication number
20250218905
Publication date
Jul 3, 2025
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COPPER PASTE FOR JOINING, METHOD FOR JOINING BODY TO BE JOINED, MET...
Publication number
20250219005
Publication date
Jul 3, 2025
Mitsui Mining and Smelting Co., Ltd.
Satoshi KONNO
B22 - CASTING POWDER METALLURGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250219007
Publication date
Jul 3, 2025
Mitsubishi Electric Corporation
Hiroya SANNAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
Publication number
20250218793
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufactacturing Company, Ltd.
I-Chun WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND 3D I...
Publication number
20250219042
Publication date
Jul 3, 2025
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
Publication number
20250218906
Publication date
Jul 3, 2025
Intel Corporation
Zhixin XIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Selective Shielding Usin...
Publication number
20250218985
Publication date
Jul 3, 2025
STATS ChipPAC Pte Ltd.
JinHee JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Publication number
20250210440
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Minjung KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PUMP-OUT RESISTANT COLDPLATE
Publication number
20250210442
Publication date
Jun 26, 2025
Microsoft Technology Licensing, LLC
Kathryn OSEEN-SENDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250210448
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Myoungchul Eum
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...
Publication number
20250206989
Publication date
Jun 26, 2025
Lintec Corporation
Taku NEMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
Publication number
20250210573
Publication date
Jun 26, 2025
Heraeus Electronics GmbH & Co. KG
Wolfgang SCHMITT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
BONDING STRUCTURE AND PRE-BONDING STRUCTURE
Publication number
20250210575
Publication date
Jun 26, 2025
Advanced Semiconductor Engineering, Inc.
Yun-Ching HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS