of an individual layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29of an individual layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
- Patent number 12,368,144
- Issue date Jul 22, 2025
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structure having a protrusion structure disposed in a ga...
- Patent number 12,362,316
- Issue date Jul 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diodes and methods
- Patent number 12,364,074
- Issue date Jul 15, 2025
- CreeLED, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
- Patent number 12,362,310
- Issue date Jul 15, 2025
- Nagase Chemtex Corporation
- Daisuke Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions ha...
- Patent number 12,362,311
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,347,739
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tip connection portion of terminal member and associated semiconduc...
- Patent number 12,347,750
- Issue date Jul 1, 2025
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,340,759
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Sujeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
- Patent number 12,341,120
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Shoji Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate with dummy via an...
- Patent number 12,334,451
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an intermetallic phase layer with a plurality of...
- Patent number 12,330,243
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display panel, display device, and manufacturing method of display...
- Patent number 12,336,413
- Issue date Jun 17, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ping Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a lead and a sealing resin
- Patent number 12,327,780
- Issue date Jun 10, 2025
- Rohm Co., Ltd.
- Tomonori Tanioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a pre-mold substrate
- Patent number 12,327,728
- Issue date Jun 10, 2025
- HAESUNG DS CO., LTD
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect for cross coupling
- Patent number 12,322,652
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20250233082
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING STRESS AND IMPROVING SURFACE ADHES...
- Publication number 20250233097
- Publication date Jul 17, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250226347
- Publication date Jul 10, 2025
- Resonac Corporation
- Takaaki NIWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
- Publication number 20250226348
- Publication date Jul 10, 2025
- Resonac Corporation
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGING STRUCTURE OF RF FRONT-END MODULE
- Publication number 20250226350
- Publication date Jul 10, 2025
- RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.
- Jianxing Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...
- Publication number 20250226359
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226276
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR, MOLDED MODULE, AND METHOD
- Publication number 20250226346
- Publication date Jul 10, 2025
- ROBERT BOSCH GmbH
- Martin Fleischmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20250219004
- Publication date Jul 3, 2025
- NITTO DENKO CORPORATION
- Masatoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
- Publication number 20250218905
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR JOINING BODY TO BE JOINED, MET...
- Publication number 20250219005
- Publication date Jul 3, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi KONNO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250219007
- Publication date Jul 3, 2025
- Mitsubishi Electric Corporation
- Hiroya SANNAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250218793
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufactacturing Company, Ltd.
- I-Chun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND 3D I...
- Publication number 20250219042
- Publication date Jul 3, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Selective Shielding Usin...
- Publication number 20250218985
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUMP-OUT RESISTANT COLDPLATE
- Publication number 20250210442
- Publication date Jun 26, 2025
- Microsoft Technology Licensing, LLC
- Kathryn OSEEN-SENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...
- Publication number 20250206989
- Publication date Jun 26, 2025
- Lintec Corporation
- Taku NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
- Publication number 20250210573
- Publication date Jun 26, 2025
- Heraeus Electronics GmbH & Co. KG
- Wolfgang SCHMITT
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING STRUCTURE AND PRE-BONDING STRUCTURE
- Publication number 20250210575
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and a method of manufacturing the semiconduct...

Driving backplane, transfer method for light-emitting diode chip, d...

Hybrid integrated circuit packages

Electronic structure having a protrusion structure disposed in a ga...

Integrated circuit (IC) and electronic apparatus

Bonding apparatus and bonding method

Light emitting diodes and methods

Multi-layer sheet for mold underfill encapsulation, method for mold...

Anisotropic conductive film with carbon-based conductive regions ha...

Semiconductor device and method for manufacturing the same

Method of fabricating a conductive layer on an IC using non-lithogr...

Package structure

Tip connection portion of terminal member and associated semiconduc...

Semiconductor package and semiconductor device

Electronic device

Semiconductor chip and semiconductor device including a copper pill...

Semifinished product for populating with components and, method for...

Semiconductor device

Semiconductor module

Semiconductor package including package substrate with dummy via an...

Micro light-emitting diode

Method of forming an intermetallic phase layer with a plurality of...

Display panel, display device, and manufacturing method of display...

Semiconductor device including a lead and a sealing resin

Semiconductor device

Method for manufacturing a pre-mold substrate

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Local interconnect for cross coupling

3DIC with heat dissipation structure and warpage control

Patents Applicationslast 30 patents

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME

SYSTEMS AND METHODS FOR REDUCING STRESS AND IMPROVING SURFACE ADHES...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...

PACKAGING STRUCTURE OF RF FRONT-END MODULE

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR, MOLDED MODULE, AND METHOD

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

CONNECTING STRUCTURE

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...

COPPER PASTE FOR JOINING, METHOD FOR JOINING BODY TO BE JOINED, MET...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE AND METHODS OF FORMATION

HIGH BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND 3D I...

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

Semiconductor Device and Method of Forming Selective Shielding Usin...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

PUMP-OUT RESISTANT COLDPLATE

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...

BONDING STRUCTURE AND PRE-BONDING STRUCTURE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP