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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32of an individual layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,289,048
- Issue date Apr 29, 2025
- Denso Corporation
- Ryota Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and method for manufacturing same
- Patent number 12,289,934
- Issue date Apr 29, 2025
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of an unprocessed, direct-bandgap chip into a silicon p...
- Patent number 12,287,510
- Issue date Apr 29, 2025
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Failover methods and systems in three-dimensional memory device
- Patent number 12,287,712
- Issue date Apr 29, 2025
- RAMBUS INC.
- Joohee Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,743
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light emitting diode
- Patent number 12,284,854
- Issue date Apr 22, 2025
- LG Electronics Inc.
- Sangdae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, and electronic apparatus
- Patent number 12,283,792
- Issue date Apr 22, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kiyohisa Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip design and method of controlling clip position
- Patent number 12,283,562
- Issue date Apr 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding of packaged magnetic random access memory
- Patent number 12,278,195
- Issue date Apr 15, 2025
- Avalanche Technology, Inc.
- Zihui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method therefor
- Patent number 12,278,320
- Issue date Apr 15, 2025
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20250140675
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
- Publication number 20250140732
- Publication date May 1, 2025
- Resonac Corporation
- Tomoya MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...
- Publication number 20250140741
- Publication date May 1, 2025
- Intel Corporation
- Rajiv Mongia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED CONDUCTIVE VIA
- Publication number 20250140748
- Publication date May 1, 2025
- Intel Corporation
- Payam Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140770
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250140664
- Publication date May 1, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND...
- Publication number 20250142991
- Publication date May 1, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250140645
- Publication date May 1, 2025
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140671
- Publication date May 1, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20250140769
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yunyi Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...
- Publication number 20250140654
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Jing GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140660
- Publication date May 1, 2025
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140677
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Min Jeong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140716
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER
- Publication number 20250140771
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF
- Publication number 20250140437
- Publication date May 1, 2025
- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
- Yunhui Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250140667
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140705
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Kyuhyeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20250140672
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...
- Publication number 20250140738
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Takeru ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140765
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor package

Semiconductor module

Display device using micro LED, and method for manufacturing same

Integration of an unprocessed, direct-bandgap chip into a silicon p...

Failover methods and systems in three-dimensional memory device

Microelectronic assemblies

Semiconductor package

Semiconductor device with open cavity and method therefor

Flexible electronic structure

Systems and methods for cooling system and power module for inverte...

High density interconnection using fanout interposer chiplet

Semiconductor package and method of fabricating same

Stacked semiconductor device test circuits and methods of use

Manufacturing method for compound semiconductor device

Electronic package and method of forming the same

Semiconductor structure and manufacturing method thereof

Method for manufacturing semiconductor device

Display device using semiconductor light emitting diode

Light emitting device, and electronic apparatus

Clip design and method of controlling clip position

Semiconductor device and method for manufacturing the same

Systems and methods for parameter drift correction for inverter for...

Methods and heat distribution devices for thermal management of chi...

Semiconductor packages having wiring patterns

Integrated voltage regulator and passive components

Shielding of packaged magnetic random access memory

Method for producing nitride mesas each intended to form an electro...

Hybrid embedded packaging structure and manufacturing method thereof

Light emitting device and manufacturing method therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...

PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...

DOUBLE-SIDED CONDUCTIVE VIA

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit with Enhanced Thermal Dissipation Structure

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND...

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

ELECTRONIC DEVICE

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER

SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF

Semiconductor Device and Method of Forming Fan-Out Package Structur...

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF