of an individual strap connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/40of an individual strap connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module having a substrate arrangement, having p...
- Patent number 12,362,312
- Issue date Jul 15, 2025
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,409
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Yasufumi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved inspectability of stacked semico...
- Patent number 12,334,418
- Issue date Jun 17, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 12,334,414
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder stop feature for electronic devices
- Patent number 12,300,643
- Issue date May 13, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor package and smart card having the same
- Patent number 12,294,000
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin semiconductor packaging unit having a plurality of bridging la...
- Patent number 12,288,737
- Issue date Apr 29, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip design and method of controlling clip position
- Patent number 12,283,562
- Issue date Apr 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,224,230
- Issue date Feb 11, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yasuaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints
- Patent number 12,205,874
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,191,237
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power storage pack, semiconductor device, and semiconductor device...
- Patent number 12,165,958
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Toshifumi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 12,154,814
- Issue date Nov 26, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE
- Publication number 20250239532
- Publication date Jul 24, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233107
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...
- Publication number 20250219029
- Publication date Jul 3, 2025
- MURATA MANUFACTURING CO., LTD.
- David M. GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210532
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE DEVICE CLIP
- Publication number 20250210579
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Engineered Interconnect Structures for Enhanced Bonding Strength
- Publication number 20250201674
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...
- Publication number 20250201754
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Joon Shyan TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...
- Publication number 20250201653
- Publication date Jun 19, 2025
- Vishay General Semiconductor LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20250192093
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
- Publication number 20250183124
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20250183218
- Publication date Jun 5, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIP STACK
- Publication number 20250183219
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR DEVICE
- Publication number 20250183118
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167079
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Ryoji MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS

of an individual strap connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor module having a substrate arrangement, having p...

Semiconductor device and a method of manufacture

Semiconductor package and related methods

Semiconductor device

Semiconductor module

Semiconductor module

Semiconductor module with improved inspectability of stacked semico...

Power semiconductor device with dual heat dissipation structures

Switching device and electronic circuit

Wiring structure and semiconductor module

Power substrate assembly with reduced warpage

Semiconductor device including semiconductor chip having power tran...

Solder stop feature for electronic devices

Fingerprint sensor package and smart card having the same

Thin semiconductor packaging unit having a plurality of bridging la...

Semiconductor packages

Clip design and method of controlling clip position

Semiconductor package having a metal clip and related methods of ma...

Semiconductor device and methods of manufacturing semiconductor dev...

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor device and method for manufacture of semiconductor de...

Semiconductor packages with vertical passive components

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor module

Semiconductor package with wire bond joints

Semiconductor module

Thermal performance improvement and stress reduction in semiconduct...

Half-bridge module for an inverter of an electric drive of an elect...

Power storage pack, semiconductor device, and semiconductor device...

Long-life extended temperature range embedded diode design for elec...

Patents Applicationslast 30 patents

ELECTRONIC MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

POWER STAGE DEVICE CLIP

Engineered Interconnect Structures for Enhanced Bonding Strength

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...

ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMICONDUCTOR PACKAGES WITH CHIP STACK

SEMI-CONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE