of bonding interfaces

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H01L2224/4807

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4807of bonding interfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal resistor and method of manufacturing the same
- Patent number 11,942,392
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jaw-Juinn Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated half-bridge power converter
- Patent number 11,715,720
- Issue date Aug 1, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method of manufacturing the same
- Patent number 10,916,520
- Issue date Feb 9, 2021
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,910,337
- Issue date Feb 2, 2021
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 10,366,958
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure
- Patent number 10,204,863
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 9,997,465
- Issue date Jun 12, 2018
- TAIWAN SEMICONDUCTOR MANUFACUTURING CO., LTD.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 9,576,921
- Issue date Feb 21, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding over active area of a semiconductor circuit
- Patent number 9,153,555
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding over active area of a semiconductor circuit
- Patent number 9,142,527
- Issue date Sep 22, 2015
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling at least one chip using a fabric, and fabric...
- Patent number 9,093,289
- Issue date Jul 28, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Dominique Vicard
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with pads of enhanced moisture blocking ability
- Patent number 8,906,705
- Issue date Dec 9, 2014
- Fujitsu Semiconductor Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,836,146
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper bonding compatible bond pad structure and method
- Patent number 8,753,972
- Issue date Jun 17, 2014
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of wire bonding over active area of a semiconductor circuit
- Patent number 8,742,580
- Issue date Jun 3, 2014
- Megit Acquisition Corp.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having surface protect...
- Patent number 8,716,122
- Issue date May 6, 2014
- Renesas Electronics Corporation
- Takuro Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with a contact pad on a sl...
- Patent number 8,674,511
- Issue date Mar 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,669,555
- Issue date Mar 11, 2014
- Panasonic Corporation
- Masao Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and semiconductor packa...
- Patent number 8,482,002
- Issue date Jul 9, 2013
- Samsung Electronics Co., Ltd.
- Chear-yeon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 8,432,015
- Issue date Apr 30, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,395,260
- Issue date Mar 12, 2013
- Fujitsu Semiconductor Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having surface protective films on bond pad
- Patent number 8,390,134
- Issue date Mar 5, 2013
- Renesas Electronics Corporation
- Takuro Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,338,829
- Issue date Dec 25, 2012
- Panasonic Corporation
- Masao Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266247
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaw-Juinn HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230068846
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaw-Juinn HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Half-Bridge Power Converter
- Publication number 20220084978
- Publication date Mar 17, 2022
- Navitas Semiconductor Limited
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210280554
- Publication date Sep 9, 2021
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035638
- Publication date Jan 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Noriko OKUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20200027848
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20190206812
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180294227
- Publication date Oct 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180158794
- Publication date Jun 7, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Kiyoshi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180151499
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180122766
- Publication date May 3, 2018
- RENESAS ELECTRONICS CORPORATION
- Noriko OKUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20160163666
- Publication date Jun 9, 2016
- Renesas Electronics Corporation
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130149855
- Publication date Jun 13, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130075727
- Publication date Mar 28, 2013
- PANASONIC CORPORATION
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING AT LEAST ONE CHIP USING A FABRIC, AND FABRIC...
- Publication number 20130033879
- Publication date Feb 7, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Dominique Vicard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130034955
- Publication date Feb 7, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING COMPATIBLE BOND PAD STRUCTURE AND METHOD
- Publication number 20120064711
- Publication date Mar 15, 2012
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120061847
- Publication date Mar 15, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY
- Publication number 20120056322
- Publication date Mar 8, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110266540
- Publication date Nov 3, 2011
- PANASONIC CORPORATION
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDING PROCESS
- Publication number 20110192885
- Publication date Aug 11, 2011
- NXP B.V.
- Hendrik Pieter HOCHSTENBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having Through Wire Interconnect With Compr...
- Publication number 20110108959
- Publication date May 12, 2011
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...
- Publication number 20110089566
- Publication date Apr 21, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PACKAGED STRUCTURE
- Publication number 20110079906
- Publication date Apr 7, 2011
- Shih-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
- Publication number 20110068469
- Publication date Mar 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

of bonding interfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal resistor and method of manufacturing the same

Wire bonding for semiconductor devices

Integrated half-bridge power converter

Wire bonding between isolation capacitors for multichip modules

Semiconductor apparatus

Microfluidic manufactured mesoscopic microelectronics interconnect

Semiconductor device, and method of manufacturing the same

Semiconductor device

Semiconductor integrated circuit device

Wire bonding between isolation capacitors for multichip modules

Semiconductor package structure

Semiconductor package structure

Semiconductor device and manufacturing method for the same

Semiconductor integrated circuit device

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Method for assembling at least one chip using a fabric, and fabric...

Method for fabricating a bond

Semiconductor device with pads of enhanced moisture blocking ability

Chip package and method for fabricating the same

Copper bonding compatible bond pad structure and method

Method of wire bonding over active area of a semiconductor circuit

Method of manufacturing semiconductor device having surface protect...

Method of forming a semiconductor device with a contact pad on a sl...

Semiconductor device

Semiconductor device including bonding pads and semiconductor packa...

Semiconductor device and wire bonding method

Semiconductor device and manufacturing method thereof

Semiconductor device having surface protective films on bond pad

Semiconductor device

Patents Applicationslast 30 patents

THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME

POWER MODULE

THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

Integrated Half-Bridge Power Converter

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR ASSEMBLING AT LEAST ONE CHIP USING A FABRIC, AND FABRIC...

SEMICONDUCTOR DEVICE

COPPER BONDING COMPATIBLE BOND PAD STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

WIREBONDING PROCESS

Semiconductor Component Having Through Wire Interconnect With Compr...

WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...

PRE-PACKAGED STRUCTURE

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS