of bonding interfaces

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3207of bonding interfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,114,526
- Issue date Oct 8, 2024
- LG Display Co., Ltd.
- Yeonjae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,791,296
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,508,685
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,195,811
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with dam structure and method for forming the same
- Patent number 11,101,214
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,094,664
- Issue date Aug 17, 2021
- Mitsubishi Electric Corporation
- Hiroaki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,573,617
- Issue date Feb 25, 2020
- Mitsubishi Electric Corporation
- Hiroaki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,142,493
- Issue date Sep 22, 2015
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for applying solder to semiconductor chips using decals w...
- Patent number 8,272,120
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Peter A. Gruber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level integrated interconnect decal and manufacturing method...
- Patent number 8,138,020
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die level integrated interconnect decal manufacturing method and ap...
- Patent number 8,053,283
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Peter A. Gruber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating semiconductor chip package using screen print...
- Patent number 6,943,061
- Issue date Sep 13, 2005
- NS Electronics Bangkok (1993) Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230154882
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20230076511
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- JIHWAN SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...
- Publication number 20230036430
- Publication date Feb 2, 2023
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP
- Publication number 20220278010
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220181592
- Publication date Jun 9, 2022
- LG Display Co., Ltd.
- Yeonjae JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20220102307
- Publication date Mar 31, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220059493
- Publication date Feb 24, 2022
- KIOXIA Corporation
- Yoshiharu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20210384125
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
- Publication date Nov 25, 2021
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...
- Publication number 20210280551
- Publication date Sep 9, 2021
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20210125955
- Publication date Apr 29, 2021
- Samsung Electronics Co., Ltd.
- JIHWAN SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20200373270
- Publication date Nov 26, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20200321304
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200194399
- Publication date Jun 18, 2020
- Mitsubishi Electric Corporation
- Hiroaki TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180190611
- Publication date Jul 5, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20170117246
- Publication date Apr 27, 2017
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
- Publication number 20160126165
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Paul FRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140367701
- Publication date Dec 18, 2014
- Mitsubishi Electrict Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110272450
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110237030
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS

of bonding interfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Method for forming package structure

Stacked semiconductor package

Semiconductor device and manufacturing method thereof

Dielectric and metallic nanowire bond layers

Stacked semiconductor package

High reliability semiconductor devices and methods of fabricating t...

Dielectric and metallic nanowire bond layers

Package structure with dam structure and method for forming the same

Semiconductor device and method of manufacturing semiconductor device

Method for electrically contacting a component by galvanic connecti...

Method and apparatus for creating a bond between objects based on f...

Metallic interconnect, a method of manufacturing a metallic interco...

Semiconductor device and method of manufacturing semiconductor device

Power semiconductor package device having locking mechanism, and pr...

Au-based solder die attachment semiconductor device and method for...

Semiconductor device

Method and structure for wafer to wafer bonding in semiconductor pa...

Apparatus for applying solder to semiconductor chips using decals w...

Wafer level integrated interconnect decal and manufacturing method...

Die level integrated interconnect decal manufacturing method and ap...

Method of fabricating semiconductor chip package using screen print...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE

BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP

DISPLAY DEVICE

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING PACKAGE STRUCTURE

RELIABLE SEMICONDUCTOR PACKAGES

BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

STACKED SEMICONDUCTOR PACKAGE

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Massively parallel transfer of microLED devices

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...