of discrete passive components

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H01L2924/19101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/19101of discrete passive components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,456,226
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure smart node and data concentrator for distributed engine control
- Patent number 11,414,201
- Issue date Aug 16, 2022
- University of Dayton
- Vamsy Chodavarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with wall-side capacitors
- Patent number 11,158,568
- Issue date Oct 26, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,886,192
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutli-chip package with encapsulated conductor via
- Patent number 10,867,890
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components having three-dimensional capacitors in a meta...
- Patent number 10,741,486
- Issue date Aug 11, 2020
- Intel Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,636,715
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 10,607,914
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,601,307
- Issue date Mar 24, 2020
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan-out package and method of manufacturing the same
- Patent number 10,580,742
- Issue date Mar 3, 2020
- Samsung Electronics Co., Ltd.
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan-out package and method of manufacturing the same
- Patent number 10,461,044
- Issue date Oct 29, 2019
- Samsung Electronics Co., Ltd.
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 10,347,550
- Issue date Jul 9, 2019
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising switches and filters
- Patent number 10,312,193
- Issue date Jun 4, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power device with vertical 3D switching cell
- Patent number 10,083,942
- Issue date Sep 25, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bastien Letowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded buffer circuit compensation scheme for integrated circuits
- Patent number 9,813,046
- Issue date Nov 7, 2017
- Intel Corporation
- Sameer Shekhar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Face-up substrate integration with solder ball connection in semico...
- Patent number 9,468,098
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Massively parallel interconnect fabric for complex semiconductor de...
- Patent number 9,035,443
- Issue date May 19, 2015
- Majid Bemanian
- G11 - INFORMATION STORAGE
Information Patent Grant
Wiring board, method of manufacturing the same, and semiconductor d...
- Patent number 8,749,073
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF shielding for a singulated laminate semiconductor device package
- Patent number 8,084,300
- Issue date Dec 27, 2011
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145350
- Publication date May 2, 2024
- MEDIATEK INC.
- Pu-Shan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20230230951
- Publication date Jul 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220384288
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200258801
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200105689
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200083801
- Publication date Mar 12, 2020
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WAFER LEVEL FAN-OUT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200013731
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- PENG ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH WALL-SIDE CAPACITORS
- Publication number 20190244883
- Publication date Aug 8, 2019
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190139845
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER LEVEL FAN-OUT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261553
- Publication date Sep 13, 2018
- Samsung Electronics Co., Ltd.
- PENG ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20180076106
- Publication date Mar 15, 2018
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC POWER DEVICE WITH VERTICAL 3D SWITCHING CELL
- Publication number 20170338208
- Publication date Nov 23, 2017
- CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- Bastien LETOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BUFFER CIRCUIT COMPENSATION SCHEME FOR INTEGRATED CIRCUITS
- Publication number 20170288647
- Publication date Oct 5, 2017
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS HAVING THREE-DIMENSIONAL CAPACITORS IN A META...
- Publication number 20170256480
- Publication date Sep 7, 2017
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
- Publication number 20140231996
- Publication date Aug 21, 2014
- Canon Kabushiki Kaisha
- Yoshitomo Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively Parallel Interconnect Fabric for Complex Semiconductor De...
- Publication number 20120068229
- Publication date Mar 22, 2012
- Majid Bemanian
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...
- Publication number 20110304016
- Publication date Dec 15, 2011
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

of discrete passive components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Secure smart node and data concentrator for distributed engine control

Package with wall-side capacitors

Semiconductor package

Mutli-chip package with encapsulated conductor via

Electronic components having three-dimensional capacitors in a meta...

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor device and method for manufacturing the same

Wafer level fan-out package and method of manufacturing the same

Wafer level fan-out package and method of manufacturing the same

Semiconductor package and method of making the same

Package comprising switches and filters

Electronic power device with vertical 3D switching cell

Electronic module comprising fluid cooling channel and method of ma...

Power semiconductor device

Embedded buffer circuit compensation scheme for integrated circuits

Face-up substrate integration with solder ball connection in semico...

Massively parallel interconnect fabric for complex semiconductor de...

Wiring board, method of manufacturing the same, and semiconductor d...

RF shielding for a singulated laminate semiconductor device package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WAFER LEVEL FAN-OUT PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE WITH WALL-SIDE CAPACITORS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

WAFER LEVEL FAN-OUT PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

ELECTRONIC POWER DEVICE WITH VERTICAL 3D SWITCHING CELL

EMBEDDED BUFFER CIRCUIT COMPENSATION SCHEME FOR INTEGRATED CIRCUITS

ELECTRONIC COMPONENTS HAVING THREE-DIMENSIONAL CAPACITORS IN A META...

Electronic module comprising fluid cooling channel and method of ma...

STACKED TYPE SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

Massively Parallel Interconnect Fabric for Complex Semiconductor De...

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...