of layers not containing Si

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H01L21/31122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/31122of layers not containing Si

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal oxide resists for EUV patterning and methods for developing t...
- Patent number 12,332,568
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Hamed Hajibabaeinajafabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,334,359
- Issue date Jun 17, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal atomic layer etching processes
- Patent number 12,320,012
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Tom E. Blomberg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 12,315,727
- Issue date May 27, 2025
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal atomic layer etching processes
- Patent number 12,312,696
- Issue date May 27, 2025
- ASM IP Holding B.V.
- Tom E. Blomberg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dry etching method, method for producing semiconductor device, and...
- Patent number 12,308,244
- Issue date May 20, 2025
- Central Glass Company, Limited
- Kunihiro Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch selectivity control in atomic layer etching
- Patent number 12,280,091
- Issue date Apr 22, 2025
- Lam Research Corporation
- Andreas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide directional removal
- Patent number 12,272,563
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching method using ligand exchange reaction
- Patent number 12,255,075
- Issue date Mar 18, 2025
- SK Hynix Inc.
- Jae Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,237,174
- Issue date Feb 25, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazunori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process for oxide of alkaline earth metal
- Patent number 12,237,172
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask trimming in method for manufacturing semiconductor device
- Patent number 12,217,961
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chien Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and method for manufacturing the same
- Patent number 12,191,155
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings in semiconductor devices
- Patent number 12,191,202
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Blaze Messer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,119,233
- Issue date Oct 15, 2024
- Resonac Corporation
- Kazuma Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to create air gaps
- Patent number 12,112,980
- Issue date Oct 8, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming patterned structures including silico...
- Patent number 12,100,597
- Issue date Sep 24, 2024
- ASM IP Holding B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a substrate
- Patent number 12,074,009
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Yuki Iijima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,062,522
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Keiji Kitagaito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method of bi-layer pixel isolation in advanced LCOS b...
- Patent number 12,055,821
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,051,595
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS
- Publication number 20250183041
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Yao-Tsung HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL OXIDE DIRECTIONAL REMOVAL
- Publication number 20250183053
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING SUBSTRATE USING BORON COMPOUND
- Publication number 20250174454
- Publication date May 29, 2025
- TES CO., LTD
- Hyeong-Wook MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOLUME SHRINKAGE, HIGH ETCH RESISTANCE AND HIGH RESOLUTION PHOT...
- Publication number 20250157818
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Lin WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERS FOR BEOL MULTI-PATTERNING
- Publication number 20250157952
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Debanjan Jana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ATOMIC LAYER ETCHING PROCESSES
- Publication number 20250154662
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR DEVICE
- Publication number 20250151360
- Publication date May 8, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Wenjie SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE SENSORS AND A METHOD OF MANUFACTURE
- Publication number 20250146971
- Publication date May 8, 2025
- Paragraf Limited
- Liam McDonnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF CARBON GAPFILL MATERIALS
- Publication number 20250137119
- Publication date May 1, 2025
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHLORINE-FREE REMOVAL OF MOLYBDENUM OXIDES FROM SUBSTRATES
- Publication number 20250132165
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING USING BORON TRICHLORIDE
- Publication number 20250125155
- Publication date Apr 17, 2025
- LAM RESEARCH CORPORATION
- Andreas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096004
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-YUAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...
- Publication number 20250095990
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE MANDRELS IN PATTERNING
- Publication number 20250087498
- Publication date Mar 13, 2025
- LAM RESEARCH CORPORATION
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
- Publication number 20250087494
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHODS AND PATTERNED SUBSTRATES MADE USING SAID METHODS
- Publication number 20250087479
- Publication date Mar 13, 2025
- Ohio State Innovation Foundation
- Siddharth Rajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave-Enhanced Atomic Layer Etching
- Publication number 20250079182
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Charles Dezelah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED DIAMOND-LIKE CARBON
- Publication number 20250046610
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250038005
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRODUCTION OF METAL IN HARD MASK FOR HIGH ASPECT RATIO DEVICE PAT...
- Publication number 20240395561
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for Semiconductor Devices Including Backside Power Rails
- Publication number 20240387249
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICALLY ETCHING A TARGET LAYER
- Publication number 20240363358
- Publication date Oct 31, 2024
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND...
- Publication number 20240282583
- Publication date Aug 22, 2024
- Resonac Corporation
- Jumpei IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMFER-LESS VIA INTEGRATION SCHEME
- Publication number 20240263301
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

of layers not containing Si

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal oxide resists for EUV patterning and methods for developing t...

Plasma etching method

Thermal atomic layer etching processes

Eliminating yield impact of stochastics in lithography

Thermal atomic layer etching processes

Dry etching method, method for producing semiconductor device, and...

Semiconductor device with self-aligned vias

Etch selectivity control in atomic layer etching

Metal oxide directional removal

Atomic layer etching method using ligand exchange reaction

Etching method

Etch process for oxide of alkaline earth metal

Hard mask trimming in method for manufacturing semiconductor device

Semiconductor structures and method for manufacturing the same

Contact openings in semiconductor devices

Tin oxide mandrels in patterning

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Methods for forming recesses in source/drain regions and devices fo...

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Etching method

Highly etch selective amorphous carbon film

Method to create air gaps

Method and system for forming patterned structures including silico...

Tin oxide films in semiconductor device manufacturing

Apparatus for processing a substrate

Plasma etching method and plasma etching apparatus

Structure and method of bi-layer pixel isolation in advanced LCOS b...

Plasma processing method and plasma processing apparatus

Patents Applicationslast 30 patents

LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS

METAL OXIDE DIRECTIONAL REMOVAL

METHOD FOR TREATING SUBSTRATE USING BORON COMPOUND

LOW VOLUME SHRINKAGE, HIGH ETCH RESISTANCE AND HIGH RESOLUTION PHOT...

SPACERS FOR BEOL MULTI-PATTERNING

THERMAL ATOMIC LAYER ETCHING PROCESSES

HIGH ELECTRON MOBILITY TRANSISTOR DEVICE

GRAPHENE SENSORS AND A METHOD OF MANUFACTURE

DEPOSITION OF CARBON GAPFILL MATERIALS

CHLORINE-FREE REMOVAL OF MOLYBDENUM OXIDES FROM SUBSTRATES

ATOMIC LAYER ETCHING USING BORON TRICHLORIDE

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME

METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...

TIN OXIDE MANDRELS IN PATTERNING

SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL

ETCHING METHODS AND PATTERNED SUBSTRATES MADE USING SAID METHODS

Microwave-Enhanced Atomic Layer Etching

DOPED DIAMOND-LIKE CARBON

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

METHOD TO CREATE AIR GAPS

INTRODUCTION OF METAL IN HARD MASK FOR HIGH ASPECT RATIO DEVICE PAT...

Microelectromechanical Systems (MEMS) Fabrication Process Including...

SEMICONDUCTOR DEVICE AND METHOD

Spacers for Semiconductor Devices Including Backside Power Rails

DEVICE AND METHOD OF FORMING THE SAME

BOTTOM-UP FORMATION OF CONTACT PLUGS

METHODS FOR CHEMICALLY ETCHING A TARGET LAYER

DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND...

CHAMFER-LESS VIA INTEGRATION SCHEME