of layers not containing Si

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CPC
H01L21/31122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31122of layers not containing Si

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,119,233
- Issue date Oct 15, 2024
- Resonac Corporation
- Kazuma Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to create air gaps
- Patent number 12,112,980
- Issue date Oct 8, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming patterned structures including silico...
- Patent number 12,100,597
- Issue date Sep 24, 2024
- ASM IP Holding B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a substrate
- Patent number 12,074,009
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Yuki Iijima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,062,522
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Keiji Kitagaito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method of bi-layer pixel isolation in advanced LCOS b...
- Patent number 12,055,821
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,051,595
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 12,051,589
- Issue date Jul 30, 2024
- Lam Research Corporation
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a substrate
- Patent number 12,020,904
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Yuki Iijima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,014,927
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-doped carbon hardmasks
- Patent number 12,014,925
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for highly anisotropic etching of titanium oxide spacer usin...
- Patent number 12,009,211
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfer-less via integration scheme
- Patent number 11,987,876
- Issue date May 21, 2024
- Lam Research Corporation
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively manufacturing material layer and target pattern
- Patent number 11,976,364
- Issue date May 7, 2024
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Tae Joo Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum processing method
- Patent number 11,961,719
- Issue date Apr 16, 2024
- HITACHI HIGH-TECH CORPORATION
- Nozomu Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,961,746
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Sho Kumakura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for selective dry etching gallium oxide
- Patent number 11,942,330
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metal-containing layers
- Patent number 11,942,332
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Akhil Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,929,424
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,923,428
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chi Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of middle layer removal
- Patent number 11,923,199
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nai-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRODUCTION OF METAL IN HARD MASK FOR HIGH ASPECT RATIO DEVICE PAT...
- Publication number 20240395561
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for Semiconductor Devices Including Backside Power Rails
- Publication number 20240387249
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICALLY ETCHING A TARGET LAYER
- Publication number 20240363358
- Publication date Oct 31, 2024
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND...
- Publication number 20240282583
- Publication date Aug 22, 2024
- Resonac Corporation
- Jumpei IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMFER-LESS VIA INTEGRATION SCHEME
- Publication number 20240263301
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240266184
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- HSUAN-WU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition of Passivating Layer During Spacer Etching
- Publication number 20240258108
- Publication date Aug 1, 2024
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL
- Publication number 20240258116
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20240258115
- Publication date Aug 1, 2024
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH OF BORON-CONTAINING MATERIAL
- Publication number 20240249953
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Yeonju Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...
- Publication number 20240243010
- Publication date Jul 18, 2024
- ADEKA CORPORATION
- JIHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE INCLUDING...
- Publication number 20240234148
- Publication date Jul 11, 2024
- SK HYNIX INC.
- Cha Deok DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM LITHOGRAPHY AND NANOENGINEERING
- Publication number 20240222073
- Publication date Jul 4, 2024
- Intel Corporation
- Shida Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
- Publication number 20240222470
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240213032
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS
- Publication number 20240203747
- Publication date Jun 20, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20240194489
- Publication date Jun 13, 2024
- Hitachi High-Tech Corporation
- Yusuke Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT METHOD, DRY ETCHING METHOD, CLEANING METHOD, PROD...
- Publication number 20240194490
- Publication date Jun 13, 2024
- Central Glass Company, Limited
- Kunihiro YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240186390
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ETCHING OF RUTHENIUM
- Publication number 20240153781
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Hisashi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition For Forming Metal Oxide Film, Patterning Process, And M...
- Publication number 20240153771
- Publication date May 9, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERN OF METAL OXIDE AND METHOD FOR PRODUCING...
- Publication number 20240105466
- Publication date Mar 28, 2024
- Resonac Corporation
- Kazuma MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20240105461
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Hirohisa YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING METHOD USING LIGAND EXCHANGE REACTION
- Publication number 20240079249
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Chul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PATTERNIG SUBSTRATE, PATTERNED SUBSTRATE, A...
- Publication number 20240072127
- Publication date Feb 29, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Hiroshi FUKUI
- H01 - BASIC ELECTRIC ELEMENTS

of layers not containing Si

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tin oxide mandrels in patterning

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Methods for forming recesses in source/drain regions and devices fo...

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Etching method

Highly etch selective amorphous carbon film

Method to create air gaps

Method and system for forming patterned structures including silico...

Tin oxide films in semiconductor device manufacturing

Apparatus for processing a substrate

Plasma etching method and plasma etching apparatus

Structure and method of bi-layer pixel isolation in advanced LCOS b...

Plasma processing method and plasma processing apparatus

Tin oxide thin film spacers in semiconductor device manufacturing

Apparatus for processing a substrate

Highly etch selective amorphous carbon film

Metal-doped carbon hardmasks

Method for highly anisotropic etching of titanium oxide spacer usin...

Chamfer-less via integration scheme

Method for selectively manufacturing material layer and target pattern

Vacuum processing method

Substrate processing method and substrate processing apparatus

Methods for selective dry etching gallium oxide

Methods of etching metal-containing layers

Semiconductor device and method for forming the same

Etching platinum-containing thin film using protective cap layer

Fin field-effect transistor and method of forming the same

Method and structure of middle layer removal

Patents Applicationslast 30 patents

METHOD TO CREATE AIR GAPS

INTRODUCTION OF METAL IN HARD MASK FOR HIGH ASPECT RATIO DEVICE PAT...

Microelectromechanical Systems (MEMS) Fabrication Process Including...

SEMICONDUCTOR DEVICE AND METHOD

Spacers for Semiconductor Devices Including Backside Power Rails

DEVICE AND METHOD OF FORMING THE SAME

BOTTOM-UP FORMATION OF CONTACT PLUGS

METHODS FOR CHEMICALLY ETCHING A TARGET LAYER

DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND...

CHAMFER-LESS VIA INTEGRATION SCHEME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Selective Deposition of Passivating Layer During Spacer Etching

SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...

DRY ETCH OF BORON-CONTAINING MATERIAL

INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...

METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE INCLUDING...

ION BEAM LITHOGRAPHY AND NANOENGINEERING

ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS

PLASMA PROCESSING METHOD

SURFACE TREATMENT METHOD, DRY ETCHING METHOD, CLEANING METHOD, PROD...

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

THERMAL ETCHING OF RUTHENIUM

Composition For Forming Metal Oxide Film, Patterning Process, And M...

METHOD FOR FORMING PATTERN OF METAL OXIDE AND METHOD FOR PRODUCING...

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

ATOMIC LAYER ETCHING METHOD USING LIGAND EXCHANGE REACTION

MANUFACTURING METHOD OF PATTERNIG SUBSTRATE, PATTERNED SUBSTRATE, A...