of organic insulating material

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H05K3/0032

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0032of organic insulating material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,213,253
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacturing of printed conductive tracks on an ob...
- Patent number 11,825,610
- Issue date Nov 21, 2023
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Thermally induced graphene sensing circuitry on intelligent valves,...
- Patent number 11,812,561
- Issue date Nov 7, 2023
- Schlumberger Technology Corporation
- Manuel Marya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral features providing improved flexible printed circuit foldi...
- Patent number 11,533,807
- Issue date Dec 20, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of producing multilayer substrate
- Patent number 11,443,886
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for preparing graphene by means of laser irradiation in l...
- Patent number 11,357,113
- Issue date Jun 7, 2022
- Jiangsu University
- Xudong Ren
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable thin film devices
- Patent number 11,191,952
- Issue date Dec 7, 2021
- Pacesetter, Inc.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with component embedded in cavity and with double...
- Patent number 11,160,169
- Issue date Oct 26, 2021
- AT&S (Chongqing) Company Limited
- Yu-Hui Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,134,575
- Issue date Sep 28, 2021
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,057,996
- Issue date Jul 6, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,019,722
- Issue date May 25, 2021
- Shinko Electric Industries Co., Ltd.
- Kenichi Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing trapezoidal through-hole in component carrier material
- Patent number 10,950,463
- Issue date Mar 16, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,903,577
- Issue date Jan 26, 2021
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable circuit board and method for manufacturing the same
- Patent number 10,863,620
- Issue date Dec 8, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,813,220
- Issue date Oct 20, 2020
- TDK Corporation
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cured body and multilayered substrate
- Patent number 10,767,051
- Issue date Sep 8, 2020
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC L...
- Publication number 20240196542
- Publication date Jun 13, 2024
- LCP Medical Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...
- Publication number 20240080989
- Publication date Mar 7, 2024
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Manuel Marya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230290716
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATHETER-DEPLOYABLE SOFT ROBOTIC SENSOR ARRAYS AND PROCESSING OF FL...
- Publication number 20230146045
- Publication date May 11, 2023
- Cornell University
- Simon Dunham
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230113278
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Component on Stepped Metal Structur...
- Publication number 20230098587
- Publication date Mar 30, 2023
- AT&S (Chongqing) Company Limited
- Steve HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL VIA SHIELDED INTERPOSER
- Publication number 20230063808
- Publication date Mar 2, 2023
- Apple Inc.
- Nima Shahidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
Via Bond attachment
- Publication number 20230053225
- Publication date Feb 16, 2023
- Harbor Electronics, Inc.
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20220408560
- Publication date Dec 22, 2022
- SONY GROUP CORPORATION
- Koji AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220369458
- Publication date Nov 17, 2022
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising at Least Two Components
- Publication number 20220287181
- Publication date Sep 8, 2022
- AT&S (Chongqing) Company Limited
- Dominik WILDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Platable Thermoplastic Compositions
- Publication number 20220227930
- Publication date Jul 21, 2022
- SHPP Global Technologies B.V.
- Yapeng FANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
IMPLANTABLE THIN FILM DEVICES
- Publication number 20220088375
- Publication date Mar 24, 2022
- PACESETTER, INC.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071000
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Well-Defined Outline Sidewall Cut by Short L...
- Publication number 20220061162
- Publication date Feb 24, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING DEVICE CONNECTED BODY, AND DEVICE CONNECTE...
- Publication number 20210345484
- Publication date Nov 4, 2021
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...
- Publication number 20210321521
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Manuel Marya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20210289637
- Publication date Sep 16, 2021
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Structure
- Publication number 20210274652
- Publication date Sep 2, 2021
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20210243896
- Publication date Aug 5, 2021
- TRANSLARITY, INC.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
A PROCESS FOR THE MANUFACTURING OF PRINTED CONDUCTIVE TRACKS ON AN...
- Publication number 20210227697
- Publication date Jul 22, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Gari ARUTINOV
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...
- Publication number 20210212195
- Publication date Jul 8, 2021
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL CONDUCTOR LAMINATED SUBSTRATE
- Publication number 20210136930
- Publication date May 6, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
Component Carrier With Electrically Conductive Layer Structures Hav...
- Publication number 20210127496
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Conductor Laminated Substrate
- Publication number 20210100109
- Publication date Apr 1, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
GLASS SUBSTRATE WITH THROUGH GLASS VIAS
- Publication number 20200303188
- Publication date Sep 24, 2020
- Nippon Sheet Glass Company, Limited
- Keiji TSUNETOMO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

of organic insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Component carrier with well-defined outline sidewall cut by short l...

Component carrier comprising at least two components

Circuit structure

Redistribution plate

Via bond attachment

Multilayer substrate and a manufacturing method of the multilayer s...

Process for the manufacturing of printed conductive tracks on an ob...

Thermally induced graphene sensing circuitry on intelligent valves,...

Multilayer coil circuit substrate

Dual conductor laminated substrate

Circuit structure

Integral features providing improved flexible printed circuit foldi...

Redistribution plate

Component carrier with electrically conductive layer structures hav...

Multilayer substrate and method of producing multilayer substrate

Apparatus for preparing graphene by means of laser irradiation in l...

Method for producing resin multilayer board

Implantable thin film devices

Component carrier with component embedded in cavity and with double...

Dual conductor laminated substrate

Circuit board, method of manufacturing circuit board, and electroni...

Wiring board manufacturing method and wiring board

Wiring substrate

Manufacturing trapezoidal through-hole in component carrier material

Printed wiring board

Bendable circuit board and method for manufacturing the same

Electronic component embedded substrate

Cured body and multilayered substrate

Patents Applicationslast 30 patents

ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC L...

THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...

Circuit Structure

CIRCUIT BOARD

Component Carrier

CATHETER-DEPLOYABLE SOFT ROBOTIC SENSOR ARRAYS AND PROCESSING OF FL...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

Component Carrier With Embedded Component on Stepped Metal Structur...

COAXIAL VIA SHIELDED INTERPOSER

REDISTRIBUTION PLATE

Via Bond attachment

Component Carrier With Different Stack Heights and Vertical Opening...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...

PRINTED CIRCUIT BOARD

Component Carrier Comprising at Least Two Components

Laser Platable Thermoplastic Compositions

IMPLANTABLE THIN FILM DEVICES

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Component Carrier With Well-Defined Outline Sidewall Cut by Short L...

METHOD FOR MANUFACTURING DEVICE CONNECTED BODY, AND DEVICE CONNECTE...

THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...

METHOD FOR PRODUCING PRINTED WIRING BOARD

Circuit Structure

REDISTRIBUTION PLATE

A PROCESS FOR THE MANUFACTURING OF PRINTED CONDUCTIVE TRACKS ON AN...

INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...

DUAL CONDUCTOR LAMINATED SUBSTRATE

Component Carrier With Electrically Conductive Layer Structures Hav...

Dual Conductor Laminated Substrate

GLASS SUBSTRATE WITH THROUGH GLASS VIAS