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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding head with large and small spray apertures
- Patent number 11,817,419
- Issue date Nov 14, 2023
- SHIBUYA CORPORATION
- Masato Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems and methods for semi-flexible eutectic bonder piece arraneg...
- Patent number 11,211,354
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction means for warp control of substrates through clamping
- Patent number 8,685,833
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding stage and electronic component packaging ap...
- Patent number 6,991,703
- Issue date Jan 31, 2006
- Sumitomo Osaka Cement Co., Ltd.
- Takeshi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230076668
- Publication date Mar 9, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20220367404
- Publication date Nov 17, 2022
- SHIBUYA CORPORATION
- Masato KITAGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...
- Publication number 20210098415
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MASS TRANSFER TOOL MANIPULATOR ASSEMBLY
- Publication number 20160176045
- Publication date Jun 23, 2016
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Mass Transfer Tool Manipulator Assembly
- Publication number 20140241843
- Publication date Aug 28, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING
- Publication number 20130260534
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method, bonding stage and electronic component packaging ap...
- Publication number 20040063251
- Publication date Apr 1, 2004
- Sumitomo Osaka Cement Co., Ltd.
- Takeshi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS

of other portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal compression bonder nozzle with vacuum relief features

Method for manufacturing semiconductor device

Solder reflow apparatus and method of manufacturing an electronic d...

Pressure sintering device and method for manufacturing an electroni...

Semiconductor manufacturing apparatus

Method of manufacturing a semiconductor package

Bonding head with large and small spray apertures

Thermal compression bonder nozzle with vacuum relief features

Bonding head including a thermal compensator, die bonding apparatus...

Systems and methods for semi-flexible eutectic bonder piece arraneg...

Mass transfer tool manipulator assembly

Bonding apparatus and bonding method

Stress reduction means for warp control of substrates through clamping

Bonding method, bonding stage and electronic component packaging ap...

Patents Applicationslast 30 patents

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SUBSTRATE HOLDER AND BONDING SYSTEM

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...

MASS TRANSFER TOOL MANIPULATOR ASSEMBLY

Mass Transfer Tool Manipulator Assembly

STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING

BONDING APPARATUS AND BONDING METHOD

Bonding method, bonding stage and electronic component packaging ap...