of previously made multilayered subassemblies

Industry

CPC
H05K2203/061

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/061of previously made multilayered subassemblies

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring body and method for manufacturing same
- Patent number 11,564,313
- Issue date Jan 24, 2023
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,452,214
- Issue date Sep 20, 2022
- HELLA GMBH & CO. KGAA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Prepreg, laminate, printed wiring board, coreless substrate, semico...
- Patent number 11,214,660
- Issue date Jan 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding known-good component between known-good component carrier...
- Patent number 11,184,983
- Issue date Nov 23, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,160,174
- Issue date Oct 26, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 11,102,892
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate bonding structure
- Patent number 11,096,282
- Issue date Aug 17, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with alternatingly vertically stacked layer struc...
- Patent number 10,834,831
- Issue date Nov 10, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,820,427
- Issue date Oct 27, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating metal foil with n-heterocyclic carbene compounds containing...
- Patent number 10,588,222
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit carrier structure, manufacturing method thereof and chip pa...
- Patent number 10,575,397
- Issue date Feb 25, 2020
- Unimicron Technology Corp.
- Chien-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced substrate includes a carbene-coated metal foil laminated t...
- Patent number 10,506,723
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Dylan J. Boday
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Microelectronic modules including thermal extension levels and meth...
- Patent number 10,440,813
- Issue date Oct 8, 2019
- NXP USA, INC.
- Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded board and method of manufacturing same
- Patent number 10,383,231
- Issue date Aug 13, 2019
- Fujikura Ltd.
- Yoshinori Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable multilayer electronics
- Patent number 10,375,831
- Issue date Aug 6, 2019
- Intel Corporation
- Chwee Lin Choong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible electrically conductive bonding films
- Patent number 10,362,717
- Issue date Jul 23, 2019
- 3M Innovative Properties Company
- Jeanne M. Bruss
- B32 - LAYERED PRODUCTS
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,362,687
- Issue date Jul 23, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method for manufacturing same
- Patent number 10,285,260
- Issue date May 7, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly with foam dielectric material
- Patent number 10,249,943
- Issue date Apr 2, 2019
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,123,432
- Issue date Nov 6, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing resin multilayer substrate
- Patent number 10,098,238
- Issue date Oct 9, 2018
- Murata Manufacturing Co., Ltd.
- Masaki Kawata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230232540
- Publication date Jul 20, 2023
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230072239
- Publication date Mar 9, 2023
- SHENNAN CIRCUITS CO.,LTD.
- ZHICHENG YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20220322534
- Publication date Oct 6, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Shin Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20220053636
- Publication date Feb 17, 2022
- NIPPON MEKTRON, LTD.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE
- Publication number 20210348276
- Publication date Nov 11, 2021
- ARISAWA MFG. CO., LTD.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Component Carrier With an Embedded Thermally Conductive Block and M...
- Publication number 20210337653
- Publication date Oct 28, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FPCB with PCT film and Method for making the FPCB
- Publication number 20210092838
- Publication date Mar 25, 2021
- JIN YOUNG GLOBAL CO., LTD.
- Kyong Do KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200015364
- Publication date Jan 9, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20190254175
- Publication date Aug 15, 2019
- HELLA GmbH & Co. KGaA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE MULTILAYER ELECTRONICS
- Publication number 20190208640
- Publication date Jul 4, 2019
- Chwee Lin Choong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20190075662
- Publication date Mar 7, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Alternatingly Vertically Stacked Layer Struc...
- Publication number 20180343751
- Publication date Nov 29, 2018
- Mikael Tuominen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE ELECTRICALLY CONDUCTIVE BONDING FILMS
- Publication number 20180235113
- Publication date Aug 16, 2018
- 3M Innovative Properties Company
- Jeanne M. Bruss
- B32 - LAYERED PRODUCTS
Information Patent Application
COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...
- Publication number 20180168051
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170265295
- Publication date Sep 14, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-BEND PRINTED CIRCUIT BOARD FABRICATION
- Publication number 20170142829
- Publication date May 18, 2017
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD AND CIRCUIT BOARD
- Publication number 20170086307
- Publication date Mar 23, 2017
- Schweizer Electronic AG
- GOTTWALD Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE CIRCUIT BOARD HAVING FLYING-TAIL STRUCTURE AND METHO...
- Publication number 20160324012
- Publication date Nov 3, 2016
- GUANGZHOU FASTPRINT CIRCUT TECH CO., LTD.
- Xingya QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH PROJECTION SCREEN AND MANUFACTURING METHOD THEREOF
- Publication number 20160216789
- Publication date Jul 28, 2016
- CORETRONIC CORPORATION
- Kun-Rong Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...
- Publication number 20160157362
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Dylan J. Boday
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160037624
- Publication date Feb 4, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyung-Chul Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Printed Circuit Board with MultiLayer Sub-Ar...
- Publication number 20160007450
- Publication date Jan 7, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Alexander Kasper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150245484
- Publication date Aug 27, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joung Gul Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A TOUCH PANEL
- Publication number 20150144255
- Publication date May 28, 2015
- HENGHAO TECHNOLOGY CO. LTD
- YEN-CHUN PENG
- B32 - LAYERED PRODUCTS

of previously made multilayered subassemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing printed circuit board

Composite circuit board and method of manufacturing the same

Laminate

Method of manufacturing circuits using thick metals and machined bu...

Method for fabricating asymmetric board

Structure for embedding and packaging multiple devices by layer and...

Component carrier with an embedded thermally conductive block and m...

Method of manufacturing multilayer substrate

Wiring body and method for manufacturing same

Printed circuit board

Simultaneous and selective wide gap partitioning of via structures...

Prepreg, laminate, printed wiring board, coreless substrate, semico...

Embedding known-good component between known-good component carrier...

Method of manufacturing multilayer substrate

Coating metal foil with N-heterocyclic carbene compounds containing...

Substrate bonding structure

Component carrier with alternatingly vertically stacked layer struc...

Simultaneous and selective wide gap partitioning of via structures...

Coating metal foil with n-heterocyclic carbene compounds containing...

Circuit carrier structure, manufacturing method thereof and chip pa...

Enhanced substrate includes a carbene-coated metal foil laminated t...

Microelectronic modules including thermal extension levels and meth...

Component-embedded board and method of manufacturing same

Stretchable multilayer electronics

Flexible electrically conductive bonding films

Simultaneous and selective wide gap partitioning of via structures...

Flexible printed circuit board and method for manufacturing same

Printed circuit board assembly with foam dielectric material

Simultaneous and selective wide gap partitioning of via structures...

Method of manufacturing resin multilayer substrate

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

METHOD FOR FABRICATING ASYMMETRIC BOARD

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

WIRING BODY AND METHOD FOR MANUFACTURING SAME

LAMINATE

Component Carrier With an Embedded Thermally Conductive Block and M...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

FPCB with PCT film and Method for making the FPCB

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

PRINTED CIRCUIT BOARD

STRETCHABLE MULTILAYER ELECTRONICS

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

Component Carrier With Alternatingly Vertically Stacked Layer Struc...

FLEXIBLE ELECTRICALLY CONDUCTIVE BONDING FILMS

COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...

PRINTED CIRCUIT BOARD

RIGID-BEND PRINTED CIRCUIT BOARD FABRICATION

METHOD FOR PRODUCING A CIRCUIT BOARD AND CIRCUIT BOARD

RIGID-FLEXIBLE CIRCUIT BOARD HAVING FLYING-TAIL STRUCTURE AND METHO...

TOUCH PROJECTION SCREEN AND MANUFACTURING METHOD THEREOF

COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Method for Producing a Printed Circuit Board with MultiLayer Sub-Ar...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING A TOUCH PANEL