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H01L21/3221

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3221of silicon bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 12,020,950
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal mitigation die using back side etch
- Patent number 11,817,365
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial wafer manufacturing method and epitaxial wafer
- Patent number RE49657
- Issue date Sep 12, 2023
- Sumco Corporation
- Takuro Iwanaga
Information Patent Grant
Exposure apparatus, exposure method, and method for manufacturing s...
- Patent number 11,747,737
- Issue date Sep 5, 2023
- Canon Kabushiki Kaisha
- Kazuhiro Takahashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Vertical power semiconductor device including a field stop region h...
- Patent number 11,742,384
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and semiconductor device
- Patent number 11,676,996
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Akira Kiyoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method thereof
- Patent number 11,615,959
- Issue date Mar 28, 2023
- HESTIA POWER SHANGHAI TECHNOLOGY INC.
- Lurng-Shehng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for suspending a thin layer on a cavity with a stiffening ef...
- Patent number 11,587,826
- Issue date Feb 21, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guillaume Berre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,562,910
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering property evaluation apparatus
- Patent number 11,557,488
- Issue date Jan 17, 2023
- Disco Corporation
- Yasushi Tanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphorus fugitive emission control
- Patent number 11,545,368
- Issue date Jan 3, 2023
- Applied Materials, Inc.
- Cuiyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having IGBT and diode with field stop layer fo...
- Patent number 11,508,581
- Issue date Nov 22, 2022
- Fuji Electric Co., Ltd.
- Kouji Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip gettering
- Patent number 11,393,697
- Issue date Jul 19, 2022
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,380,597
- Issue date Jul 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for modifying substrates based on crystal lattice dislocatio...
- Patent number 11,309,191
- Issue date Apr 19, 2022
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peeling method and method of manufacturing semiconductor device
- Patent number 11,296,131
- Issue date Apr 5, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and process for electron beam mediated plasma etch and de...
- Patent number 11,257,685
- Issue date Feb 22, 2022
- Tokyo Electron Limited
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cells with improved lifetime, passivation and/or efficiency
- Patent number 11,251,315
- Issue date Feb 15, 2022
- SunPower Corporation
- David D. Smith
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of producing semiconductor epitaxial wafer, semiconductor ep...
- Patent number 11,211,423
- Issue date Dec 28, 2021
- Sumco Corporation
- Ryosuke Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon germanium alloy fins with reduced defects
- Patent number 11,201,231
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light assisted platelet formation facilitating layer transfer from...
- Patent number 11,173,697
- Issue date Nov 16, 2021
- GlobalWafers Co., Ltd.
- Gang Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermal processing method for silicon wafer
- Patent number 11,162,191
- Issue date Nov 2, 2021
- Globalwafers Japan Co., Ltd
- Susumu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFETs with multiple dislocation planes
- Patent number 11,158,740
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphorus fugitive emission control
- Patent number 11,127,601
- Issue date Sep 21, 2021
- Applied Materials, Inc.
- Cuiyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a wafer from an ingot including a peel-off dete...
- Patent number 11,114,307
- Issue date Sep 7, 2021
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 11,107,823
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for film modification
- Patent number 11,049,731
- Issue date Jun 29, 2021
- Applied Materials, Inc.
- Erica Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device and method for removing...
- Patent number 11,038,110
- Issue date Jun 15, 2021
- EWHA University-Industry Collaboration Foundation
- Sang Wook Lee
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for forming semiconductor device structure having oxide layer
- Patent number 11,018,022
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPITAXIAL WAFER AND PRODUCTION METHOD THEREFOR
- Publication number 20240395563
- Publication date Nov 28, 2024
- Shin-Etsu Handotai Co., Ltd.
- Atsushi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER
- Publication number 20240395564
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240304457
- Publication date Sep 12, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...
- Publication number 20240297201
- Publication date Sep 5, 2024
- SUMCO CORPORATION
- Takeshi Kadono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240297052
- Publication date Sep 5, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...
- Publication number 20240282801
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Takeshi KADONO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ENHANCING STABILITY OF N-TYPE SEMICONDUCTOR THROUGH OXYG...
- Publication number 20240266187
- Publication date Aug 8, 2024
- TIANJIN UNIVERSITY
- Liqiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE
- Publication number 20240071756
- Publication date Feb 29, 2024
- SUMCO CORPORATION
- Koji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN EPITAXIAL WAFER
- Publication number 20240063027
- Publication date Feb 22, 2024
- Shin-Etsu Handotai Co., Ltd.
- Katsuyoshi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Power Semiconductor Device and Manufacturing Method
- Publication number 20230352531
- Publication date Nov 2, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING LAYER FORMING DEVICE AND PROCESSING APPARATUS
- Publication number 20230321781
- Publication date Oct 12, 2023
- Disco Corporation
- Fumiteru TASHINO
- B24 - GRINDING POLISHING
Information Patent Application
DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATUR...
- Publication number 20230230868
- Publication date Jul 20, 2023
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT
- Publication number 20230223274
- Publication date Jul 13, 2023
- CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
- Marc L. Tarabbia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20230162989
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- I-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON SUBSTRATE
- Publication number 20230119333
- Publication date Apr 20, 2023
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230064733
- Publication date Mar 2, 2023
- Hestia Power Shanghai Technology Inc.
- Lurng-Shehng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VERIFICATION OF CONDUCTIVITY TYPE OF SILICON WAFER
- Publication number 20230037569
- Publication date Feb 9, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220301885
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- I-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phosphorus Fugitive Emission Control
- Publication number 20210384041
- Publication date Dec 9, 2021
- Applied Materials, Inc.
- Cuiyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20210320174
- Publication date Oct 14, 2021
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER
- Publication number 20210280432
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING PROPERTY EVALUATION APPARATUS
- Publication number 20210175131
- Publication date Jun 10, 2021
- Disco Corporation
- Yasushi TANNO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE
- Publication number 20210151314
- Publication date May 20, 2021
- SUMCO CORPORATION
- Koji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT REDUCTION OF SEMICONDUCTOR LAYERS AND SEMICONDUCTOR DEVICES...
- Publication number 20210104415
- Publication date Apr 8, 2021
- Semiconductor Components Industries, LLC
- Ali SALIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP GETTERING
- Publication number 20210050223
- Publication date Feb 18, 2021
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELLS WITH IMPROVED LIFETIME, PASSIVATION AND/OR EFFICIENCY
- Publication number 20210043782
- Publication date Feb 11, 2021
- SunPower Corporation
- David D. SMITH
- H01 - BASIC ELECTRIC ELEMENTS

of silicon bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for forming thereof

Bonded structures

Thermal mitigation die using back side etch

Epitaxial wafer manufacturing method and epitaxial wafer

Exposure apparatus, exposure method, and method for manufacturing s...

Vertical power semiconductor device including a field stop region h...

Method of manufacturing semiconductor device, and semiconductor device

Silicon carbide semiconductor device and manufacturing method thereof

Method for suspending a thin layer on a cavity with a stiffening ef...

Semiconductor structure and method for forming thereof

Gettering property evaluation apparatus

Phosphorus fugitive emission control

Semiconductor device having IGBT and diode with field stop layer fo...

Semiconductor chip gettering

Bonded structures

Method for modifying substrates based on crystal lattice dislocatio...

Peeling method and method of manufacturing semiconductor device

Apparatus and process for electron beam mediated plasma etch and de...

Solar cells with improved lifetime, passivation and/or efficiency

Method of producing semiconductor epitaxial wafer, semiconductor ep...

Silicon germanium alloy fins with reduced defects

Light assisted platelet formation facilitating layer transfer from...

Thermal processing method for silicon wafer

MOSFETs with multiple dislocation planes

Phosphorus fugitive emission control

Method of producing a wafer from an ingot including a peel-off dete...

Integrated structures and methods of forming integrated structures

Methods for film modification

Method for manufacturing electronic device and method for removing...

Method for forming semiconductor device structure having oxide layer

Patents Applicationslast 30 patents

EPITAXIAL WAFER AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER

PROCESSING METHOD OF BONDED WAFER

METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...

PROCESSING METHOD OF BONDED WAFER

METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...

METHOD FOR ENHANCING STABILITY OF N-TYPE SEMICONDUCTOR THROUGH OXYG...

BONDED STRUCTURES

BONDED STRUCTURES

METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE

METHOD FOR PRODUCING AN EPITAXIAL WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

Vertical Power Semiconductor Device and Manufacturing Method

GETTERING LAYER FORMING DEVICE AND PROCESSING APPARATUS

DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATUR...

INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON SUBSTRATE

SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR VERIFICATION OF CONDUCTIVITY TYPE OF SILICON WAFER

BONDED STRUCTURES

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

Phosphorus Fugitive Emission Control

VERTICAL POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER

GETTERING PROPERTY EVALUATION APPARATUS

METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE

DEFECT REDUCTION OF SEMICONDUCTOR LAYERS AND SEMICONDUCTOR DEVICES...

SEMICONDUCTOR CHIP GETTERING

SOLAR CELLS WITH IMPROVED LIFETIME, PASSIVATION AND/OR EFFICIENCY