of silicon-containing layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/32137of silicon-containing layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,341,020
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration processes utilizing boron-doped silicon materials
- Patent number 12,334,358
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,336,271
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure
- Patent number 12,328,897
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,327,735
- Issue date Jun 10, 2025
- Semes Co., Ltd.
- Seong Gil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate with silicon sidewall spacers
- Patent number 12,310,052
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Han Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,300,741
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Teng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,283,622
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide and tin carbide materials for semiconductor patterning ap...
- Patent number 12,272,564
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming and monitoring quality of the same
- Patent number 12,237,417
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices using directional pro...
- Patent number 12,230,507
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 12,217,973
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kosuke Ogasawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching features using a targeted deposition for selecti...
- Patent number 12,217,955
- Issue date Feb 4, 2025
- Lam Research Corporation
- Wenchi Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Profile shaping for control gate recesses
- Patent number 12,211,908
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Akhil Singhal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming FinFET device
- Patent number 12,211,750
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 12,165,911
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,154,792
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing metal gate overhang by forming a top-wide bottom-narrow du...
- Patent number 12,142,664
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method
- Patent number 12,142,484
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,131,964
- Issue date Oct 29, 2024
- HITACHI HIGH-TECH CORPORATION
- Kousuke Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 12,112,954
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,094,687
- Issue date Sep 17, 2024
- HITACHI HIGH-TECH CORPORATION
- Masayuki Shiina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating gate test structure for embedded memory device
- Patent number 12,096,629
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SIDEWALL PASSIVATION USING ALDEHYDE OR ISOCYANATE CHEMISTRY FOR HIG...
- Publication number 20250188600
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATION OF SEMICONDUCTOR STRUCTURES AND APPARATUS FO...
- Publication number 20250183045
- Publication date Jun 5, 2025
- National Yang Ming Chiao Tung University
- Seiji Samukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOMARKER SENSING STRUCTURE
- Publication number 20250164441
- Publication date May 22, 2025
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Method of Forming and Monitoring Quality of the Same
- Publication number 20250169101
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250154409
- Publication date May 15, 2025
- Resonac Corporation
- Atsushi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...
- Publication number 20250149330
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Wenchi LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...
- Publication number 20250149343
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON GATE ETCH METHOD
- Publication number 20250140571
- Publication date May 1, 2025
- Shanghai Huali Integrated Circuit Corporation
- Jin XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURI...
- Publication number 20250140564
- Publication date May 1, 2025
- SK Specialty Co., Ltd.
- Byunghyang KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250142926
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
- Publication number 20250118566
- Publication date Apr 10, 2025
- HITACHI HIGH-TECH CORPORATION
- Junya Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...
- Publication number 20250095990
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250089332
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhi-Qiang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC PLASMA ETCHING USING C2H2F2
- Publication number 20250079183
- Publication date Mar 6, 2025
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Nathan STAFFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
- Publication number 20240379505
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation
- Publication number 20240373613
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layer Formation during Plasma Etching Conductive Materials
- Publication number 20240371655
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stealth Patterning Formation for Bonding Improvement
- Publication number 20240363359
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING HIGH ASPECT RATIO STRUCTURES
- Publication number 20240332031
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Feng QIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON
- Publication number 20240290628
- Publication date Aug 29, 2024
- American Air Liquide, Inc.
- Tomo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...
- Publication number 20240282585
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Bin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20240274408
- Publication date Aug 15, 2024
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...
- Publication number 20240249936
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240234161
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240136197
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

of silicon-containing layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing method and substrate processing apparatus

Integration processes utilizing boron-doped silicon materials

Semiconductor devices and methods of manufacturing thereof

Structure and formation method of semiconductor device structure

Apparatus and method for processing substrate

Metal gate with silicon sidewall spacers

Semiconductor device and method

Semiconductor device and method

Tin oxide and tin carbide materials for semiconductor patterning ap...

FinFET device and method of forming and monitoring quality of the same

Method of manufacturing semiconductor devices using directional pro...

Semiconductor device and manufacturing method thereof

Method of etching film and plasma processing apparatus

Method for etching features using a targeted deposition for selecti...

Profile shaping for control gate recesses

Mechanisms for forming FinFET device

Semiconductor device and manufacturing method thereof

Method for forming a semiconductor-on-insulator (SOI) substrate

Methods for etching a material layer for semiconductor applications

Etching method and plasma processing apparatus

Plasma etching method

Reducing metal gate overhang by forming a top-wide bottom-narrow du...

Single chamber flowable film formation and treatments

Etching method

Plasma processing apparatus and plasma processing method

Selective liquid sliding surface and method of fabricating the same

Etching method, substrate processing apparatus, and substrate proce...

Selective silicon deposition

Plasma processing apparatus and plasma processing method

Floating gate test structure for embedded memory device

Patents Applicationslast 30 patents

SIDEWALL PASSIVATION USING ALDEHYDE OR ISOCYANATE CHEMISTRY FOR HIG...

METHOD FOR FABRICATION OF SEMICONDUCTOR STRUCTURES AND APPARATUS FO...

BIOMARKER SENSING STRUCTURE

FinFET Device and Method of Forming and Monitoring Quality of the Same

ETCHING METHOD

METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

POLYSILICON GATE ETCH METHOD

METHOD OF ETCHING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE

METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-C...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CRYOGENIC PLASMA ETCHING USING C2H2F2

ETCHING METHOD

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

Bond Films for Reduced Thermal Resistance and Methods Forming the Same

Conductive Feature Formation

Protection Layer Formation during Plasma Etching Conductive Materials

Stealth Patterning Formation for Bonding Improvement

METHOD FOR ETCHING HIGH ASPECT RATIO STRUCTURES

ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON

TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...

HIGH ENERGY ATOMIC LAYER ETCHING

METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES