of silicon-containing layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32137of silicon-containing layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 12,165,911
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,154,792
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing metal gate overhang by forming a top-wide bottom-narrow du...
- Patent number 12,142,664
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method
- Patent number 12,142,484
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,131,964
- Issue date Oct 29, 2024
- HITACHI HIGH-TECH CORPORATION
- Kousuke Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 12,112,954
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,094,687
- Issue date Sep 17, 2024
- HITACHI HIGH-TECH CORPORATION
- Masayuki Shiina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating gate test structure for embedded memory device
- Patent number 12,096,629
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive feature formation
- Patent number 12,096,609
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 12,051,589
- Issue date Jul 30, 2024
- Lam Research Corporation
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved polysilicon etch dimensional control
- Patent number 12,020,948
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Jui He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming circuit-protection devices
- Patent number 12,015,026
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional modification of patterning structure to enhance pattern...
- Patent number 11,984,318
- Issue date May 14, 2024
- Applied Materials, Inc.
- Shurong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,967,533
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metal-containing layers
- Patent number 11,942,332
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Akhil Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of middle layer removal
- Patent number 11,923,199
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nai-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making shallow trench structure
- Patent number 11,901,217
- Issue date Feb 13, 2024
- NEXCHIP SEMICONDUCTOR CORPORATION
- Tzujen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices and methods of fabri...
- Patent number 11,888,042
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kwang Soo Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure of semiconductor device and method for forming the same
- Patent number 11,854,825
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching techniques
- Patent number 11,837,467
- Issue date Dec 5, 2023
- Toyko Electron Limited
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,830,764
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device comprising flash memory and r...
- Patent number 11,810,967
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 11,804,379
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Taku Gohira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
- Publication number 20240379505
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation
- Publication number 20240373613
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layer Formation during Plasma Etching Conductive Materials
- Publication number 20240371655
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stealth Patterning Formation for Bonding Improvement
- Publication number 20240363359
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING HIGH ASPECT RATIO STRUCTURES
- Publication number 20240332031
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Feng QIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON
- Publication number 20240290628
- Publication date Aug 29, 2024
- American Air Liquide, Inc.
- Tomo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...
- Publication number 20240282585
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Bin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20240274408
- Publication date Aug 15, 2024
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...
- Publication number 20240249936
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240234161
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240136197
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072142
- Publication date Feb 29, 2024
- SEMES CO., LTD.
- Thomas Jongwan KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240064952
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Rong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20240030031
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021682
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014213
- Publication date Jan 11, 2024
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Zheng Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE SHAPING FOR CONTROL GATE RECESSES
- Publication number 20230411462
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Akhil Singhal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230402289
- Publication date Dec 14, 2023
- TOKYO ELECTRON LIMITED
- Kae TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230386932
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL
- Publication number 20230386857
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Jui HE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLASMA SYSTEMS AND PROCESSES WITH PULSED MAGNETIC FIELD
- Publication number 20230377853
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20230377948
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20230369140
- Publication date Nov 16, 2023
- NEXPERIA B.V.
- Steven Peake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Etching High Aspect Ratio Features Within A Dielectric U...
- Publication number 20230360925
- Publication date Nov 9, 2023
- TOKYO ELECTRON LIMITED
- JinYing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20230360977
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Hong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230352563
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING GATE TEST STRUCTURE FOR EMBEDDED MEMORY DEVICE
- Publication number 20230345717
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS

of silicon-containing layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Method for forming a semiconductor-on-insulator (SOI) substrate

Methods for etching a material layer for semiconductor applications

Etching method and plasma processing apparatus

Plasma etching method

Reducing metal gate overhang by forming a top-wide bottom-narrow du...

Single chamber flowable film formation and treatments

Etching method

Plasma processing apparatus and plasma processing method

Selective liquid sliding surface and method of fabricating the same

Etching method, substrate processing apparatus, and substrate proce...

Selective silicon deposition

Plasma processing apparatus and plasma processing method

Floating gate test structure for embedded memory device

Conductive feature formation

Tin oxide films in semiconductor device manufacturing

Tin oxide thin film spacers in semiconductor device manufacturing

Method for improved polysilicon etch dimensional control

Methods of forming circuit-protection devices

Directional modification of patterning structure to enhance pattern...

Semiconductor devices and methods of manufacturing thereof

Methods of etching metal-containing layers

Method and structure of middle layer removal

Method and apparatus for making shallow trench structure

Three-dimensional semiconductor memory devices and methods of fabri...

Gate structure of semiconductor device and method for forming the same

Plasma etching techniques

Method for forming a semiconductor-on-insulator (SOI) substrate

Method of making semiconductor device comprising flash memory and r...

Etching method and plasma processing apparatus

Patents Applicationslast 30 patents

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

Bond Films for Reduced Thermal Resistance and Methods Forming the Same

Conductive Feature Formation

Protection Layer Formation during Plasma Etching Conductive Materials

Stealth Patterning Formation for Bonding Improvement

METHOD FOR ETCHING HIGH ASPECT RATIO STRUCTURES

ETCHING METHOD USING OXYGEN-CONTAINING HYDROFLUOROCARBON

TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...

HIGH ENERGY ATOMIC LAYER ETCHING

METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

PROFILE SHAPING FOR CONTROL GATE RECESSES

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL

PLASMA SYSTEMS AND PROCESSES WITH PULSED MAGNETIC FIELD

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

Method For Etching High Aspect Ratio Features Within A Dielectric U...

WAFER PROCESSING METHOD

Semiconductor Device and Method

FLOATING GATE TEST STRUCTURE FOR EMBEDDED MEMORY DEVICE