of the interface with the bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48453of the interface with the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire bonding for semiconductor devices
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- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
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Wire bonding method and wire bonding apparatus
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- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
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- Issue date Feb 23, 2021
- Micron Technology, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, recording element substrate, and liquid disc...
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- Issue date Feb 2, 2021
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
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- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an intermediate layer disposed between two...
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- Issue date Jun 9, 2020
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Information Patent Grant
Light emitting element
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- Duk Il Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
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- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond connection with intermediate contact structure
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- Issue date Oct 8, 2019
- Intel Corporation
- Yong She
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date May 14, 2019
- LG Innotek Co., Ltd
- Yeong Deuk Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,153,241
- Issue date Dec 11, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die
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- Issue date Oct 23, 2018
- Global Circuit Innovations, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Jun 19, 2018
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- Shotaro Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,499
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire and electrode joining method and joint structure
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- Issue date Oct 17, 2017
- Toyota Jidosha Kabushiki Kaisha
- Yoh Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a bondpad and bondpad
- Patent number 9,780,053
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Magdalena Hoier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory device, electronic device, or method f...
- Patent number 9,773,787
- Issue date Sep 26, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Takanori Matsuzaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,754,919
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
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- Shing-Ren SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
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- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE
- Publication number 20240120300
- Publication date Apr 11, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038698
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Erh-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
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- TEXAS INSTRUMENTS INCORPORATED
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SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...
- Publication number 20220254824
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- Sony Semiconductor Solutions Corporation
- MITSUHITO KANATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20210175228
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
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- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20200152620
- Publication date May 14, 2020
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, RECORDING ELEMENT SUBSTRATE, AND LIQUID DISC...
- Publication number 20200001605
- Publication date Jan 2, 2020
- Canon Kabushiki Kaisha
- Masaya Uyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
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WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE
- Publication number 20190051627
- Publication date Feb 14, 2019
- Intel Corporation
- Yong SHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20180166608
- Publication date Jun 14, 2018
- Seoul Viosys Co., Ltd.
- Duk Il Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die
- Publication number 20180047685
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330864
- Publication date Nov 16, 2017
- Renesas Electronics Corporation
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20170263568
- Publication date Sep 14, 2017
- Amkor Technology, Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication date Aug 17, 2017
- LG Innotek Co., Ltd.
- Yeong Deuk Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE
- Publication number 20170179075
- Publication date Jun 22, 2017
- Toyota Jidosha Kabushiki Kaisha
- Yoh SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20170125440
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- Semiconductor Energy Laboratory Co., Ltd.
- Munehiro KOZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY DEVICE, ELECTRONIC DEVICE, OR METHOD F...
- Publication number 20170125420
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- Semiconductor Energy Laboratory Co., Ltd.
- Takanori Matsuzaki
- G06 - COMPUTING CALCULATING COUNTING
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- Avago Technologies General IP (Singapore) PTE. LTD.
- Jonathan Abrokwah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
- Publication number 20150303169
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- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTIO...
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- ROBERT BOSCH GmbH
- Fabian Bez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS

of the interface with the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Palladium-coated copper bonding wire, manufacturing method of palla...

Wire bonding for semiconductor devices

Semiconductor device including bond pad with fixing parts fixed ont...

Semiconductor devices with package-level configurability

Semiconductor device packages with high angle wire bonding and non-...

Semiconductor device having conductive wire with increased attachme...

Semiconductor apparatus

Wire bonding method and wire bonding apparatus

Semiconductor device having conductive wire with increased attachme...

Semiconductor devices with package-level configurability

Semiconductor element, recording element substrate, and liquid disc...

Semiconductor integrated circuit device

Electronic device having an intermediate layer disposed between two...

Light emitting element

Pad structure exposed in an opening through multiple dielectric lay...

Wire bond connection with intermediate contact structure

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having conductive wire with increased attachme...

Remapped packaged extracted die

Semiconductor device

Semiconductor device and method of manufacturing the same

Reliable interconnect

Copper wire and electrode joining method and joint structure

Methods for forming semiconductor devices with stepped bond pads

Semiconductor device

Method of forming a bondpad and bondpad

Semiconductor device, memory device, electronic device, or method f...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

CHIP PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR ELEMENT, RECORDING ELEMENT SUBSTRATE, AND LIQUID DISC...

WIRE BONDING METHOD AND WIRE BONDING APPARATUS

WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING ELEMENT

Remapped Packaged Extracted Die

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

Semiconductor Device

COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, MEMORY DEVICE, ELECTRONIC DEVICE, OR METHOD F...

MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF

SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES

ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTIO...

MOISTURE BARRIER FOR A WIRE BOND