of their bonding interfaces

Industry

CPC
H01L2224/09055

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09055of their bonding interfaces

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,861,773
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, base plate of semiconductor module, and metho...
- Patent number 10,541,219
- Issue date Jan 21, 2020
- Fuji Electric Co., Ltd.
- Yoshinori Uezato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,570,446
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Hyo Seok Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030106
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20220093546
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20220093547
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035890
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

of their bonding interfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies with inductors in direct bonding regions

Bonding structure and method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor module, base plate of semiconductor module, and metho...

Semiconductor device

Electronic component mounting structure

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

BONDING STRUCTURE AND METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

FINE-PITCH JOINING PAD STRUCTURE

BONDING STRUCTURE AND METHOD THEREOF

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MOUNTING STRUCTURE