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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14183On contiguous sides of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,749,627
- Issue date Sep 5, 2023
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,195,809
- Issue date Dec 7, 2021
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-organizing network with chip package having multiple interconn...
- Patent number 9,190,371
- Issue date Nov 17, 2015
- Moon J. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming semiconductor chip connections
- Patent number 9,035,465
- Issue date May 19, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interposer
- Patent number 8,829,654
- Issue date Sep 9, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a substrate and an interposer
- Patent number 8,829,655
- Issue date Sep 9, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection and assembly of three-dimensional chip packages
- Patent number 8,772,920
- Issue date Jul 8, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an organic substrate and interposer...
- Patent number 8,587,132
- Issue date Nov 19, 2013
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cube semiconductor package composed of a plurality of stacked toget...
- Patent number 8,299,592
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming semiconductor chip connections
- Patent number 8,236,610
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION
- Publication number 20220051998
- Publication date Feb 17, 2022
- STMICROELECTRONICS LTD.
- Endruw JAHJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION
- Publication number 20200211988
- Publication date Jul 2, 2020
- STMICROELECTRONICS LTD.
- Endruw JAHJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20160148888
- Publication date May 26, 2016
- Seung-Kwan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SEMICONDUCTOR CHIP CONNECTIONS
- Publication number 20140332929
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STACK WITH LOW PROFILE CONTACTS
- Publication number 20140326856
- Publication date Nov 6, 2014
- OMNIVISION TECHNOLOGIES, INC.
- Dominic Massetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY
- Publication number 20140084454
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Interposer
- Publication number 20140061886
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including a Substrate and an Interposer
- Publication number 20140061945
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Interposer with Through-Semiconduct...
- Publication number 20140061946
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including an Organic Substrate and Interposer...
- Publication number 20130214426
- Publication date Aug 22, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
- Publication number 20130015578
- Publication date Jan 17, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SEMICONDUCTOR CHIP CONNECTIONS
- Publication number 20120187561
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ORGANIZING NETWORK WITH CHIP PACKAGE HAVING MULTIPLE INTERCONN...
- Publication number 20120153450
- Publication date Jun 21, 2012
- Moon J. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM
- Publication number 20120148187
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Application
Forming Semiconductor Chip Connections
- Publication number 20100301475
- Publication date Dec 2, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUBE SEMICONDUCTOR PACKAGE COMPOSED OF A PLURALITY OF STACKED TOGET...
- Publication number 20100187676
- Publication date Jul 29, 2010
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS

On contiguous sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having a sidewall connection

Semiconductor package having a sidewall connection

Electronic system having increased coupling by using horizontal and...

Semiconductor method for forming semiconductor structure having bum...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Semiconductor structure having bump on tilting upper corner surface

Electronic system having increased coupling by using horizontal and...

Self-organizing network with chip package having multiple interconn...

Forming semiconductor chip connections

Semiconductor package with interposer

Semiconductor package including a substrate and an interposer

Interconnection and assembly of three-dimensional chip packages

Semiconductor package including an organic substrate and interposer...

Cube semiconductor package composed of a plurality of stacked toget...

Forming semiconductor chip connections

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION

SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME

FORMING SEMICONDUCTOR CHIP CONNECTIONS

INTEGRATED CIRCUIT STACK WITH LOW PROFILE CONTACTS

DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY

Semiconductor Package with Interposer

Semiconductor Package Including a Substrate and an Interposer

Semiconductor Package Including Interposer with Through-Semiconduct...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Semiconductor Package Including an Organic Substrate and Interposer...

INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES

FORMING SEMICONDUCTOR CHIP CONNECTIONS

SELF-ORGANIZING NETWORK WITH CHIP PACKAGE HAVING MULTIPLE INTERCONN...

INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM

Forming Semiconductor Chip Connections

CUBE SEMICONDUCTOR PACKAGE COMPOSED OF A PLURALITY OF STACKED TOGET...