on different surfaces

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H01L2224/73251

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73251on different surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,721,613
- Issue date Aug 8, 2023
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method of manufacturing the same
- Patent number 11,088,113
- Issue date Aug 10, 2021
- TOSHIBA MEMORY CORPORATION
- Kazutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 11,043,477
- Issue date Jun 22, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module having power device connected between heat sink and dr...
- Patent number 10,763,244
- Issue date Sep 1, 2020
- Siemens Aktiengesellschaft
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,741,505
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,580,759
- Issue date Mar 3, 2020
- Samsung Electronics Co., Ltd.
- Eun Jung Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package to die connection system and method therefor
- Patent number 10,566,268
- Issue date Feb 18, 2020
- NXP USA, INC.
- Mark Douglas Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 10,475,758
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip-type substrate for producing chip card modules
- Patent number 10,176,420
- Issue date Jan 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,128,223
- Issue date Nov 13, 2018
- TOSHIBA MEMORY CORPORATION
- Kazushige Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 10,050,025
- Issue date Aug 14, 2018
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,911,705
- Issue date Mar 6, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,490,200
- Issue date Nov 8, 2016
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
- Publication number 20240113063
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Udit RAWAT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER
- Publication number 20230317674
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230121888
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Minsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220068769
- Publication date Mar 3, 2022
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME
- Publication number 20220044988
- Publication date Feb 10, 2022
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303347
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Kazutaka SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGING USING ORGANIC ELECTRICALLY INSULATING LAYERS
- Publication number 20200181407
- Publication date Jun 11, 2020
- ALLIANCE FOR SUSTAINABLE ENERGY, LLC
- Douglas John DeVOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic Assembly With a Component Located Between Two Substrates...
- Publication number 20200152532
- Publication date May 14, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Rene Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190267351
- Publication date Aug 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Eun Jung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20190139908
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Monolithically Integrating Transistors, Carrier, an...
- Publication number 20180331083
- Publication date Nov 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...
- Publication number 20170229435
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170186714
- Publication date Jun 29, 2017
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES
- Publication number 20140242755
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME
- Publication number 20140191381
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING POWER DEVICES AT WAFER LEVEL
- Publication number 20140147973
- Publication date May 29, 2014
- Hyuk-soon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT PIPE THERMAL UNIT
- Publication number 20140090816
- Publication date Apr 3, 2014
- Jin YANG
- F28 - HEAT EXCHANGE IN GENERAL

on different surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cold plates incorporating reactive multilayer systems and S-cells

Soldering structure with groove portion and power module comprising...

Semiconductor packages with pass-through clock traces and associate...

Power module

Connectors for interconnecting microelectronic circuits

Semiconductor device structure and method for forming the same

Semiconductor storage device and method of manufacturing the same

Power converter monolithically integrating transistors, carrier, an...

Electronic system having increased coupling by using horizontal and...

Power module having power device connected between heat sink and dr...

Method of manufacturing semiconductor device and semiconductor device

Fan-out semiconductor package

Package to die connection system and method therefor

Semiconductor device

Semiconductor device structure and method for forming the same

Electronic system having increased coupling by using horizontal and...

Using MEMS fabrication incorporating into LED device mounting and a...

Electronic system having increased coupling by using horizontal and...

Method of manufacturing semiconductor devices having conductive plu...

Strip-type substrate for producing chip card modules

Semiconductor device and manufacturing method thereof

Semiconductor arrangement, semiconductor system and method of formi...

Power converter monolithically integrating transistors, carrier, an...

Using MEMS fabrication incorporating into LED device mounting and a...

Semiconductor device and semiconductor device manufacturing method

Electronic system having increased coupling by using horizontal and...

Small footprint semiconductor package

Semiconductor devices having stacked structures and methods for fab...

Component built-in board and method of manufacturing the same, and...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS

COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS

SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

POWER MODULE

SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME

Connectors for Interconnecting Microelectronic Circuits

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONICS PACKAGING USING ORGANIC ELECTRICALLY INSULATING LAYERS

Electronic Assembly With a Component Located Between Two Substrates...

Semiconductor Devices and Methods of Manufacture Thereof

FAN-OUT SEMICONDUCTOR PACKAGE

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Power Converter Monolithically Integrating Transistors, Carrier, an...

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Small Footprint Semiconductor Package

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME

METHOD OF PACKAGING POWER DEVICES AT WAFER LEVEL

ADJUSTABLE HEAT PIPE THERMAL UNIT