on different surfaces

Industry

CPC
H01L2224/73151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73151on different surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 11,380,608
- Issue date Jul 5, 2022
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,127,707
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,024,566
- Issue date Jun 1, 2021
- Renesas Electronics Corporation
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor in...
- Patent number 9,431,321
- Issue date Aug 30, 2016
- Kabushiki Kaisha Toshiba
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,669,655
- Issue date Mar 11, 2014
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210272890
- Publication date Sep 2, 2021
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020594
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200168545
- Publication date May 28, 2020
- RENESAS ELECTRONICS CORPORATION
- Shinichi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140035154
- Publication date Feb 6, 2014
- INFINEON TECHNOLOGIES AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY O...
- Publication number 20100190294
- Publication date Jul 29, 2010
- Margaret R. Simmons-Matthews
- H01 - BASIC ELECTRIC ELEMENTS

on different surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Semiconductor package structure and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Fan-out pop stacking process

Small footprint semiconductor package

Method of manufacturing a semiconductor device and semiconductor in...

Chip package and a method for manufacturing a chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Small Footprint Semiconductor Package

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY O...