On flat or curved insulated base, e.g., printed circuit, etc.

Industry

CPC
Y10T29/49124

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.

Industries

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-power biasing networks for superconducting integrated circuits
- Patent number 12,021,527
- Issue date Jun 25, 2024
- SeeQC, Inc.
- Oleg A. Mukhanov
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
- Patent number 11,978,712
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a camera for a vision system of a vehicle
- Patent number 11,812,563
- Issue date Nov 7, 2023
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochromic window fabrication methods
- Patent number 11,772,366
- Issue date Oct 3, 2023
- View, Inc.
- Mark A. Collins
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Softening nerve cuff electrodes
- Patent number 11,638,816
- Issue date May 2, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Vehicular vision system camera with coaxial cable connector
- Patent number 11,304,306
- Issue date Apr 12, 2022
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,191,165
- Issue date Nov 30, 2021
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming laminated circuit board
- Patent number 11,122,693
- Issue date Sep 14, 2021
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Softening nerve cuff electrodes
- Patent number 11,045,646
- Issue date Jun 29, 2021
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact assembly
- Patent number 11,019,730
- Issue date May 25, 2021
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,959,339
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated passive circuit elements for sensing devices
- Patent number 10,900,766
- Issue date Jan 26, 2021
- 3M Innovative Properties Company
- Billy L. Weaver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optic for a light source
- Patent number 10,890,313
- Issue date Jan 12, 2021
- ABL IP Holding LLC
- Craig Eugene Marquardt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Single layer low cost wafer level packaging for SFF SiP
- Patent number 10,867,961
- Issue date Dec 15, 2020
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for transmission lines in packages
- Patent number 10,840,201
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking device with configurable electrical connector key and inter...
- Patent number 10,829,959
- Issue date Nov 10, 2020
- Sargent Manufacturing Company
- Scott B. Lowder
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Manufacturing method for solid-state imaging device and solid-state...
- Patent number 10,825,730
- Issue date Nov 3, 2020
- Hamamatsu Photonics K.K.
- Yasuhito Yoneta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling an electrode array that includes a plastically...
- Patent number 10,780,262
- Issue date Sep 22, 2020
- Stryker Corporation
- Robert Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for manufacturing electronic component
- Patent number 10,770,205
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Haruhiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing rigid-flexible circuit board
- Patent number 10,765,013
- Issue date Sep 1, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Biao Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Digitizer and method of manufacturing the same
- Patent number 10,761,671
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Joo-Hoon Lee
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHROMIC WINDOW FABRICATION METHODS
- Publication number 20240123708
- Publication date Apr 18, 2024
- VIEW, INC.
- Mark A. Collins
- B32 - LAYERED PRODUCTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20220240392
- Publication date Jul 28, 2022
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ENERGY DELIVERY DEVICE AND METHODS OF USE
- Publication number 20210251681
- Publication date Aug 19, 2021
- Covidien LP
- Amr Salahieh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SOFTENING NERVE CUFF ELECTRODES
- Publication number 20210236810
- Publication date Aug 5, 2021
- Board of Regents, The University of Texas System
- Romil Modi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods and Apparatus for Transmission Lines in Packages
- Publication number 20210082848
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHROMIC WINDOW FABRICATION METHODS
- Publication number 20200398535
- Publication date Dec 24, 2020
- VIEW, INC.
- Mark A. Collins
- G02 - OPTICS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20200251462
- Publication date Aug 6, 2020
- Intel Corporation
- Russell Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20200178397
- Publication date Jun 4, 2020
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20200045827
- Publication date Feb 6, 2020
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20190281703
- Publication date Sep 12, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20190254172
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190250502
- Publication date Aug 15, 2019
- Unimicron Technology Corp.
- Pu-Ju Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCHROMIC WINDOW FABRICATION METHODS
- Publication number 20190243204
- Publication date Aug 8, 2019
- VIEW, INC.
- Mark A. Collins
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods and Apparatus for Transmission Lines in Packages
- Publication number 20190244921
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DEVICE WITH CONFIGURABLE ELECTRICAL CONNECTOR KEY AND INTER...
- Publication number 20190211585
- Publication date Jul 11, 2019
- SARGENT MANUFACTURING COMPANY
- Scott B. Lowder
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
DIGITIZER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190204962
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Joo-Hoon LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIEZOCHROMIC STAMP
- Publication number 20180376599
- Publication date Dec 27, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP
- Publication number 20180301435
- Publication date Oct 18, 2018
- Intel Corporation
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Substrate Core Layer
- Publication number 20180288880
- Publication date Oct 4, 2018
- FutureWei Technologies, Inc.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE...
- Publication number 20180286752
- Publication date Oct 4, 2018
- Hamamatsu Photonics K.K.
- Yasuhito YONETA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE POSITION DETECTION APPARATUS, EXPOSURE APPARATUS, AND EXPOS...
- Publication number 20180188657
- Publication date Jul 5, 2018
- Nikon Corporation
- Yasuhiro Hidaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DEVICE WITH CONFIGURABLE ELECTRICAL CONNECTOR KEY AND INTER...
- Publication number 20180094456
- Publication date Apr 5, 2018
- SARGENT MANUFACTURING COMPANY
- Scott B. Lowder
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
SURGE PROTECTION FOR AN ELECTRONIC DEVICE
- Publication number 20180092261
- Publication date Mar 29, 2018
- HONEYWELL INTERNATIONAL INC.
- Jiri Sapak
- G02 - OPTICS

On flat or curved insulated base, e.g., printed circuit, etc.

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Low-power biasing networks for superconducting integrated circuits

Laminated circuit board

Offset interposers for large-bottom packages and large-die package-...

Method of forming semiconductor package transmission lines with mic...

Method for assembling a camera for a vision system of a vehicle

Offset interposers for large-bottom packages and large-die package-...

Electrochromic window fabrication methods

Method for manufacturing a circuit having a lamination layer using...

Softening nerve cuff electrodes

Flexible circuit electrode array and method of manufacturing the same

Mask structure and manufacturing method thereof

Vehicular vision system camera with coaxial cable connector

Method for manufacturing a circuit having a lamination layer using...

Method for forming laminated circuit board

Softening nerve cuff electrodes

Contact assembly

Manufacturing method of circuit board

Manufacturing a product using a soldering process

Integrated passive circuit elements for sensing devices

Optic for a light source

Single layer low cost wafer level packaging for SFF SiP

Methods and apparatus for transmission lines in packages

Locking device with configurable electrical connector key and inter...

Manufacturing method for solid-state imaging device and solid-state...

Piezochromic stamp

Method of assembling an electrode array that includes a plastically...

Method for manufacturing electronic component

Method for manufacturing rigid-flexible circuit board

Digitizer and method of manufacturing the same

Patents Applicationslast 30 patents

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

ELECTROCHROMIC WINDOW FABRICATION METHODS

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

Method for Manufacturing a Circuit Having a Lamination Layer Using...

ENERGY DELIVERY DEVICE AND METHODS OF USE

SOFTENING NERVE CUFF ELECTRODES

Methods and Apparatus for Transmission Lines in Packages

ELECTROCHROMIC WINDOW FABRICATION METHODS

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

Method for Manufacturing a Circuit Having a Lamination Layer Using...

MANUFACTURING METHOD OF CIRCUIT BOARD

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

MASK STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTROCHROMIC WINDOW FABRICATION METHODS

Methods and Apparatus for Transmission Lines in Packages

LOCKING DEVICE WITH CONFIGURABLE ELECTRICAL CONNECTOR KEY AND INTER...

DIGITIZER AND METHOD OF MANUFACTURING THE SAME

PIEZOCHROMIC STAMP

SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP

Methods and Apparatus for a Substrate Core Layer

MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE...

THROUGH-HOLE ELECTRODE SUBSTRATE

SURFACE POSITION DETECTION APPARATUS, EXPOSURE APPARATUS, AND EXPOS...

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

LOCKING DEVICE WITH CONFIGURABLE ELECTRICAL CONNECTOR KEY AND INTER...

SURGE PROTECTION FOR AN ELECTRONIC DEVICE