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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/17181On opposite sides of the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper sensor for 3-dimensional die stack
- Patent number 12,361,808
- Issue date Jul 15, 2025
- Xilinx, Inc.
- Thomas Paul Leboeuf
- G08 - SIGNALLING
Information Patent Grant
Interposer circuit
- Patent number 12,352,814
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 12,347,783
- Issue date Jul 1, 2025
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,734
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding of packaged magnetic random access memory
- Patent number 12,278,195
- Issue date Apr 15, 2025
- Avalanche Technology, Inc.
- Zihui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Game engine on a chip
- Patent number 12,249,018
- Issue date Mar 11, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat Yerli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239572
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...
- Publication number 20250234562
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Siwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250219000
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210434
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sang Ho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING INDUCTOR DEVICES
- Publication number 20250194255
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Jason GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20250182372
- Publication date Jun 5, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat YERLI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183103
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunjung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167098
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149490
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
- Publication number 20250116810
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Daegon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK
- Publication number 20250111765
- Publication date Apr 3, 2025
- Xilinx, Inc.
- Thomas Paul LEBOEUF
- G08 - SIGNALLING
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105193
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105158
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sung Min MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20250096178
- Publication date Mar 20, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250096194
- Publication date Mar 20, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
- Publication number 20250087252
- Publication date Mar 13, 2025
- Rambus Inc.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079250
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS

On opposite sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with ring structure

Tamper sensor for 3-dimensional die stack

Interposer circuit

Interconnect architecture with silicon interposer and EMIB

Semiconductor package and method of fabricating the same

Integrated circuit package and method of forming same

Semiconductor package

Semiconductor packages and methods of forming same

Semiconductor device

Microelectronic assemblies

Shielding of packaged magnetic random access memory

Method of fabricating semiconductor package including sub-interpose...

Package process and package structure

Wire bond wires for interference shielding

Game engine on a chip

Three dimensional circuit implementing machine trained network

Circuit substrate structure and manufacturing method thereof

Semiconductor package

Devices and methods related to radio-frequency filters on silicon-o...

Fan-out package having a main die and a dummy die

TSV check circuit with replica path

Semiconductor package

Multi-chip package with high density interconnects

Semiconductor package and method of forming the same

Fault tolerant memory systems and components with interconnected an...

Microelectronic package with solder array thermal interface materia...

Microelectronic assemblies

Integrated voltage regulator (IVR) package including inductor and c...

Bonding structures and methods for forming the same

Forming large chips through stitching

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP

SEMICONDUCTOR PACKAGE

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

INTERPOSER INCLUDING INDUCTOR DEVICES

Fan-Out Package Having a Main Die and a Dummy Die

GAME ENGINE ON A CHIP

SEMICONDUCTOR PACKAGE

Structure and Method for Fabricating a Computing System with an Int...

SEMICONDUCTOR PACKAGE

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

SEMICONDUCTOR PACKAGE

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP

TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE

MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...