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H01L29/456

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

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H01L29/456on silicon

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming fin field effect transistor (FinFET) device stru...
- Patent number 12,176,435
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,154,954
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Wan Yu Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective epitaxy process for the formation of CFET local interconn...
- Patent number 12,131,954
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,125,878
- Issue date Oct 22, 2024
- Kioxia Corporation
- Tomonari Shioda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor transistor device and method of manufacturing the same
- Patent number 12,119,400
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Robert Paul Haase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Threshold adjustment for quantum dot array devices with metal sourc...
- Patent number 12,107,144
- Issue date Oct 1, 2024
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside connection structures for nanostructures and methods of fo...
- Patent number 12,100,656
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having SiGe layer on Si pillar
- Patent number 12,096,612
- Issue date Sep 17, 2024
- Micron Technology, Inc.
- Tomohiko Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing si...
- Patent number 12,080,762
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Naoyuki Ohse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap around silicide for FinFETs
- Patent number 12,068,383
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 12,048,156
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Shin-Hwan Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface-treated semiconductor layer
- Patent number 12,046,656
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Yeonchoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free resistance contacts and silicide with silicide stop layer
- Patent number 12,040,373
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including emitter regions and method of manufa...
- Patent number 12,034,065
- Issue date Jul 9, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high-voltage transistor with thin gate poly
- Patent number 12,029,041
- Issue date Jul 2, 2024
- Infineon Technologies LLC
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-sheet-based complementary metal-oxide-semiconductor devices wi...
- Patent number 11,996,484
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact structure
- Patent number 11,996,361
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having spacer residue
- Patent number 11,984,450
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices including a fin field e...
- Patent number 11,978,775
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Doohyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar semiconductor device having conforming ohmic contacts
- Patent number 11,978,776
- Issue date May 7, 2024
- Intel Corporation
- Ashutosh Sagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 11,974,435
- Issue date Apr 30, 2024
- SK hynix Inc.
- In Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide power diode device and fabrication method thereof
- Patent number 11,967,651
- Issue date Apr 23, 2024
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- Yonghong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for semiconductor devices and methods of forming the same
- Patent number 11,961,893
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429102
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240405023
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387751
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Akira SAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20240387645
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355936
- Publication date Oct 24, 2024
- United Microelectronics Corp.
- Boon Keat Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Formation Method and Related Structure
- Publication number 20240332374
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH AN IMPROVED CONDUCTIVE CONTACT ST...
- Publication number 20240332376
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Davide FAGIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-SHEET-BASED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICES WI...
- Publication number 20240313119
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
- Publication number 20240297220
- Publication date Sep 5, 2024
- Kabushiki Kaisha Toshiba
- Masatsugu NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD FOR FLOATING CONTACT HOLE, AND SEMICONDUCTOR DEVICE
- Publication number 20240290846
- Publication date Aug 29, 2024
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Qun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20240276724
- Publication date Aug 15, 2024
- SK HYNIX INC.
- In Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...
- Publication number 20240258397
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258396
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Jun Ki PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240250143
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20240249977
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240243183
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Sangmin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION BY INTEGRATION OF MOLYBDENUM WITH TITA...
- Publication number 20240234209
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Avgerinos V. Gelatos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240222453
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Eui Bok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE TRANSISTOR WITH THIN HIGH-K METAL GATE AND METHOD OF F...
- Publication number 20240206183
- Publication date Jun 20, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURES
- Publication number 20240186313
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Vladimir Mikhalev
- G11 - INFORMATION STORAGE
Information Patent Application
SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS
- Publication number 20240186127
- Publication date Jun 6, 2024
- Intel Corporation
- Ilya V. Karpov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High Voltage Transistor Structure
- Publication number 20240186412
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20240154018
- Publication date May 9, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145569
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
- Publication number 20240120241
- Publication date Apr 11, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS THEREOF
- Publication number 20240113173
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR
- Publication number 20240105789
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- WONHYUK LEE
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming fin field effect transistor (FinFET) device stru...

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device having contact trenches extending from opposit...

Selective epitaxy process for the formation of CFET local interconn...

Bottom-up formation of contact plugs

Semiconductor structure with a contact to source/drain layers and f...

Bottom-up formation of contact plugs

Semiconductor device and manufacturing method thereof

Semiconductor transistor device and method of manufacturing the same

Field effect transistor contact with reduced contact resistance

Threshold adjustment for quantum dot array devices with metal sourc...

Backside connection structures for nanostructures and methods of fo...

Semiconductor device having SiGe layer on Si pillar

Diffusion soldering with contaminant protection

Silicon carbide semiconductor device and method of manufacturing si...

Wrap around silicide for FinFETs

Vertical memory devices and methods of manufacturing the same

Semiconductor device including surface-treated semiconductor layer

Liner-free resistance contacts and silicide with silicide stop layer

Semiconductor device including emitter regions and method of manufa...

Method of forming high-voltage transistor with thin gate poly

Nano-sheet-based complementary metal-oxide-semiconductor devices wi...

Method of making a contact structure

Semiconductor device having spacer residue

Method of fabricating semiconductor devices including a fin field e...

Non-planar semiconductor device having conforming ohmic contacts

Semiconductor device and manufacturing method of a semiconductor de...

Silicon carbide power diode device and fabrication method thereof

Contacts for semiconductor devices and methods of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

BOTTOM-UP FORMATION OF CONTACT PLUGS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Contact Formation Method and Related Structure

INTEGRATED ELECTRONIC DEVICE WITH AN IMPROVED CONDUCTIVE CONTACT ST...

NANO-SHEET-BASED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICES WI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

FORMING METHOD FOR FLOATING CONTACT HOLE, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...

SEMICONDUCTOR DEVICE

CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

CONTACT RESISTANCE REDUCTION BY INTEGRATION OF MOLYBDENUM WITH TITA...

SEMICONDUCTOR DEVICE

HIGH-VOLTAGE TRANSISTOR WITH THIN HIGH-K METAL GATE AND METHOD OF F...

CAPACITOR STRUCTURES

SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS

High Voltage Transistor Structure

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...

SEMICONDUCTOR STRUCTURES AND METHODS THEREOF

SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR