on the bonding area

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H01L2224/02163

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02163on the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having hybrid bonding...
- Patent number 11,894,247
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having hybrid bonding interface, method of man...
- Patent number 11,257,694
- Issue date Feb 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming interconnect assemblies with probed bond pads
- Patent number 10,741,460
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 10,351,418
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for forming interconnect assemblies with probed bond pads
- Patent number 10,134,647
- Issue date Nov 20, 2018
- Micron Technology, Inc.
- Owen R. Fay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 10,136,520
- Issue date Nov 20, 2018
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 9,957,156
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 9,717,148
- Issue date Jul 25, 2017
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect assemblies with probed bond pads
- Patent number 9,646,899
- Issue date May 9, 2017
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,111,951
- Issue date Aug 18, 2015
- Seiko Instruments Inc.
- Keisuke Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated posts with reduced topography and stress
- Patent number 8,476,760
- Issue date Jul 2, 2013
- Texas Instruments Incorporated
- Manoj K. Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 8,183,683
- Issue date May 22, 2012
- Amkor Technology, Inc.
- Joon Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure for semiconductor device, method for forming th...
- Patent number 6,603,207
- Issue date Aug 5, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure for semiconductor device, method for forming th...
- Patent number 6,387,794
- Issue date May 14, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING HYBRID BONDING...
- Publication number 20220059372
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING HYBRID BONDING INTERFACE, METHOD OF MAN...
- Publication number 20210242050
- Publication date Aug 5, 2021
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS
- Publication number 20190051569
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Rings in Semiconductor Devices and Methods of Forming Same
- Publication number 20180230003
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...
- Publication number 20170311451
- Publication date Oct 26, 2017
- QUARTZDYNE, INC.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20170275153
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS
- Publication number 20170207139
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150243614
- Publication date Aug 27, 2015
- Renesas Electronics Corporation
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361430
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140217594
- Publication date Aug 7, 2014
- Seiko Instruments Inc.
- Keisuke UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS
- Publication number 20140070832
- Publication date Mar 13, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED POSTS WITH REDUCED TOPOGRAPHY AND STRESS
- Publication number 20120112343
- Publication date May 10, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Manoj K. Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode structure for semiconductor device, method for forming th...
- Publication number 20020081830
- Publication date Jun 27, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE FOR SEMICONDUCTOR DEVICE, METHOD FOR FORMING TH...
- Publication number 20010014523
- Publication date Aug 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- YOSHIHIRO BESSHO
- H01 - BASIC ELECTRIC ELEMENTS

on the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having hybrid bonding...

Semiconductor device having hybrid bonding interface, method of man...

Methods for forming interconnect assemblies with probed bond pads

Bond rings in semiconductor devices and methods of forming same

Methods for forming interconnect assemblies with probed bond pads

Methods of forming a microelectronic device structure, and related...

Bond rings in semiconductor devices and methods of forming same

Methods of forming a microelectronic device structure, and related...

Interconnect assemblies with probed bond pads

Semiconductor device

Electroplated posts with reduced topography and stress

Semiconductor device and fabricating method thereof

Electrode structure for semiconductor device, method for forming th...

Electrode structure for semiconductor device, method for forming th...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING HYBRID BONDING...

SEMICONDUCTOR DEVICE HAVING HYBRID BONDING INTERFACE, METHOD OF MAN...

METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS

Bond Rings in Semiconductor Devices and Methods of Forming Same

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...

BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

METHODS FOR FORMING INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTERCONNECT ASSEMBLIES WITH PROBED BOND PADS

ELECTROPLATED POSTS WITH REDUCED TOPOGRAPHY AND STRESS

Electrode structure for semiconductor device, method for forming th...

ELECTRODE STRUCTURE FOR SEMICONDUCTOR DEVICE, METHOD FOR FORMING TH...