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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29561On the entire surface of the core

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Patents Grantslast 30 patents

Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 9,741,677
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having electrode interconnections within a con...
- Patent number 9,252,346
- Issue date Feb 2, 2016
- LG Electronics Inc.
- Byungjoon Rhee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 9,087,778
- Issue date Jul 21, 2015
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 8,746,538
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170352638
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170256515
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130134210
- Publication date May 30, 2013
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

On the entire surface of the core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Member for semiconductor device

Semiconductor device including antistatic die attach material

Method for producing member for semiconductor device and semiconduc...

Semiconductor device including antistatic die attach material

Solder, solder joint structure and method of forming solder joint s...

Semiconductor device having electrode interconnections within a con...

Joining method and semiconductor device manufacturing method

Joining method and semiconductor device manufacturing method

Patents Applicationslast 30 patents

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD