on the same surface

Industry

CPC
H01L2224/73201

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73201on the same surface

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Semiconductor device
- Patent number 11,309,232
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with short circuit failure mode
- Patent number 10,872,830
- Issue date Dec 22, 2020
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device almost last embedded device structure and method of manufact...
- Patent number 10,504,826
- Issue date Dec 10, 2019
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number 10,293,289
- Issue date May 21, 2019
- Nanopareil, LLC
- Todd J. Menkhaus
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip chip assembly with connected component
- Patent number 10,211,174
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,984,988
- Issue date May 29, 2018
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number 9,604,168
- Issue date Mar 28, 2017
- Nanopareil, LLC
- Todd Menkhaus
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,583,456
- Issue date Feb 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS anchor and spacer structure
- Patent number 9,213,181
- Issue date Dec 15, 2015
- Pixtronix, Inc.
- Timothy J. Brosnihan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Maintaining alignment in a multi-chip module using a compressible s...
- Patent number 8,742,576
- Issue date Jun 3, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for manufacturing a device
- Patent number 8,633,600
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...
- Publication number 20240282745
- Publication date Aug 22, 2024
- JUSUNG ENGINEERING CO., LTD.
- Jung Bae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...
- Publication number 20210050323
- Publication date Feb 18, 2021
- Jusung Engineering Co., Ltd.
- Jung Bae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200395276
- Publication date Dec 17, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE
- Publication number 20190355634
- Publication date Nov 21, 2019
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170133
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170134
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...
- Publication number 20130207261
- Publication date Aug 15, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS ANCHOR AND SPACER STRUCTURE
- Publication number 20120295058
- Publication date Nov 22, 2012
- Pixtronix, Inc.
- Timothy J. Brosnihan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device and Method for Manufacturing a Device
- Publication number 20120068364
- Publication date Mar 22, 2012
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS

on the same surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Hybrid felts of electrospun nanofibers

Semiconductor device

Power semiconductor module with short circuit failure mode

Multiple plated via arrays of different wire heights on same substrate

Device almost last embedded device structure and method of manufact...

Method of manufacturing semiconductor devices having conductive plu...

Hybrid felts of electrospun nanofibers

Multiple bond via arrays of different wire heights on a same substrate

Flip chip assembly with connected component

Semiconductor arrangement, semiconductor system and method of formi...

Flip chip assembly with connected component

Multiple bond via arrays of different wire heights on a same substrate

Hybrid felts of electrospun nanofibers

Component built-in board and method of manufacturing the same, and...

Multiple bond via arrays of different wire heights on a same substrate

MEMS anchor and spacer structure

Maintaining alignment in a multi-chip module using a compressible s...

Device and method for manufacturing a device

Patents Applicationslast 30 patents

ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE

Semiconductor Devices and Methods of Manufacture Thereof

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

Multiple bond via arrays of different wire heights on a same substrate

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...

MEMS ANCHOR AND SPACER STRUCTURE

Device and Method for Manufacturing a Device