on the semiconductor or solid-state body

Industry

CPC
H01L2224/49421

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49421on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit structure
- Patent number 12,035,471
- Issue date Jul 9, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
- Publication number 20230395566
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
- Publication number 20230395565
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20220132662
- Publication date Apr 28, 2022
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Packages and Methods of Manufacturing the Same
- Publication number 20130241055
- Publication date Sep 19, 2013
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
- Publication number 20120228759
- Publication date Sep 13, 2012
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR PACKAGE

CIRCUIT STRUCTURE

Multi-Chip Packages and Methods of Manufacturing the Same

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES