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on the semiconductor or solid-state body

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  • CPC
  • H01L2224/49421
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49421on the semiconductor or solid-state body
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 12,300,668
    • Issue date May 13, 2025
    • Samsung Electronics Co., Ltd.
    • Raehyung Do
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor fuse with multi-bond wire
    • Patent number 12,191,252
    • Issue date Jan 7, 2025
    • Texas Instruments Incorporated
    • Enis Tuncer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit structure
    • Patent number 12,035,471
    • Issue date Jul 9, 2024
    • GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
    • Andu Zhou
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents