on the semiconductor or solid-state body

Industry

CPC
H01L2224/48486

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48486on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and manufacturing method thereof
- Patent number 7,859,123
- Issue date Dec 28, 2010
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump formation method and wire bonding method
- Patent number 7,044,357
- Issue date May 16, 2006
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor chip comprising multiple bo...
- Patent number 6,780,749
- Issue date Aug 24, 2004
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,583,483
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072619
- Publication date Mar 25, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and wire bonding method
- Publication number 20040164128
- Publication date Aug 26, 2004
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030205725
- Publication date Nov 6, 2003
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devcice and its manufacturing method
- Publication number 20020050653
- Publication date May 2, 2002
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structure of bonding wire

Bonding wire for semiconductor devices

Wire bonding structure and manufacturing method thereof

Bump formation method and wire bonding method

Method of manufacturing a semiconductor chip comprising multiple bo...

Semiconductor device and its manufacturing method

Patents Applicationslast 30 patents

BONDING STRUCTURE OF BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

Bump formation method and wire bonding method

Semiconductor device and its manufacturing method

Semiconductor devcice and its manufacturing method