TREA

Only on parts of the surface of the core

Follow

Industry

  • CPC
  • H01L2224/13563
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13563Only on parts of the surface of the core
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210184022
    • Publication date Jun 17, 2021
    • Murata Manufacturing Co., Ltd.
    • Yasunari UMEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP STRUCTURE MANUFACTURING METHOD
    • Publication number 20200266163
    • Publication date Aug 20, 2020
    • LBSEMICON CO., LTD.
    • Jin Kuk LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200211991
    • Publication date Jul 2, 2020
    • NANYA TECHNOLOGY CORPORATION
    • Chih-Ching LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190333887
    • Publication date Oct 31, 2019
    • Murata Manufacturing Co., Ltd.
    • Yasunari UMEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180233475
    • Publication date Aug 16, 2018
    • Murata Manufacturing Co., Ltd.
    • Yasunari UMEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20160315060
    • Publication date Oct 27, 2016
    • Murata Manufacturing Co., Ltd.
    • Yasunari UMEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME
    • Publication number 20160307862
    • Publication date Oct 20, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Liang Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCED TITANIUM UNDERCUT IN ETCH PROCESS
    • Publication number 20150348925
    • Publication date Dec 3, 2015
    • Applied Materials, Inc.
    • David P. Surdock
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTU...
    • Publication number 20090246988
    • Publication date Oct 1, 2009
    • TAIWAN TFT LCD ASSOCIATION
    • Sheng-Shu Yang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE
    • Publication number 20080211092
    • Publication date Sep 4, 2008
    • Industrial Technology Research Institute
    • Su-Tsai LU
    • H01 - BASIC ELECTRIC ELEMENTS