Only on the bonding interface of the layer connector

Industry

CPC
H01L2224/29564

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29564Only on the bonding interface of the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...
- Publication number 20230395551
- Publication date Dec 7, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi KISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387062
- Publication date Nov 30, 2023
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Lead-Free Solder Alloy and Semiconductor Device
- Publication number 20160300809
- Publication date Oct 13, 2016
- Hitachi, Ltd
- Takaaki MIYAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Only on the bonding interface of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond materials with enhanced plasma resistant characteristics and a...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Patents Applicationslast 30 patents

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...

SEMICONDUCTOR DEVICE

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Lead-Free Solder Alloy and Semiconductor Device

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...