Only outside the bonding interface of the bonding area

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H01L2224/05565

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05565Only outside the bonding interface of the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor device, semiconductor device package and method of ma...
- Patent number 11,830,834
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, production method thereof, and display apparatus
- Patent number 10,756,034
- Issue date Aug 25, 2020
- BOE Technology Group Co., Ltd.
- Weiyun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,157,866
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package including solder bumps with streng...
- Patent number 9,899,584
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Seok Min Hwang
- G02 - OPTICS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 9,780,052
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
- Patent number 9,768,134
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 9,679,859
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,583,456
- Issue date Feb 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, integrated circuit structure using the same,...
- Patent number 9,559,069
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bowl-shaped solder structure
- Patent number 9,455,237
- Issue date Sep 27, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,841,767
- Issue date Sep 23, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having an anti-contact layer
- Patent number 8,742,577
- Issue date Jun 3, 2014
- Samsung Electronics Co., Ltd.
- Young-kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,450,203
- Issue date May 28, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230103256
- Publication date Mar 30, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...
- Publication number 20230009219
- Publication date Jan 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230005961
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dae Hwan JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220399292
- Publication date Dec 15, 2022
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20180145046
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170352633
- Publication date Dec 7, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20170271287
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE, AND LIGHTNING A...
- Publication number 20170110639
- Publication date Apr 20, 2017
- Samsung Electronics Co., Ltd.
- Seok Min Hwang
- G02 - OPTICS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170077052
- Publication date Mar 16, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure With Sacrificial Anode and Method for Forming
- Publication number 20160329288
- Publication date Nov 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT STRUCTURE USING THE SAME,...
- Publication number 20160225729
- Publication date Aug 4, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Feng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160005703
- Publication date Jan 7, 2016
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130213702
- Publication date Aug 22, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130087917
- Publication date Apr 11, 2013
- Young-kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130022830
- Publication date Jan 24, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Only outside the bonding interface of the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing different size opposing bonding pads and...

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor device, semiconductor device package and method of ma...

Interconnect structure and method of forming same

Interconnect structures for preventing solder bridging, and associa...

Collars for under-bump metal structures and associated systems and...

Interconnect structure and method of forming same

Semiconductor devices and semiconductor devices including a redistr...

Display substrate, production method thereof, and display apparatus

Multiple plated via arrays of different wire heights on same substrate

Interconnect structures for preventing solder bridging, and associa...

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor devices including conductive pillars

Semiconductor structure with sacrificial anode and method for forming

Interconnect structure and method of forming same

Semiconductor device with metal film and method for manufacturing s...

Semiconductor device and package including solder bumps with streng...

Collars for under-bump metal structures and associated systems and...

Methods of forming conductive materials on semiconductor devices, a...

Multiple bond via arrays of different wire heights on a same substrate

Interconnect structure and method of forming same

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor device, integrated circuit structure using the same,...

Bowl-shaped solder structure

Bumping process and structure thereof

Semiconductor package having an anti-contact layer

Bumping process and structure thereof

Patents Applicationslast 30 patents

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Interconnect Structure and Method of Forming Same

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

Multiple bond via arrays of different wire heights on a same substrate

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE, AND LIGHTNING A...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Semiconductor Structure With Sacrificial Anode and Method for Forming

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT STRUCTURE USING THE SAME,...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

BUMPING PROCESS AND STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE

BUMPING PROCESS AND STRUCTURE THEREOF