onto a metallic substrate

Industry

CPC
H05K3/0061

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0061onto a metallic substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics cooling assemblies and methods for making the same
- Patent number 12,048,085
- Issue date Jul 23, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, insulated circuit board with heat sink, and heat sink
- Patent number 12,035,468
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus
- Patent number 12,022,606
- Issue date Jun 25, 2024
- TDK-Lambda UK Limited
- Alex Knill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,924,961
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ai Jing Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit / printed circuit board assembly and method of m...
- Patent number 11,910,519
- Issue date Feb 20, 2024
- Eridan Communications, Inc.
- Douglas A. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, electronic device and method for manufacturing the...
- Patent number 11,849,566
- Issue date Dec 19, 2023
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Systems and methods for coupling a metal core PCB to a heat sink
- Patent number 11,774,082
- Issue date Oct 3, 2023
- Fluence Bioengineering, Inc.
- Dung Duong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit board assembly
- Patent number 11,765,835
- Issue date Sep 19, 2023
- LEONARDO UK LTD
- Anthony Kinghorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board utilizing optical signals in addition to electrical s...
- Patent number 11,754,781
- Issue date Sep 12, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control apparatus and method for producing an electronic...
- Patent number 11,696,389
- Issue date Jul 4, 2023
- VITESCO TECHNOLOGIES GERMANY GMBH
- Martin Steinau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting systems and methods
- Patent number 11,690,172
- Issue date Jun 27, 2023
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics cooling assemblies and methods for making the same
- Patent number 11,665,813
- Issue date May 30, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 11,598,904
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 11,602,056
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating battery protection circuit package
- Patent number 11,452,213
- Issue date Sep 20, 2022
- ITM SEMICONDUCTOR CO., LTD.
- Hyuk Hwi Na
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lighting fixture with reflector and template PCB
- Patent number 11,441,747
- Issue date Sep 13, 2022
- Ideal Industries Lighting LLC
- Nelson Man Hoi Lui
- F21 - LIGHTING
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved polymer-copper adhesion
- Patent number 11,388,822
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Grant
Systems and methods for coupling a metal core PCB to a heat sink
- Patent number 11,333,341
- Issue date May 17, 2022
- Fluence Bioengineering, Inc.
- Dung Duong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic control device
- Patent number 11,312,408
- Issue date Apr 26, 2022
- Hitachi Astemo, Ltd.
- Katsumasa Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods
- Patent number 11,304,290
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240290632
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME
- Publication number 20240260186
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Thomas KIPPES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
- Publication number 20240130076
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
- Publication number 20240114614
- Publication date Apr 4, 2024
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
- Publication number 20230375780
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230319975
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230292428
- Publication date Sep 14, 2023
- Unimicron Technology Corp.
- Ai Jing LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOR CIRCUIT BOARD
- Publication number 20230292433
- Publication date Sep 14, 2023
- Tokuyama Corporation
- Eiki TSUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230276577
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Yasushi USAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20230262871
- Publication date Aug 17, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20230199973
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
- Publication number 20230127557
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20230091454
- Publication date Mar 23, 2023
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20230073563
- Publication date Mar 9, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
- Publication number 20220359342
- Publication date Nov 10, 2022
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Markus Lasch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...
- Publication number 20220357508
- Publication date Nov 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE
- Publication number 20220322537
- Publication date Oct 6, 2022
- ITM SEMICONDUCTOR CO., LTD.
- Hyuk Hwi NA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20220272846
- Publication date Aug 25, 2022
- Leonardo UK Ltd
- Anthony KINGHORN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220142005
- Publication date May 5, 2022
- DENSO CORPORATION
- TOSHIHIRO MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Improved Polymer-Copper Adhesion
- Publication number 20220071023
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20220053630
- Publication date Feb 17, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK
- Publication number 20220001482
- Publication date Jan 6, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
- Publication number 20210410284
- Publication date Dec 30, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE
- Publication number 20210368631
- Publication date Nov 25, 2021
- ITM SEMICONDUCTOR CO., LTD.
- Hyuk Hwi NA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND...
- Publication number 20210280504
- Publication date Sep 9, 2021
- Bitmain Technologies Inc.
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Control Apparatus And Method For Producing An Electronic...
- Publication number 20210227681
- Publication date Jul 22, 2021
- Vitesco Technologies Germany GmbH
- Martin Steinau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20210127500
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

onto a metallic substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Insulating resin circuit substrate

Method for manufacturing photoelectric composite circuit board

Power electronics assemblies having embedded power electronics devices

Insulated circuit substrate manufacturing method

Flexible circuit board with thermally conductive connection to a he...

Power electronics device assemblies including dual graphite layers...

Insulated circuit board

Method of constructing a circuitry assembly for heat dispersal usin...

Power electronics cooling assemblies and methods for making the same

Bonded body, insulated circuit board with heat sink, and heat sink

Power supply apparatus

Circuit board and method of manufacturing the same

Integrated circuit / printed circuit board assembly and method of m...

Joint structure, electronic device and method for manufacturing the...

Power electronics assembly

Systems and methods for coupling a metal core PCB to a heat sink

Circuit board assembly

Circuit board utilizing optical signals in addition to electrical s...

Electronic control apparatus and method for producing an electronic...

LED lighting systems and methods

Power electronics cooling assemblies and methods for making the same

Power semiconductor module and method for producing a power semicon...

Circuit board and semiconductor device including the same

Method of fabricating battery protection circuit package

Lighting fixture with reflector and template PCB

Packaging photon building blocks with top side connections and inte...

Methods for improved polymer-copper adhesion

Systems and methods for coupling a metal core PCB to a heat sink

Electronic control device

Semiconductor structures and methods

Patents Applicationslast 30 patents

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

Thermal Conduction - Electrical Conduction Isolated Circuit Board w...

METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD

INSULATING RESIN CIRCUIT SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LAMINATE FOR CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD

INSULATED CIRCUIT BOARD

PRODUCING METHOD OF WIRED CIRCUIT BOARD

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...

METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE

CIRCUIT BOARD ASSEMBLY

JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...

Methods for Improved Polymer-Copper Adhesion

POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME

BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK

BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK

METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE

CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND...

Electronic Control Apparatus And Method For Producing An Electronic...

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME