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H05K3/0061
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00
Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/0061
onto a metallic substrate
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Patents Grants
last 30 patents
Information
Patent Grant
Circuit board and method of manufacturing the same
Patent number
11,924,961
Issue date
Mar 5, 2024
Unimicron Technology Corp.
Ai Jing Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit / printed circuit board assembly and method of m...
Patent number
11,910,519
Issue date
Feb 20, 2024
Eridan Communications, Inc.
Douglas A. Kirkpatrick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure, electronic device and method for manufacturing the...
Patent number
11,849,566
Issue date
Dec 19, 2023
Denso Corporation
Toshihiro Miyake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power electronics assembly
Patent number
RE49723
Issue date
Nov 7, 2023
Turntide Technologies, Inc.
Peter Barrass
Information
Patent Grant
Systems and methods for coupling a metal core PCB to a heat sink
Patent number
11,774,082
Issue date
Oct 3, 2023
Fluence Bioengineering, Inc.
Dung Duong
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Circuit board assembly
Patent number
11,765,835
Issue date
Sep 19, 2023
LEONARDO UK LTD
Anthony Kinghorn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board utilizing optical signals in addition to electrical s...
Patent number
11,754,781
Issue date
Sep 12, 2023
Avary Holding (Shenzhen) Co., Limited.
Wei-Liang Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic control apparatus and method for producing an electronic...
Patent number
11,696,389
Issue date
Jul 4, 2023
VITESCO TECHNOLOGIES GERMANY GMBH
Martin Steinau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
LED lighting systems and methods
Patent number
11,690,172
Issue date
Jun 27, 2023
Metrospec Technology, LLC
Henry V. Holec
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power electronics cooling assemblies and methods for making the same
Patent number
11,665,813
Issue date
May 30, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power semiconductor module and method for producing a power semicon...
Patent number
11,598,904
Issue date
Mar 7, 2023
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and semiconductor device including the same
Patent number
11,602,056
Issue date
Mar 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating battery protection circuit package
Patent number
11,452,213
Issue date
Sep 20, 2022
ITM SEMICONDUCTOR CO., LTD.
Hyuk Hwi Na
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Lighting fixture with reflector and template PCB
Patent number
11,441,747
Issue date
Sep 13, 2022
Ideal Industries Lighting LLC
Nelson Man Hoi Lui
F21 - LIGHTING
Information
Patent Grant
Packaging photon building blocks with top side connections and inte...
Patent number
11,411,152
Issue date
Aug 9, 2022
Bridgelux, Inc.
R. Scott West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for improved polymer-copper adhesion
Patent number
11,388,822
Issue date
Jul 12, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Grant
Systems and methods for coupling a metal core PCB to a heat sink
Patent number
11,333,341
Issue date
May 17, 2022
Fluence Bioengineering, Inc.
Dung Duong
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Electronic control device
Patent number
11,312,408
Issue date
Apr 26, 2022
Hitachi Astemo, Ltd.
Katsumasa Hagiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures and methods
Patent number
11,304,290
Issue date
Apr 12, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum-silicon carbide composite and production method therefor
Patent number
11,296,008
Issue date
Apr 5, 2022
DENKA COMPANY LIMITED
Takeshi Miyakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Light emitting device
Patent number
11,276,802
Issue date
Mar 15, 2022
Nichia Corporation
Motokazu Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic printed circuit board assembly for high-power components
Patent number
11,272,617
Issue date
Mar 8, 2022
ZKW GROUP GMBH
Dietmar Kieslinger
F21 - LIGHTING
Information
Patent Grant
LED lighting systems and method
Patent number
11,266,014
Issue date
Mar 1, 2022
Metrospec Technology, LLC
Henry V. Holec
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode (LED) lighting device
Patent number
11,236,868
Issue date
Feb 1, 2022
Feit Electric Company, Inc.
Shen Yanwei
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board arrangement comprising an electrical componen...
Patent number
11,212,907
Issue date
Dec 28, 2021
ZF Friedrichshafen AG
Manuel Schwab
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fiber-less photonic system in an integrated package
Patent number
11,156,790
Issue date
Oct 26, 2021
University College Cork
Peter O'Brien
G02 - OPTICS
Information
Patent Grant
Socket assembly, light emitter module, and lighting system
Patent number
11,129,276
Issue date
Sep 21, 2021
TE Connectivity Nederland B.V.
Jeroen Iedema
F21 - LIGHTING
Information
Patent Grant
PCB with coin and dielectric layer
Patent number
11,122,674
Issue date
Sep 14, 2021
Pui Yin Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
5G mmWave cooling through PCB
Patent number
11,112,841
Issue date
Sep 7, 2021
Intel Corporation
Divya Mani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Thermal management assembly comprising bulk graphene material
Patent number
11,105,567
Issue date
Aug 31, 2021
Momentive Performance Materials Quartz, Inc.
Wei Fan
B82 - NANO-TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
Publication number
20240130093
Publication date
Apr 18, 2024
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
Publication number
20240130076
Publication date
Apr 18, 2024
Toyota Motor Engineering & Manufacturing North America, Inc.
Tianzhu Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
Publication number
20240114614
Publication date
Apr 4, 2024
ICP TECHNOLOGY CO., LTD.
HO-CHIEH YU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
Publication number
20230375780
Publication date
Nov 23, 2023
Avary Holding (Shenzhen) Co., Limited.
WEI-LIANG WU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
Publication number
20230319975
Publication date
Oct 5, 2023
MITSUBISHI MATERIALS CORPORATION
Yoshiaki Sakaniwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20230292428
Publication date
Sep 14, 2023
Unimicron Technology Corp.
Ai Jing LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATE FOR CIRCUIT BOARD
Publication number
20230292433
Publication date
Sep 14, 2023
Tokuyama Corporation
Eiki TSUSHIMA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20230276577
Publication date
Aug 31, 2023
IBIDEN CO., LTD.
Yasushi USAMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
Publication number
20230262871
Publication date
Aug 17, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Publication number
20230199973
Publication date
Jun 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
Publication number
20230127557
Publication date
Apr 27, 2023
MITSUBISHI MATERIALS CORPORATION
Yoshiaki Sakaniwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATED CIRCUIT BOARD
Publication number
20230091454
Publication date
Mar 23, 2023
MITSUBISHI MATERIALS CORPORATION
Akira Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
Publication number
20230073563
Publication date
Mar 9, 2023
Nitto Denko Corporation
Hayato TAKAKURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
Publication number
20220359342
Publication date
Nov 10, 2022
ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
Markus Lasch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...
Publication number
20220357508
Publication date
Nov 10, 2022
Avary Holding (Shenzhen) Co., Limited.
WEI-LIANG WU
G02 - OPTICS
Information
Patent Application
METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE
Publication number
20220322537
Publication date
Oct 6, 2022
ITM SEMICONDUCTOR CO., LTD.
Hyuk Hwi NA
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
CIRCUIT BOARD ASSEMBLY
Publication number
20220272846
Publication date
Aug 25, 2022
Leonardo UK Ltd
Anthony KINGHORN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...
Publication number
20220142005
Publication date
May 5, 2022
DENSO CORPORATION
TOSHIHIRO MIYAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for Improved Polymer-Copper Adhesion
Publication number
20220071023
Publication date
Mar 3, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
Publication number
20220053630
Publication date
Feb 17, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK
Publication number
20220001482
Publication date
Jan 6, 2022
MITSUBISHI MATERIALS CORPORATION
Nobuyuki Terasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
Publication number
20210410284
Publication date
Dec 30, 2021
MITSUBISHI MATERIALS CORPORATION
Nobuyuki Terasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FABRICATING BATTERY PROTECTION CIRCUIT PACKAGE
Publication number
20210368631
Publication date
Nov 25, 2021
ITM SEMICONDUCTOR CO., LTD.
Hyuk Hwi NA
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND...
Publication number
20210280504
Publication date
Sep 9, 2021
Bitmain Technologies Inc.
Lei ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Control Apparatus And Method For Producing An Electronic...
Publication number
20210227681
Publication date
Jul 22, 2021
Vitesco Technologies Germany GmbH
Martin Steinau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Publication number
20210127500
Publication date
Apr 29, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Printed Circuit Board Assembly for High-Power Components
Publication number
20210092846
Publication date
Mar 25, 2021
ZKW GROUP GMBH
Dietmar KIESLINGER
F21 - LIGHTING
Information
Patent Application
POWER SUPPLY APPARATUS
Publication number
20210037638
Publication date
Feb 4, 2021
TDK-LAMBDA UK LIMITED
Alex KNILL
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF CONTINUOUS SHEET FOR CIRCUIT BOARD PRODUCTI...
Publication number
20210037656
Publication date
Feb 4, 2021
LG CHEM, LTD.
Hyung Suk Oh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB
Publication number
20200400279
Publication date
Dec 24, 2020
IDEAL INDUSTRIES LIGHTING LLC
Nelson Man Hoi Lui
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC