operating with cathodic sputtering

Industry

CPC
H01J37/34

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/34operating with cathodic sputtering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Magnetron plasma sputtering arrangement
- Patent number 12,170,194
- Issue date Dec 17, 2024
- Danmarks Tekniske Universitet
- Eugen Stamate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming apparatus and film forming method
- Patent number 12,163,215
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Koji Maeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnet system, sputtering device and method
- Patent number 12,165,857
- Issue date Dec 10, 2024
- VON ARDENNE Asset GmbH & Co. KG
- Klaus Schneider
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition process apparatus and method of optimizin...
- Patent number 12,165,935
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molten liquid transport for tunable vaporization in ion sources
- Patent number 12,154,754
- Issue date Nov 26, 2024
- Applied Materials, Inc.
- Craig R. Chaney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition into trenches and vias
- Patent number 12,154,770
- Issue date Nov 26, 2024
- Ascentool, Inc.
- George Xinsheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plasma processing a substrate in a plasma chamber and pla...
- Patent number 12,148,601
- Issue date Nov 19, 2024
- TRUMPF Huettinger Sp. z o. o.
- Wojciech Gajewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass airflow sensor and hydrocarbon trap combination
- Patent number 12,140,111
- Issue date Nov 12, 2024
- K & N Engineering, Inc.
- Kevin McClelland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for reducing misalignment between sputtering target and shield
- Patent number 12,136,543
- Issue date Nov 5, 2024
- Honeywell International Inc.
- Bo Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch uniformity improvement for single turn internal coil PVD chamber
- Patent number 12,136,544
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Anthony Chih-Tung Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Corrosion resistant and low embrittlement aluminum alloy coatings o...
- Patent number 12,134,817
- Issue date Nov 5, 2024
- The Boeing Company
- Stephen P. Gaydos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method for tuning magnetic field distribution of deposit...
- Patent number 12,129,541
- Issue date Oct 29, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target, film forming apparatus, and method of manufacturing film fo...
- Patent number 12,125,690
- Issue date Oct 22, 2024
- JSW AFTY CORPORATION
- Hironori Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide semiconductor sputtering target and method of fabricating thi...
- Patent number 12,119,225
- Issue date Oct 15, 2024
- KV Materials Co., Ltd.
- Shinhyuk Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving deposition process
- Patent number 12,112,930
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
TiCN having reduced growth defects by means of HiPIMS
- Patent number 12,110,580
- Issue date Oct 8, 2024
- OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON
- Denis Kurapov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cathode unit for magnetron sputtering apparatus and magnetron sputt...
- Patent number 12,112,929
- Issue date Oct 8, 2024
- ULVAC, Inc.
- Koji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual reverse pulse sputtering system
- Patent number 12,112,931
- Issue date Oct 8, 2024
- Advanced Energy Industries, Inc.
- Doug Pelleymounter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inverted cylindrical magnetron (ICM) system and methods of use
- Patent number 12,106,924
- Issue date Oct 1, 2024
- Vactronix Scientific, LLC.
- Tianzong Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target and method for manufacturing sputtering target
- Patent number 12,106,949
- Issue date Oct 1, 2024
- JX Advanced Metals Corporation
- Yuki Furuya
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of forming nitride semiconductor film
- Patent number 12,094,710
- Issue date Sep 17, 2024
- Tokyo Electron Limited
- Nobuaki Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid ion source for aluminum ion generation using a target holder...
- Patent number 12,094,681
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Graham Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition apparatus and method thereof
- Patent number 12,094,698
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method, film forming apparatus, and program
- Patent number 12,094,700
- Issue date Sep 17, 2024
- Tokyo Electron Limited
- Toshiharu Hirata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for controlling ion fraction in physical vapo...
- Patent number 12,094,699
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xiaodong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target, manufacturing method therefor, and manufacturing...
- Patent number 12,091,743
- Issue date Sep 17, 2024
- JX Advanced Metals Corporation
- Yasuyuki Iwabuchi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for coating a substrate with tantalum nitride
- Patent number 12,084,755
- Issue date Sep 10, 2024
- SAFRAN
- Marjorie Christine Cavarroc
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,087,563
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Liang Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition apparatus
- Patent number 12,077,850
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Lung Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
- Publication number 20240420937
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yu Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN SINTERED SPUTTERING TARGET
- Publication number 20240408671
- Publication date Dec 12, 2024
- JX NIPPON MINING & METALS CORPORATION
- Ryo Suzuki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Remote Plasma Device and Plasma Processing Apparatus
- Publication number 20240412949
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Taro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reference Box for Direct-Drive Radiofrequency Power Supply
- Publication number 20240404804
- Publication date Dec 5, 2024
- LAM RESEARCH CORPORATION
- Alexander Miller Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Magnetron Sputtering
- Publication number 20240404806
- Publication date Dec 5, 2024
- Melec GmbH
- Günter Mark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240395512
- Publication date Nov 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...
- Publication number 20240384394
- Publication date Nov 21, 2024
- Tosoh SMD, Inc.
- Eduardo del Rio Perez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...
- Publication number 20240384395
- Publication date Nov 21, 2024
- Tosoh SMD, Inc.
- Eduardo del Rio Perez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20240387156
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Improving Deposition Process
- Publication number 20240387155
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET
- Publication number 20240376592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Ying WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION APPARATUS
- Publication number 20240360545
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung Huo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA BASED FILM MODIFICATION FOR SEMICONDUCTOR DEVICES
- Publication number 20240352575
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Timothy J. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING KIT SHIELD
- Publication number 20240352574
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Sundarapandian Ramaling Vijayalaskshmi REDDY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240347327
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IGZO SPUTTERING TARGET
- Publication number 20240344193
- Publication date Oct 17, 2024
- JX Metals Corporation
- Kazutaka Murai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS SHUTTER ARRANGEMENT
- Publication number 20240347326
- Publication date Oct 17, 2024
- Evatec AG
- JÖRG KERSCHBAUMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION
- Publication number 20240339310
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Young WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...
- Publication number 20240332046
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Kirankumar Neelasandra SAVANDAIAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING APPARATUS
- Publication number 20240321563
- Publication date Sep 26, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Shigeki MATSUNAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER...
- Publication number 20240304430
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Mehdi Vaez-Iravani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF...
- Publication number 20240301546
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Thomas Werner Zilbauer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
JET IMPINGEMENT COOLING ASSEMBLY FOR PLASMA WINDOWS POSITIONED IN A...
- Publication number 20240297017
- Publication date Sep 5, 2024
- SHINE Technologies, LLC
- Preston Barrows
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetron Design for Improved Bottom Coverage and Uniformity
- Publication number 20240290593
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Cory LAFOLLETT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION SOURCE AND CHAMBER ASSEMBLY
- Publication number 20240282558
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Sathiyamurthi GOVINDASAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION DEVICE
- Publication number 20240274420
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Atsushi SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTU...
- Publication number 20240274416
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Jaesik An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME
- Publication number 20240271271
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHROMIC DEVICES
- Publication number 20240263294
- Publication date Aug 8, 2024
- View, Inc.
- Zhongchun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240263296
- Publication date Aug 8, 2024
- Chao Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

operating with cathodic sputtering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magnetron plasma sputtering arrangement

Film forming apparatus and film forming method

Magnet system, sputtering device and method

Physical vapor deposition process apparatus and method of optimizin...

Anti-stiction process for MEMS device

Molten liquid transport for tunable vaporization in ion sources

Vacuum deposition into trenches and vias

Method of plasma processing a substrate in a plasma chamber and pla...

Mass airflow sensor and hydrocarbon trap combination

Device for reducing misalignment between sputtering target and shield

Etch uniformity improvement for single turn internal coil PVD chamber

Corrosion resistant and low embrittlement aluminum alloy coatings o...

Deposition method for tuning magnetic field distribution of deposit...

Target, film forming apparatus, and method of manufacturing film fo...

Oxide semiconductor sputtering target and method of fabricating thi...

Method for improving deposition process

TiCN having reduced growth defects by means of HiPIMS

Cathode unit for magnetron sputtering apparatus and magnetron sputt...

Dual reverse pulse sputtering system

Inverted cylindrical magnetron (ICM) system and methods of use

Sputtering target and method for manufacturing sputtering target

Method of forming nitride semiconductor film

Hybrid ion source for aluminum ion generation using a target holder...

Physical vapor deposition apparatus and method thereof

Film forming method, film forming apparatus, and program

Methods and apparatus for controlling ion fraction in physical vapo...

Sputtering target, manufacturing method therefor, and manufacturing...

Method for coating a substrate with tantalum nitride

Semiconductor processing tool and methods of operation

Physical vapor deposition apparatus

Patents Applicationslast 30 patents

GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA

TUNGSTEN SINTERED SPUTTERING TARGET

Remote Plasma Device and Plasma Processing Apparatus

Reference Box for Direct-Drive Radiofrequency Power Supply

Method for Magnetron Sputtering

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...

LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...

DEPOSITION SYSTEM AND METHOD

Method for Improving Deposition Process

PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET

PHYSICAL VAPOR DEPOSITION APPARATUS

PLASMA BASED FILM MODIFICATION FOR SEMICONDUCTOR DEVICES

PROCESSING KIT SHIELD

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

IGZO SPUTTERING TARGET

PROCESS SHUTTER ARRANGEMENT

APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION

ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...

FILM FORMING APPARATUS

REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER...

SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF...

JET IMPINGEMENT COOLING ASSEMBLY FOR PLASMA WINDOWS POSITIONED IN A...

Magnetron Design for Improved Bottom Coverage and Uniformity

PHYSICAL VAPOR DEPOSITION SOURCE AND CHAMBER ASSEMBLY

FILM FORMATION METHOD AND FILM FORMATION DEVICE

PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTU...

PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME

ELECTROCHROMIC DEVICES

SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME