operating with cathodic sputtering

Industry

CPC
H01J37/34

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/34operating with cathodic sputtering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sputtering apparatus for coating of 3D-objects
- Patent number 12,272,525
- Issue date Apr 8, 2025
- EVATEC AG
- Stephan Voser
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,266,512
- Issue date Apr 1, 2025
- Semes Co., Ltd.
- Dukhyun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for sputtering and depositing metal on surface of...
- Patent number 12,266,513
- Issue date Apr 1, 2025
- Lanzhou Institute of Chemical Physics, CAS
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetron sputter device
- Patent number 12,266,516
- Issue date Apr 1, 2025
- Daegu Gyeongbuk Institute of Science & Technology
- June Seo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and support for coating eyeglass lenses
- Patent number 12,261,031
- Issue date Mar 25, 2025
- Schneider GmbH & Co. KG
- Gunter Schneider
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device and method for producing layers with improved uniformity in...
- Patent number 12,258,661
- Issue date Mar 25, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Michael Vergöhl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition (PVD) system and method of processing target
- Patent number 12,252,777
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Ying Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus
- Patent number 12,249,497
- Issue date Mar 11, 2025
- Samsung Display Co., Ltd.
- Hyun-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter deposition
- Patent number 12,249,498
- Issue date Mar 11, 2025
- Dyson Technology Limited
- Michael Edward Rendall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatus and magnetron mechanism
- Patent number 12,249,496
- Issue date Mar 11, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Yujie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slit diaphragm
- Patent number 12,243,730
- Issue date Mar 4, 2025
- Singulus Technologies AG
- Peter Weipert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two-dimensional electronic component and method of manufacturing same
- Patent number 12,237,152
- Issue date Feb 25, 2025
- National Central University
- Ching-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target and method for producing sputtering target
- Patent number 12,234,544
- Issue date Feb 25, 2025
- JX Advanced Metals Corporation
- Shuhei Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deposition apparatus, deposition target structure, and method
- Patent number 12,237,159
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, mobile terminal, and sputter coating apparatus
- Patent number 12,228,759
- Issue date Feb 18, 2025
- Huawei Technologies Co., Ltd.
- Peiling Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Yttrium ingot and sputtering target in which the yttrium ingot is used
- Patent number 12,227,830
- Issue date Feb 18, 2025
- Tosoh Corporation
- Yuya Tsuchida
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sputtering target for magnetic recording medium
- Patent number 12,230,485
- Issue date Feb 18, 2025
- Tanaka Kikinzoku Kogyo K.K.
- Tomonari Kamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetic-field-assisted plasma coating system
- Patent number 12,224,165
- Issue date Feb 11, 2025
- Board of Trustees of Michigan State University
- Thomas Schuelke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer coating
- Patent number 12,221,687
- Issue date Feb 11, 2025
- CemeCon AG
- Werner Kölker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas mixing method to enhance plasma
- Patent number 12,224,159
- Issue date Feb 11, 2025
- SKY TECH INC.
- Ta-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target and sputtering apparatus including the same
- Patent number 12,221,686
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Hyuneok Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ion beam source, substrate process apparatus including the same, an...
- Patent number 12,224,163
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- SeungWan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnesium oxide sputtering target
- Patent number 12,224,166
- Issue date Feb 11, 2025
- JX Advanced Metals Corporation
- Hiroki Kajita
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method and device for producing uniform films on moving substrates...
- Patent number 12,217,947
- Issue date Feb 4, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Michael Vergöhl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Profiled sputtering target and method of making the same
- Patent number 12,217,951
- Issue date Feb 4, 2025
- Honeywell International Inc.
- Shih-Yao Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnet system, sputtering device and housing cover
- Patent number 12,217,950
- Issue date Feb 4, 2025
- VON ARDENNE Asset GmbH & Co. KG
- Thorsten Sander
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Isolated volume seals and method of forming an isolated volume with...
- Patent number 12,217,982
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Kirankumar Neelasandra Savandaiah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target, method of bonding target material and backing pl...
- Patent number 12,217,948
- Issue date Feb 4, 2025
- Sumitomo Chemical Company, Limited
- Masahiro Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shutter disc for a semiconductor processing tool
- Patent number 12,215,414
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Lin Wang
- B08 - CLEANING
Information Patent Grant
Magnetically enhanced high density plasma-chemical vapor deposition...
- Patent number 12,217,949
- Issue date Feb 4, 2025
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PERMEANCE MAGNETIC ASSEMBLY
- Publication number 20250112032
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Jen YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION
- Publication number 20250101572
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Harish Y. PENMETHSA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING
- Publication number 20250095975
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Han KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20250092508
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES
- Publication number 20250087472
- Publication date Mar 13, 2025
- INTEVAC, INC.
- Samuel D. Harkness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20250087536
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
- Publication number 20250079142
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Liang CHEN
- B08 - CLEANING
Information Patent Application
Mass Airflow Sensor And Hydrocarbon Trap Combination
- Publication number 20250067235
- Publication date Feb 27, 2025
- K&N Engineering, Inc.
- Kevin McClelland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
- Publication number 20250062165
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS AND FILM FORMING METHOD
- Publication number 20250059640
- Publication date Feb 20, 2025
- TOKYO ELECTRON LIMITED
- Koji MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SPUTTERING OF MULTIPLE ELECTRODES WITH OPTIMIZED PLAMSA COUPLING...
- Publication number 20250054728
- Publication date Feb 13, 2025
- SPUTTERING COMPONENTS, INC.
- Ken Nauman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS MIXING METHOD TO ENHANCE PLASMA
- Publication number 20250054732
- Publication date Feb 13, 2025
- SKY TECH INC.
- TA-HAO KUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING METAL
- Publication number 20250037981
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING APPARATUS AND METHOD FOR THIN FILM ELECTRODE DEPOSITION
- Publication number 20250029819
- Publication date Jan 23, 2025
- SAMSUNG DISPLAY CO., LTD.
- You Jong LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ACTIVELY COOLED ANODE FOR SPUTTERING PROCESSES
- Publication number 20250029820
- Publication date Jan 23, 2025
- INTEVAC, INC.
- Patrick Morse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRON-BEAM-ASSISTED SPUTTERING DEVICE AND METHOD THEREFOR
- Publication number 20250019819
- Publication date Jan 16, 2025
- INFOVION INC.
- Yong Hwan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE
- Publication number 20250014878
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Andreas SCHMID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
- Publication number 20240429036
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
- Publication number 20240420937
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yu Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN SINTERED SPUTTERING TARGET
- Publication number 20240408671
- Publication date Dec 12, 2024
- JX NIPPON MINING & METALS CORPORATION
- Ryo Suzuki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Remote Plasma Device and Plasma Processing Apparatus
- Publication number 20240412949
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Taro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reference Box for Direct-Drive Radiofrequency Power Supply
- Publication number 20240404804
- Publication date Dec 5, 2024
- LAM RESEARCH CORPORATION
- Alexander Miller Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Magnetron Sputtering
- Publication number 20240404806
- Publication date Dec 5, 2024
- Melec GmbH
- Günter Mark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240395512
- Publication date Nov 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...
- Publication number 20240384394
- Publication date Nov 21, 2024
- Tosoh SMD, Inc.
- Eduardo del Rio Perez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...
- Publication number 20240384395
- Publication date Nov 21, 2024
- Tosoh SMD, Inc.
- Eduardo del Rio Perez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20240387156
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Improving Deposition Process
- Publication number 20240387155
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET
- Publication number 20240376592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Ying WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION APPARATUS
- Publication number 20240360545
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung Huo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

operating with cathodic sputtering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sputtering apparatus for coating of 3D-objects

Plasma processing apparatus

Device and method for sputtering and depositing metal on surface of...

Magnetron sputter device

System, method and support for coating eyeglass lenses

Device and method for producing layers with improved uniformity in...

Physical vapor deposition (PVD) system and method of processing target

Sputtering apparatus

Sputter deposition

Semiconductor processing apparatus and magnetron mechanism

Slit diaphragm

Two-dimensional electronic component and method of manufacturing same

Sputtering target and method for producing sputtering target

Deposition apparatus, deposition target structure, and method

Housing, mobile terminal, and sputter coating apparatus

Yttrium ingot and sputtering target in which the yttrium ingot is used

Sputtering target for magnetic recording medium

Magnetic-field-assisted plasma coating system

Multi-layer coating

Gas mixing method to enhance plasma

Sputtering target and sputtering apparatus including the same

Ion beam source, substrate process apparatus including the same, an...

Magnesium oxide sputtering target

Method and device for producing uniform films on moving substrates...

Profiled sputtering target and method of making the same

Magnet system, sputtering device and housing cover

Isolated volume seals and method of forming an isolated volume with...

Sputtering target, method of bonding target material and backing pl...

Shutter disc for a semiconductor processing tool

Magnetically enhanced high density plasma-chemical vapor deposition...

Patents Applicationslast 30 patents

PERMEANCE MAGNETIC ASSEMBLY

MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION

SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES

DEPOSITION SYSTEM AND METHOD

SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS

Mass Airflow Sensor And Hydrocarbon Trap Combination

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS

FILM FORMING APPARATUS AND FILM FORMING METHOD

RF SPUTTERING OF MULTIPLE ELECTRODES WITH OPTIMIZED PLAMSA COUPLING...

GAS MIXING METHOD TO ENHANCE PLASMA

SYSTEMS AND METHODS FOR DEPOSITING METAL

SPUTTERING APPARATUS AND METHOD FOR THIN FILM ELECTRODE DEPOSITION

ACTIVELY COOLED ANODE FOR SPUTTERING PROCESSES

ELECTRON-BEAM-ASSISTED SPUTTERING DEVICE AND METHOD THEREFOR

WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING

GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA

TUNGSTEN SINTERED SPUTTERING TARGET

Remote Plasma Device and Plasma Processing Apparatus

Reference Box for Direct-Drive Radiofrequency Power Supply

Method for Magnetron Sputtering

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...

LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR...

DEPOSITION SYSTEM AND METHOD

Method for Improving Deposition Process

PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET

PHYSICAL VAPOR DEPOSITION APPARATUS