Optical coupling

Industry

CPC
H01L2225/06534

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06534Optical coupling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,830,841
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,791,311
- Issue date Oct 17, 2023
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure integrated-circuit systems
- Patent number 11,670,602
- Issue date Jun 6, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HBM silicon photonic TSV architecture for lookup computing AI accel...
- Patent number 11,398,453
- Issue date Jul 26, 2022
- Samsung Electronics Co., Ltd.
- Peng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor package and method for manufacturing the same
- Patent number 11,322,470
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device(s) and structure(s) with electronic control...
- Patent number 11,270,988
- Issue date Mar 8, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure integrated-circuit systems
- Patent number 11,251,139
- Issue date Feb 15, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electrical/optical interface with two-tiered packaging
- Patent number 11,107,770
- Issue date Aug 31, 2021
- Xilinx, Inc.
- Suresh Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 11,069,571
- Issue date Jul 20, 2021
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,991,673
- Issue date Apr 27, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies with lids including circuit elements
- Patent number 10,950,580
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 10,872,816
- Issue date Dec 22, 2020
- Gula Consulting Limited Liabiity Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,784,233
- Issue date Sep 22, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including optically connected wafer stack
- Patent number 10,734,354
- Issue date Aug 4, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,734,356
- Issue date Aug 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device module having a silicon interposer
- Patent number 10,727,368
- Issue date Jul 28, 2020
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 10,707,124
- Issue date Jul 7, 2020
- Gula Consulting Limited Liabiity Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Grant
Method for optical interconnection between semiconductor chips usin...
- Patent number 10,686,534
- Issue date Jun 16, 2020
- Korea Institute of Science and Technology
- Jaehoon Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical semiconductor package and method for manufacturing the same
- Patent number 10,665,560
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,651,152
- Issue date May 12, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip integration on qubit chips
- Patent number 10,644,217
- Issue date May 5, 2020
- International Business Machines Corporation
- Sami Rosenblatt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,593,646
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,529,691
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,475,767
- Issue date Nov 12, 2019
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,418,321
- Issue date Sep 17, 2019
- Renesas Electronics Corporation
- Shinichi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,373,933
- Issue date Aug 6, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,366,972
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,325,896
- Issue date Jun 18, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,283,494
- Issue date May 7, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES
- Publication number 20240268131
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Timothy M. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240063184
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230420417
- Publication date Dec 28, 2023
- Nagase & Co., Ltd
- Yoichiro KURITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...
- Publication number 20220367412
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Peng GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220254747
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE INTEGRATED-CIRCUIT SYSTEMS
- Publication number 20220130774
- Publication date Apr 28, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20220115268
- Publication date Apr 14, 2022
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES
- Publication number 20210242189
- Publication date Aug 5, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210217727
- Publication date Jul 15, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200286845
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE INTEGRATED-CIRCUIT SYSTEMS
- Publication number 20200235059
- Publication date Jul 23, 2020
- X-Celeprint Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...
- Publication number 20190214365
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Peng GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190206837
- Publication date Jul 4, 2019
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
- Publication number 20190198479
- Publication date Jun 27, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONICS PACKAGE WITH SELF-ALIGNED STACKED-DIE ASSEMBLY
- Publication number 20190074263
- Publication date Mar 7, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH SELF-ALIGNED STACKED-DIE ASSEMBLY
- Publication number 20190074271
- Publication date Mar 7, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366409
- Publication date Dec 20, 2018
- RENESAS ELECTRONICS CORPORATION
- Shinichi KUWABARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20180197772
- Publication date Jul 12, 2018
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20170076979
- Publication date Mar 16, 2017
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321803
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321804
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
MEMORY CHIP PACKAGE, MEMORY SYSTEM HAVING THE SAME AND DRIVING METH...
- Publication number 20140268980
- Publication date Sep 18, 2014
- JEONG-KYOUM KIM
- G11 - INFORMATION STORAGE
Information Patent Application
WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY
- Publication number 20140003765
- Publication date Jan 2, 2014
- Jia-Hung Tseng
- G02 - OPTICS
Information Patent Application
BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION
- Publication number 20130320567
- Publication date Dec 5, 2013
- ORACLE INTERNATIONAL CORPORATION
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS STACK STRUCTURES WITH OPTICAL TO ELECTRICAL TIMING RE...
- Publication number 20130320359
- Publication date Dec 5, 2013
- SEMATECH, INC.
- Klaus HUMMLER
- G02 - OPTICS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20130228938
- Publication date Sep 5, 2013
- Sagacious Investment Group L.L.C.
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20130221533
- Publication date Aug 29, 2013
- Sagacious Investment Group L.L.C.
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Application
OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK
- Publication number 20130108211
- Publication date May 2, 2013
- Chee Yee Kwok
- G02 - OPTICS

Optical coupling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Electronic device

Secure integrated-circuit systems

HBM silicon photonic TSV architecture for lookup computing AI accel...

Optical semiconductor package and method for manufacturing the same

3D semiconductor device(s) and structure(s) with electronic control...

Secure integrated-circuit systems

Integrated electrical/optical interface with two-tiered packaging

High speed, high density, low power die interconnect system

Electronic device

Semiconductor device assemblies with lids including circuit elements

High speed, high density, low power die interconnect system

Microelectronics package with self-aligned stacked-die assembly

Semiconductor device including optically connected wafer stack

Microelectronics package with self-aligned stacked-die assembly

Optoelectronic device module having a silicon interposer

High speed, high density, low power die interconnect system

Method for optical interconnection between semiconductor chips usin...

Optical semiconductor package and method for manufacturing the same

Microelectronics package with self-aligned stacked-die assembly

Flip chip integration on qubit chips

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Electronic device

Semiconductor device

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Tooling for coupling multiple electronic chips

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Patents Applicationslast 30 patents

OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES

PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

ELECTRONIC DEVICE

HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SECURE INTEGRATED-CIRCUIT SYSTEMS

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

3D SEMICONDUCTOR DEVICES AND STRUCTURES

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SECURE INTEGRATED-CIRCUIT SYSTEMS

HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK

MICROELECTRONICS PACKAGE WITH SELF-ALIGNED STACKED-DIE ASSEMBLY

MICROELECTRONICS PACKAGE WITH SELF-ALIGNED STACKED-DIE ASSEMBLY

SEMICONDUCTOR DEVICE

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

MEMORY CHIP PACKAGE, MEMORY SYSTEM HAVING THE SAME AND DRIVING METH...

WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY

BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION

HETEROGENEOUS STACK STRUCTURES WITH OPTICAL TO ELECTRICAL TIMING RE...

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK