Optical signal interface included within high-frequency semiconductor device housing

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CPC
H01L2223/6694

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6694Optical signal interface included within high-frequency semiconductor device housing

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Patents Grantslast 30 patents

Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense hybrid package integration of optically programmable chip
- Patent number 11,476,238
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer circuit
- Patent number 11,152,308
- Issue date Oct 19, 2021
- II-VI DELAWARE, INC.
- Norbert Schlepple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conveying high frequency module and a high-frequency module
- Patent number 11,101,226
- Issue date Aug 24, 2021
- DUSTPHOTONICS LTD.
- Guy Koren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable frequency selective surfaces
- Patent number 10,424,679
- Issue date Sep 24, 2019
- Raytheon Company
- Gary A. Frazier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial cable assembly, electronic package and connector
- Patent number 10,085,337
- Issue date Sep 25, 2018
- Institut National D'Optique
- Christophe Fisné
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing unit, electronic module, and electroni...
- Patent number 9,078,347
- Issue date Jul 7, 2015
- Kyocera Corporation
- Mahiro Tsujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
High Frequency Package
- Publication number 20220344289
- Publication date Oct 27, 2022
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE
- Publication number 20220084964
- Publication date Mar 17, 2022
- XSIGHT LABS LTD.
- Guy Koren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense Hybrid Package Integration Of Optically Programmable Chip
- Publication number 20210351169
- Publication date Nov 11, 2021
- International Business Machines Corporation
- Frank Robert Libsch
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT
- Publication number 20210104812
- Publication date Apr 8, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE
- Publication number 20200273821
- Publication date Aug 27, 2020
- Guy Koren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES
- Publication number 20200227362
- Publication date Jul 16, 2020
- Intel Corporation
- Jonathan W. THIBADO
- G02 - OPTICS
Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20200144190
- Publication date May 7, 2020
- Finisar Corporation
- Norbert Schlepple
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROGRAMMABLE FREQUENCY SELECTIVE SURFACES
- Publication number 20180102592
- Publication date Apr 12, 2018
- Raytheon Company
- Gary A. Frazier
- G11 - INFORMATION STORAGE
Information Patent Application
COAXIAL CABLE ASSEMBLY, ELECTRONIC PACKAGE AND CONNECTOR
- Publication number 20170347446
- Publication date Nov 30, 2017
- Institut National D'Optique
- Christophe Fisné
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING UNIT, ELECTRONIC MODULE, AND ELECTRONI...
- Publication number 20130128467
- Publication date May 23, 2013
- KYOCERA CORPORATION
- Mahiro Tsujino
- G02 - OPTICS

Optical signal interface included within high-frequency semiconductor device housing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer and electronic package

Dense hybrid package integration of optically programmable chip

Interposer circuit

Method for conveying high frequency module and a high-frequency module

Programmable frequency selective surfaces

Coaxial cable assembly, electronic package and connector

Electronic component housing unit, electronic module, and electroni...

Patents Applicationslast 30 patents

High Frequency Package

METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE

Dense Hybrid Package Integration Of Optically Programmable Chip

SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT

METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE

REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES

INTERPOSER CIRCUIT

PROGRAMMABLE FREQUENCY SELECTIVE SURFACES

COAXIAL CABLE ASSEMBLY, ELECTRONIC PACKAGE AND CONNECTOR

ELECTRONIC COMPONENT HOUSING UNIT, ELECTRONIC MODULE, AND ELECTRONI...