Other details of electrical connections

Industry

CPC
H05K2201/10954

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10954Other details of electrical connections

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fluid ejection controllers to pivotally hold firing boards
- Patent number 11,975,547
- Issue date May 7, 2024
- Hewlett-Packard Development Company, L.P.
- Vignesh Kannan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Electronic assembly
- Patent number 11,744,021
- Issue date Aug 29, 2023
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Supporting-terminal-equipped capacitor chip and mounted structure t...
- Patent number 11,570,896
- Issue date Jan 31, 2023
- Murata Manufacturing Co., Ltd.
- Shinobu Chikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch component placement on printed circuit boards
- Patent number 10,729,050
- Issue date Jul 28, 2020
- Seagate Technology LLC
- Vimal Cyril
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,674,604
- Issue date Jun 2, 2020
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shape conformable capacitive coupler
- Patent number 10,641,818
- Issue date May 5, 2020
- Keysight Technologies, Inc.
- Choon Kait Andrew Tek
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Electrical connector
- Patent number 10,615,533
- Issue date Apr 7, 2020
- Lotes Co., Ltd.
- Yong Quan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,405,437
- Issue date Sep 3, 2019
- Samsung Display Co., Ltd.
- Seung-Hwa Ha
- G02 - OPTICS
Information Patent Grant
Contact bump connection and contact bump and method for producing a...
- Patent number 10,292,270
- Issue date May 14, 2019
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a printed circuit board assembly
- Patent number 9,832,874
- Issue date Nov 28, 2017
- International Business Machines Corporation
- Andreas C. Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having self healing liquid phase power connects and metho...
- Patent number 9,728,868
- Issue date Aug 8, 2017
- Cree Fayetteville, Inc.
- Alexander Lostetter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jumper module mounting circuit board and circuit board assembly
- Patent number 9,414,491
- Issue date Aug 9, 2016
- Yazaki Corporation
- Takanori Kitajo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of printed circuit boards
- Patent number 9,414,493
- Issue date Aug 9, 2016
- International Business Machines Corporation
- Andreas C. Doering
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming of an electric connection of the via type
- Patent number 9,237,650
- Issue date Jan 12, 2016
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALTERNATIVES
- Roland Gers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact bumps methods of making contact bumps
- Patent number 9,215,809
- Issue date Dec 15, 2015
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM
- Publication number 20250024600
- Publication date Jan 16, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Charles SOURIAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20230240011
- Publication date Jul 27, 2023
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID EJECTION CONTROLLERS TO PIVOTALLY HOLD FIRING BOARDS
- Publication number 20220322538
- Publication date Oct 6, 2022
- Hewlett-Packard Development Company, L.P.
- Vignesh KANNAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENT
- Publication number 20220201865
- Publication date Jun 23, 2022
- DENSO CORPORATION
- Go SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING-TERMINAL-EQUIPPED CAPACITOR CHIP AND MOUNTED STRUCTURE T...
- Publication number 20210127493
- Publication date Apr 29, 2021
- Murata Manufacturing Co., Ltd.
- Shinobu CHIKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPE CONFORMABLE CAPACITIVE COUPLER
- Publication number 20200064395
- Publication date Feb 27, 2020
- KEYSIGHT TECHNOLOGIES, INC.
- Choon Kait Andrew Tek
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20190280417
- Publication date Sep 12, 2019
- LOTES CO., LTD
- Yong Quan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COMPONENT PLACEMENT ON PRINTED CIRCUIT BOARDS
- Publication number 20190150334
- Publication date May 16, 2019
- SEAGATE TECHNOLOGY LLC
- Vimal CYRIL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170127517
- Publication date May 4, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING
- Publication number 20160128193
- Publication date May 5, 2016
- Elwha LLC
- William David Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING
- Publication number 20160128192
- Publication date May 5, 2016
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF PRINTED CIRCUIT BOARDS
- Publication number 20150351242
- Publication date Dec 3, 2015
- International Business Machines Corporation
- ANDREAS C. DOERING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMUM POWER INTERFACE BOARD POWER PERFORMANCE BY SERVER OR STORAG...
- Publication number 20150313042
- Publication date Oct 29, 2015
- HON HAI PRECISION INDUSTRY CO., LTD.
- YU-CHI TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact Bump Connection and Contact Bump and Method for Producing a...
- Publication number 20150208508
- Publication date Jul 23, 2015
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20150163897
- Publication date Jun 11, 2015
- LOTES CO., LTD
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JUMPER MODULE MOUNTING CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY
- Publication number 20150062834
- Publication date Mar 5, 2015
- YAZAKI CORPORATION
- Takanori KITAJO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20150049443
- Publication date Feb 19, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING OF AN ELECTRIC CONNECTION OF THE VIA TYPE
- Publication number 20140346680
- Publication date Nov 27, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Roland Gers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20140084460
- Publication date Mar 27, 2014
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H01 - BASIC ELECTRIC ELEMENTS

Other details of electrical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluid ejection controllers to pivotally hold firing boards

Electronic assembly

Supporting-terminal-equipped capacitor chip and mounted structure t...

Fine pitch component placement on printed circuit boards

Printed wiring board and method for manufacturing the same

Shape conformable capacitive coupler

Electrical connector

Display device

Contact bump connection and contact bump and method for producing a...

Method of forming a printed circuit board assembly

Apparatus having self healing liquid phase power connects and metho...

Jumper module mounting circuit board and circuit board assembly

Assembly of printed circuit boards

Forming of an electric connection of the via type

Contact bumps methods of making contact bumps

Patents Applicationslast 30 patents

INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM

ELECTRONIC ASSEMBLY

FLUID EJECTION CONTROLLERS TO PIVOTALLY HOLD FIRING BOARDS

ELECTRIC COMPONENT

SUPPORTING-TERMINAL-EQUIPPED CAPACITOR CHIP AND MOUNTED STRUCTURE T...

SHAPE CONFORMABLE CAPACITIVE COUPLER

ELECTRICAL CONNECTOR

FINE PITCH COMPONENT PLACEMENT ON PRINTED CIRCUIT BOARDS

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING

SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING

ASSEMBLY OF PRINTED CIRCUIT BOARDS

OPTIMUM POWER INTERFACE BOARD POWER PERFORMANCE BY SERVER OR STORAG...

Contact Bump Connection and Contact Bump and Method for Producing a...

ELECTRICAL CONNECTOR

JUMPER MODULE MOUNTING CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY

CHIP ARRANGEMENT

FORMING OF AN ELECTRIC CONNECTION OF THE VIA TYPE

Contact bumps methods of making contact bumps