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H05K2201/10227

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10227Other objects

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,207,410
- Issue date Jan 21, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mainboard connection structure and guiding device
- Patent number 12,052,823
- Issue date Jul 30, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Chia-Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel device and manufacturing method of panel device
- Patent number 11,963,300
- Issue date Apr 16, 2024
- Au Optronics Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power converter
- Patent number 11,915,995
- Issue date Feb 27, 2024
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving device
- Patent number 11,314,102
- Issue date Apr 26, 2022
- TDK TAIWAN CORP.
- Chao-Chang Hu
- G02 - OPTICS
Information Patent Grant
Multi-aperture cameras with at least one two state zoom camera
- Patent number 11,310,405
- Issue date Apr 19, 2022
- Corephotonics Ltd.
- Gal Shabtay
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus, system, and method for retaining thermal interface mater...
- Patent number 11,229,120
- Issue date Jan 18, 2022
- Juniper Networks, Inc.
- John Ferullo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing apparatus
- Patent number 11,160,173
- Issue date Oct 26, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 11,083,082
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Kathleen Ann Fadden
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device with force element
- Patent number 10,966,008
- Issue date Mar 30, 2021
- Bose Corporation
- Randall Mathieu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Expanding thermal device and system for effecting heat transfer wit...
- Patent number 10,887,978
- Issue date Jan 5, 2021
- Raytheon Company
- Brian W. Johansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving device
- Patent number 10,782,538
- Issue date Sep 22, 2020
- TDK TAIWAN CORP.
- Chao-Chang Hu
- G02 - OPTICS
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 10,531,561
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Kathleen Ann Fadden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection pad for embedded components in PCB packaging
- Patent number 10,455,707
- Issue date Oct 22, 2019
- Apple Inc.
- Kenneth Leland Kiplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically attached edge shield
- Patent number 10,375,865
- Issue date Aug 6, 2019
- Microsoft Technology Licensing, LLC
- Mark Mitchell Gloster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lens driving device
- Patent number 10,365,500
- Issue date Jul 30, 2019
- TDK TAIWAN CORP.
- Chao-Chang Hu
- G02 - OPTICS
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 10,306,753
- Issue date May 28, 2019
- International Business Machines Corporation
- Kathleen Ann Fadden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expanding thermal device and system for effecting heat transfer wit...
- Patent number 10,292,255
- Issue date May 14, 2019
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,237,977
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,231,334
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pen battery mechanical shock reduction design
- Patent number 10,181,591
- Issue date Jan 15, 2019
- Microsoft Technology Licensing, LLC
- Bradley E. Clements
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrical device placement using a pedestal
- Patent number 10,080,289
- Issue date Sep 18, 2018
- MACOM Technology Solutions Holdings, Inc.
- Jessica Aldrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High heat-dissipation circuit board assembly system and power suppl...
- Patent number 10,064,315
- Issue date Aug 28, 2018
- Lite-On Electronics (Guangzhou) Limited
- Chien-Hsiung Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 10,028,378
- Issue date Jul 17, 2018
- Nitto Denko Corporation
- Hiroyuki Tanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Load resistor supports
- Patent number 9,978,486
- Issue date May 22, 2018
- Fluke Corporation
- Mark Steven Buckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate and method of inspecting interconnection...
- Patent number 9,974,162
- Issue date May 15, 2018
- Shinko Electric Industries Co., Ltd.
- Tsukasa Obinata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 9,949,370
- Issue date Apr 17, 2018
- Nitto Denko Corporation
- Hiroyuki Tanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 9,936,576
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 9,913,375
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VOLTAGE REGULATOR MODULE HAVING A POWER STAGE
- Publication number 20240314926
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT FASTENERS FOR SECURING COMPONENTS TOGETHER
- Publication number 20240292515
- Publication date Aug 29, 2024
- Tesla, Inc.
- Rameez Hasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240057251
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230319975
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAINBOARD CONNECTION STRUCTURE AND GUIDING DEVICE
- Publication number 20230217594
- Publication date Jul 6, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- CHIA-KANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230137656
- Publication date May 4, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERTER
- Publication number 20220181233
- Publication date Jun 9, 2022
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL DEVICE AND MANUFACTURING METHOD OF PANEL DEVICE
- Publication number 20220053638
- Publication date Feb 17, 2022
- AU OPTRONICS CORPORATION
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-APERTURE CAMERAS WITH AT LEAST ONE TWO STATE ZOOM CAMERA
- Publication number 20220046151
- Publication date Feb 10, 2022
- Corephotonics Ltd.
- Gal Shabtay
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)
- Publication number 20200008295
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Kathleen Ann FADDEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LENS DRIVING DEVICE
- Publication number 20190302473
- Publication date Oct 3, 2019
- TDK TAIWAN CORP.
- Chao-Chang HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Expanding Thermal Device and System for Effecting Heat Transfer wit...
- Publication number 20190261502
- Publication date Aug 22, 2019
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY ATTACHED EDGE SHIELD
- Publication number 20180279515
- Publication date Sep 27, 2018
- Microsoft Technology Licensing, LLC
- Mark Mitchell Gloster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SENSOR LEAD FRAME SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20180248092
- Publication date Aug 30, 2018
- TTOP CORP.
- Jen-You Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE PROTECTION STRUCTURE
- Publication number 20180234596
- Publication date Aug 16, 2018
- Asia Vital Components Co., Ltd.
- Ping-Huang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual-Chip Package Structure
- Publication number 20180233487
- Publication date Aug 16, 2018
- Lyontek Inc.
- CHI-CHENG HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180168038
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180153035
- Publication date May 31, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEN BATTERY MECHANICAL SHOCK REDUCTION DESIGN
- Publication number 20180063984
- Publication date Mar 1, 2018
- Microsoft Technology Licensing, LLC
- Bradley E. CLEMENTS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20180049316
- Publication date Feb 15, 2018
- AUTONETWORKS TECHNOLOGIES, LTD.
- Yu Muronoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTRICAL DEVICE PLACEMENT USING A PEDESTAL
- Publication number 20180027657
- Publication date Jan 25, 2018
- MACOM Technology Solutions Holdings, Inc.
- Jessica Aldrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component And Method For Producing An Electronic Compone...
- Publication number 20170339790
- Publication date Nov 23, 2017
- Conti Temic microelectronic GmbH
- Frieder Wittmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Expanding Thermal Device and System for Effecting Heat Transfer wit...
- Publication number 20170339779
- Publication date Nov 23, 2017
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20170339786
- Publication date Nov 23, 2017
- Nitto Denko Corporation
- Hiroyuki TANABE
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRICAL CIRCUITRY ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170332492
- Publication date Nov 16, 2017
- Flextronics Automotive GmbH & Co. KG
- Peter Lutz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH HEAT-DISSIPATION CIRCUIT BOARD ASSEMBLY SYSTEM AND POWER SUPPL...
- Publication number 20170303427
- Publication date Oct 19, 2017
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- CHIEN-HSIUNG TSAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION SUBSTRATE AND METHOD OF INSPECTING INTERCONNECTION...
- Publication number 20170273175
- Publication date Sep 21, 2017
- Shinko Electric Industries Co., Ltd.
- Tsukasa OBINATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOAD RESISTOR SUPPORTS
- Publication number 20170207010
- Publication date Jul 20, 2017
- FLUKE CORPORATION
- Mark Steven BUCKNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20170171969
- Publication date Jun 15, 2017
- Nitto Denko Corporation
- Hiroyuki TANABE
- G11 - INFORMATION STORAGE
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20170171970
- Publication date Jun 15, 2017
- Nitto Denko Corporation
- Hiroyuki TANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Other objects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board

Insulating resin circuit substrate

Mainboard connection structure and guiding device

Panel device and manufacturing method of panel device

Power converter

Lens driving device

Multi-aperture cameras with at least one two state zoom camera

Apparatus, system, and method for retaining thermal interface mater...

Fixing apparatus

Enclosure-to-board interface with tamper-detect circuit(s)

Electronic device with force element

Expanding thermal device and system for effecting heat transfer wit...

Lens driving device

Enclosure-to-board interface with tamper-detect circuit(s)

Connection pad for embedded components in PCB packaging

Mechanically attached edge shield

Lens driving device

Enclosure-to-board interface with tamper-detect circuit(s)

Expanding thermal device and system for effecting heat transfer wit...

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Pen battery mechanical shock reduction design

Method and apparatus for electrical device placement using a pedestal

High heat-dissipation circuit board assembly system and power suppl...

Suspension board with circuit and producing method thereof

Load resistor supports

Interconnection substrate and method of inspecting interconnection...

Suspension board with circuit and producing method thereof

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Patents Applicationslast 30 patents

VOLTAGE REGULATOR MODULE HAVING A POWER STAGE

PRESS-FIT FASTENERS FOR SECURING COMPONENTS TOGETHER

PRINTED CIRCUIT BOARD

INSULATING RESIN CIRCUIT SUBSTRATE

MAINBOARD CONNECTION STRUCTURE AND GUIDING DEVICE

WIRING CIRCUIT BOARD

POWER CONVERTER

PANEL DEVICE AND MANUFACTURING METHOD OF PANEL DEVICE

MULTI-APERTURE CAMERAS WITH AT LEAST ONE TWO STATE ZOOM CAMERA

ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)

LENS DRIVING DEVICE

Expanding Thermal Device and System for Effecting Heat Transfer wit...

MECHANICALLY ATTACHED EDGE SHIELD

LIGHT SENSOR LEAD FRAME SUBSTRATE AND MANUFACTURING METHOD THEREOF

CAMERA MODULE PROTECTION STRUCTURE

Dual-Chip Package Structure

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

PEN BATTERY MECHANICAL SHOCK REDUCTION DESIGN

CIRCUIT STRUCTURE

METHOD AND APPARATUS FOR ELECTRICAL DEVICE PLACEMENT USING A PEDESTAL

Electronic Component And Method For Producing An Electronic Compone...

Expanding Thermal Device and System for Effecting Heat Transfer wit...

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

ELECTRICAL CIRCUITRY ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

HIGH HEAT-DISSIPATION CIRCUIT BOARD ASSEMBLY SYSTEM AND POWER SUPPL...

INTERCONNECTION SUBSTRATE AND METHOD OF INSPECTING INTERCONNECTION...

LOAD RESISTOR SUPPORTS

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF