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H01L2924/1082

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and manufacturing method thereof
- Patent number 10,242,963
- Issue date Mar 26, 2019
- National Tsing Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method of fabricating a CZTS photovoltaic device by e...
- Patent number 9,041,141
- Issue date May 26, 2015
- International Business Machines Corporation
- Shafaat Ahmed
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Structure and method of fabricating a CZTS photovoltaic device by e...
- Patent number 8,790,956
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Shafaat Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process
- Patent number 8,497,162
- Issue date Jul 30, 2013
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of fabricating a CZTS photovoltaic device by e...
- Patent number 8,426,241
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Shafaat Ahmed
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170248590
- Publication date Aug 31, 2017
- National Tsing-Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and Method of Fabricating a CZTS Photovoltaic Device by E...
- Publication number 20140252530
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Shafaat Ahmed
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LID ATTACH PROCESS
- Publication number 20130309814
- Publication date Nov 21, 2013
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Fabricating a CZTS Photovoltaic Device by E...
- Publication number 20130125977
- Publication date May 23, 2013
- International Business Machines Corporation
- Shafaat Ahmed
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure and Method of Fabricating a CZTS Photovoltaic Device by E...
- Publication number 20120061790
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Shafaat Ahmed
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for permanently bonding wafers

Method for applying a bonding layer

Sensor and manufacturing method thereof

Method for applying a bonding layer

Structure and method of fabricating a CZTS photovoltaic device by e...

Structure and method of fabricating a CZTS photovoltaic device by e...

Lid attach process

Structure and method of fabricating a CZTS photovoltaic device by e...

Patents Applicationslast 30 patents

SENSOR AND MANUFACTURING METHOD THEREOF

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR APPLYING A BONDING LAYER

Structure and Method of Fabricating a CZTS Photovoltaic Device by E...

LID ATTACH PROCESS

Structure and Method of Fabricating a CZTS Photovoltaic Device by E...

Structure and Method of Fabricating a CZTS Photovoltaic Device by E...