Outer radiating structures on heat dissipating housings

Industry

CPC
H05K7/20409

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20409Outer radiating structures on heat dissipating housings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Projection device
- Patent number RE50258
- Issue date Dec 31, 2024
- Coretronic Corporation
- Jhih-Hao Chen
Information Patent Grant
Enhanced thermal management in electrical boxes
- Patent number 12,178,004
- Issue date Dec 24, 2024
- Crestron Electronics, Inc.
- Edward Joy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated controller and vehicle including the same
- Patent number 12,178,016
- Issue date Dec 24, 2024
- Hyundai Motor Company
- Jae Yong Park
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and apparatus for venturi nozzle heat exhaust for an informa...
- Patent number 12,167,563
- Issue date Dec 10, 2024
- Dell Products L.P.
- Qinghong He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Potting boat heat sink
- Patent number 12,157,217
- Issue date Dec 3, 2024
- Milwaukee Electric Tool Corporation
- Mauricio Builes Zapata
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Housing structure
- Patent number 12,156,380
- Issue date Nov 26, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Ming Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device
- Patent number 12,156,379
- Issue date Nov 26, 2024
- Kioxia Corporation
- Seiichi Tajima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation device of electronic equipment
- Patent number 12,156,381
- Issue date Nov 26, 2024
- Techway Industrial Co., Ltd.
- Fu Hsiang Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-dimensional column-based heat dissipation features for datace...
- Patent number 12,150,284
- Issue date Nov 19, 2024
- NVIDIA Corporation
- Susheela Nanjunda Rao Narasimhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling for power distribution systems
- Patent number 12,144,156
- Issue date Nov 12, 2024
- Hamilton Sundstrand Corporation
- Debabrata Pal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoconductive structure of socket connector
- Patent number 12,142,872
- Issue date Nov 12, 2024
- JESS-LINK PRODUCTS CO., LTD.
- Ming-Jun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device for a vehicle electronic control unit and controller...
- Patent number 12,144,144
- Issue date Nov 12, 2024
- Aptiv Technologies AG
- Jakub Korta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device heat dissipation system with sugar alcohol phase...
- Patent number 12,137,539
- Issue date Nov 5, 2024
- Beihang University
- Yuming Xing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive assembly, camera module and electronic device
- Patent number 12,133,364
- Issue date Oct 29, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Chao Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,127,377
- Issue date Oct 22, 2024
- Hitachi Astemo, Ltd.
- Keiko Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-capacity memory air cooling device
- Patent number 12,124,302
- Issue date Oct 22, 2024
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Jeffrey S Holland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid-cooling heat dissipation plate with unequal height pin-fins...
- Patent number 12,120,845
- Issue date Oct 15, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Yi-Hsin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic apparatus and cooling module
- Patent number 12,108,561
- Issue date Oct 1, 2024
- Lenovo (Singapore) Pte. Ltd.
- Junki Hashiba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Regulating temperature of an image sensor using a thermoelectric co...
- Patent number 12,108,575
- Issue date Oct 1, 2024
- GHOST AUTONOMY INC.
- Efrain Hernandez Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication systems having pluggable optical modules
- Patent number 12,101,904
- Issue date Sep 24, 2024
- Nubis Communications, Inc.
- Christopher Robert Cole
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 12,096,598
- Issue date Sep 17, 2024
- Lenovo (Singapore) Pte. Ltd.
- Kengo Sano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling device and data processing apparatus
- Patent number 12,096,597
- Issue date Sep 17, 2024
- ANTPOOL TECHNOLOGIES LIMITED
- Hanlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal-control structure for speakers and associated appar...
- Patent number 12,082,377
- Issue date Sep 3, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vapor chamber, heat sink, and terminal
- Patent number 12,082,381
- Issue date Sep 3, 2024
- Huawei Technologies Co., Ltd.
- Denis Yurchenko
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic control device
- Patent number 12,082,376
- Issue date Sep 3, 2024
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system with a cooling device with at least a pressing po...
- Patent number 12,066,876
- Issue date Aug 20, 2024
- ASUSTeK COMPUTER Inc.
- Kuo-Chin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation member including fin groups
- Patent number 12,061,057
- Issue date Aug 13, 2024
- Nidec Corporation
- Kazuhiro Nishikawa
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LIDAR HEAT DISSIPATION STRUCTURE AND LIDAR
- Publication number 20250004513
- Publication date Jan 2, 2025
- INNOVUSION (SUZHOU) CO., LTD.
- Guojun LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL BRIDGE FOR THERMALLY CONDUCTIVE TRANSPORT OF HEAT
- Publication number 20250008695
- Publication date Jan 2, 2025
- Phoenix Contact GmbH & Co. KG
- Frank Best
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY MODULE ASSEMBLY
- Publication number 20240429534
- Publication date Dec 26, 2024
- Hyundai Motor Company
- Kang Woo Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD
- Publication number 20240431073
- Publication date Dec 26, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL SYSTEM WITH COOLING BY HEAT-TRANSFER FLUID
- Publication number 20240422953
- Publication date Dec 19, 2024
- SAFRAN
- Toni YOUSSEF
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT CONDUCTOR ASSEMBLY
- Publication number 20240393665
- Publication date Nov 28, 2024
- GoPro, Inc.
- David Thomas Platner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...
- Publication number 20240397669
- Publication date Nov 28, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240385664
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroyuki TAKAOKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...
- Publication number 20240381585
- Publication date Nov 14, 2024
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-SUPPLY BOX FOR VEHICLE
- Publication number 20240381578
- Publication date Nov 14, 2024
- YAZAKI CORPORATION
- Kazuomi Kiyosue
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE
- Publication number 20240363477
- Publication date Oct 31, 2024
- Honor Device Co., Ltd.
- Erliang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VARIABLE PIN HEAT SINK
- Publication number 20240349458
- Publication date Oct 17, 2024
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Ronald O. Grover
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLED MULTI-CHIP COLD PLATES
- Publication number 20240341057
- Publication date Oct 10, 2024
- The Research Foundation for the State University of New York
- Bahgat G. Sammakia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
- Publication number 20240329342
- Publication date Oct 3, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Application
CONTROLLER WITH COOLING
- Publication number 20240334642
- Publication date Oct 3, 2024
- Eaton Intelligent Power Limited
- Sachin Appasaheb PATIL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240334619
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Eri Kuwahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink and device with integrated heatsink
- Publication number 20240318929
- Publication date Sep 26, 2024
- International Business and Technology Service Corporation
- Kaizhong Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE, LIGHT SOURCE DEVICE, AND IMAGE PROJECTION APPARATUS
- Publication number 20240324137
- Publication date Sep 26, 2024
- Mayu BANNO
- F21 - LIGHTING
Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20240314978
- Publication date Sep 19, 2024
- NIDEC CORPORATION
- Kengo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...
- Publication number 20240306348
- Publication date Sep 12, 2024
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Heat Dissipation Structure of Electronic E...
- Publication number 20240298424
- Publication date Sep 5, 2024
- Honor Device Co., Ltd.
- Hanghang Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20240292569
- Publication date Aug 29, 2024
- EGGTRONIC ENGINEERING S.P.A.
- Igor SPINELLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Outdoor networking equipment enclosure utilizing internal open fram...
- Publication number 20240292558
- Publication date Aug 29, 2024
- CIENA CORPORATION
- Chander Prakash Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE, AND ELECTRICITY-CONSUMP...
- Publication number 20240292578
- Publication date Aug 29, 2024
- SHENZHEN RSPOWER TECHNOLOGY CO., LTD.
- Liangyin GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240268060
- Publication date Aug 8, 2024
- Hitachi Astemo, Ltd.
- Minami TERANISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...
- Publication number 20240268076
- Publication date Aug 8, 2024
- ROHDE & SCHWARZ GMBH & CO. KG
- Yin TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SUB-SYSTEM ENCLOSURE
- Publication number 20240268077
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED THERMAL MANAGEMENT IN ELECTRICAL BOXES
- Publication number 20240268064
- Publication date Aug 8, 2024
- CRESTRON ELECTRONICS, INC.
- Edward Joy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Outer radiating structures on heat dissipating housings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Projection device

Enhanced thermal management in electrical boxes

Integrated controller and vehicle including the same

Thermal management device for circuit breakers

Method and apparatus for venturi nozzle heat exhaust for an informa...

Potting boat heat sink

Housing structure

Semiconductor storage device

Heat dissipation device of electronic equipment

Multi-dimensional column-based heat dissipation features for datace...

Cooling for power distribution systems

Cooling apparatus for electronic element

Thermoconductive structure of socket connector

Cooling device for a vehicle electronic control unit and controller...

Electronic device heat dissipation system with sugar alcohol phase...

Photosensitive assembly, camera module and electronic device

Electronic control device

High-capacity memory air cooling device

Liquid-cooling heat dissipation plate with unequal height pin-fins...

Heatsink with increased air flow

Electronic apparatus and cooling module

Regulating temperature of an image sensor using a thermoelectric co...

Communication systems having pluggable optical modules

Electronic apparatus

Cooling device and data processing apparatus

Passive thermal-control structure for speakers and associated appar...

Vapor chamber, heat sink, and terminal

Electronic control device

Electronic system with a cooling device with at least a pressing po...

Heat dissipation member including fin groups

Patents Applicationslast 30 patents

LIDAR HEAT DISSIPATION STRUCTURE AND LIDAR

THERMAL BRIDGE FOR THERMALLY CONDUCTIVE TRANSPORT OF HEAT

BATTERY MODULE ASSEMBLY

CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD

ELECTRICAL SYSTEM WITH COOLING BY HEAT-TRANSFER FLUID

HEAT CONDUCTOR ASSEMBLY

PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...

ELECTRONIC DEVICE

DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...

POWER-SUPPLY BOX FOR VEHICLE

THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE

VARIABLE PIN HEAT SINK

LIQUID COOLED MULTI-CHIP COLD PLATES

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

CONTROLLER WITH COOLING

ELECTRONIC DEVICE

Heatsink and device with integrated heatsink

COOLING DEVICE, LIGHT SOURCE DEVICE, AND IMAGE PROJECTION APPARATUS

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...

COOLING DEVICE

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...

Method for Manufacturing Heat Dissipation Structure of Electronic E...

COOLING DEVICE

Outdoor networking equipment enclosure utilizing internal open fram...

HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE, AND ELECTRICITY-CONSUMP...

ELECTRONIC CONTROL DEVICE

HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...

MEMORY SUB-SYSTEM ENCLOSURE

ENHANCED THERMAL MANAGEMENT IN ELECTRICAL BOXES