Outgassing

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CPC
H01L2924/3641

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3641Outgassing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display apparatus
- Patent number 11,705,546
- Issue date Jul 18, 2023
- Samsung Display Co., Ltd.
- Junhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting die
- Patent number 11,069,651
- Issue date Jul 20, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducter device with filler to suppress generation of air bubb...
- Patent number 10,727,145
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Harada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,340,237
- Issue date Jul 2, 2019
- Kokusai Electric Corporation
- Hideharu Itatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clip
- Patent number 9,118,126
- Issue date Aug 25, 2015
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having gap-filler injection-friendly structure
- Patent number 8,946,909
- Issue date Feb 3, 2015
- Samsung Electronics Co., Ltd.
- Yun-rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package manufacturing method
- Patent number 8,936,968
- Issue date Jan 20, 2015
- Ableprint Technology Co., Ltd.
- Horng Chih Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,574,963
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing chip elements equipped with wire insertion gro...
- Patent number 8,445,328
- Issue date May 21, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY
- Publication number 20230275057
- Publication date Aug 31, 2023
- Mitsui Chemicals, Inc.
- Yuzo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING DIE
- Publication number 20200321311
- Publication date Oct 8, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERTER
- Publication number 20190206751
- Publication date Jul 4, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroyuki HARADA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190081014
- Publication date Mar 14, 2019
- Hitachi Kokusai Electric Inc.
- Hideharu ITATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
- Publication number 20170200695
- Publication date Jul 13, 2017
- Evatec AG
- Wolfgang Rietzler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20160333238
- Publication date Nov 17, 2016
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140197549
- Publication date Jul 17, 2014
- Samsung Electronics Co., Ltd.
- Seok-Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE MANUFACTURING METHOD
- Publication number 20130065362
- Publication date Mar 14, 2013
- ABLEPRINT TECHNOLOGY CO., LTD.
- HORNG CHIH HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CHIP ELEMENTS EQUIPPED WITH WIRE INSERTION GRO...
- Publication number 20120064671
- Publication date Mar 15, 2012
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120052628
- Publication date Mar 1, 2012
- RENESAS ELECTRONICS CORPORATION
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure with underfilling material and packaging method t...
- Publication number 20120032328
- Publication date Feb 9, 2012
- Global Unichip Corporation
- Yu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board And Semiconductor Package Including The Same
- Publication number 20110309526
- Publication date Dec 22, 2011
- Samsung Electronics Co., Ltd.
- Yun-rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy Resin Composition and Die Bonding Material Comprising the Com...
- Publication number 20090133833
- Publication date May 28, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus

Method of mounting die

Systems and methods for improved delamination characteristics in a...

Semiconducter device with filler to suppress generation of air bubb...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method of manufacturing semiconductor device

Bonding interface layer

Semiconductor component support and semiconductor device

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Power semiconductor package with conductive clip

Semiconductor package having gap-filler injection-friendly structure

Flip chip package manufacturing method

Method of manufacturing semiconductor device

Method for producing chip elements equipped with wire insertion gro...

IGBT power semiconductor package having a conductive clip

Patents Applicationslast 30 patents

COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY

METHOD OF MOUNTING DIE

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERTER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

BONDING INTERFACE LAYER

APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Power Semiconductor Package with Conductive Clip

FLIP CHIP PACKAGE MANUFACTURING METHOD

IGBT Power Semiconductor Package Having a Conductive Clip

METHOD FOR PRODUCING CHIP ELEMENTS EQUIPPED WITH WIRE INSERTION GRO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Package structure with underfilling material and packaging method t...

Printed Circuit Board And Semiconductor Package Including The Same

Epoxy Resin Composition and Die Bonding Material Comprising the Com...