outside the bonding interface

Industry

CPC
H01L2224/32505

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32505outside the bonding interface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,810,886
- Issue date Nov 7, 2023
- Japan Display Inc.
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device incorporating self-assembled monolayer and method of...
- Patent number 11,430,759
- Issue date Aug 30, 2022
- Samsung Display Co., Ltd.
- Dae Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,355,419
- Issue date Jun 7, 2022
- Amosense Co., Ltd.
- Ik-Seong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and optical coupling device
- Patent number 10,833,055
- Issue date Nov 10, 2020
- Kabushiki Kaisha Toshiba
- Naoya Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cohesively connecting a first component of a power semic...
- Patent number 10,438,924
- Issue date Oct 8, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and optical coupling device
- Patent number 10,115,714
- Issue date Oct 30, 2018
- Kabushiki Kaisha Toshiba
- Naoya Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-ceramic bonded body and power module substrate
- Patent number 10,103,035
- Issue date Oct 16, 2018
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive paste, and electrically conducive connectio...
- Patent number 10,046,418
- Issue date Aug 14, 2018
- Furukawa Electric Co., Ltd.
- Shunji Masumori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding with silver paste
- Patent number 9,972,597
- Issue date May 15, 2018
- Hyundai Motor Company
- Kyoung-Kook Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device in which an electrode of a semiconductor eleme...
- Patent number 9,824,994
- Issue date Nov 21, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die warpage control for thin die assembly
- Patent number 9,659,899
- Issue date May 23, 2017
- Intel Corporation
- Sandeep B. Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and non-conductive paste including zinc particl...
- Patent number 9,376,541
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Un-byoung Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 9,024,205
- Issue date May 5, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Connecting material having metallic particles of an oxygen state ra...
- Patent number 8,421,247
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Hiroki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
No-flow underfill composition and method
- Patent number 7,619,318
- Issue date Nov 17, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill composition and method
- Patent number 6,982,492
- Issue date Jan 3, 2006
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20210391293
- Publication date Dec 16, 2021
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER-CONTAINING FILM
- Publication number 20210238456
- Publication date Aug 5, 2021
- DEXERIALS CORPORATION
- Makoto MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210111142
- Publication date Apr 15, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dae Ho SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20200335422
- Publication date Oct 22, 2020
- AMOSENSE CO., LTD.
- Ik-Seong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200006275
- Publication date Jan 2, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE
- Publication number 20190019784
- Publication date Jan 17, 2019
- Kabushiki Kaisha Toshiba
- Naoya TAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASS...
- Publication number 20180308820
- Publication date Oct 25, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE
- Publication number 20170069610
- Publication date Mar 9, 2017
- Kabushiki Kaisha Toshiba
- Naoya TAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
- Publication number 20160358791
- Publication date Dec 8, 2016
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160126207
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY
- Publication number 20150318258
- Publication date Nov 5, 2015
- Intel Corporation
- SANDEEP B. SANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150228617
- Publication date Aug 13, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY
- Publication number 20140091470
- Publication date Apr 3, 2014
- Sandeep B. Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECT...
- Publication number 20130001774
- Publication date Jan 3, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Shunji Masumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE
- Publication number 20110101543
- Publication date May 5, 2011
- Hiroki Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

outside the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Advanced device assembly structures and methods

Semiconductor device comprising a can housing a semiconductor die w...

Display device

Semiconductor device with enhanced thermal dissipation and method f...

Display device incorporating self-assembled monolayer and method of...

Power semiconductor module

Electronic packaging structure

Multi-layered composite bonding materials and power electronics ass...

Semiconductor device and optical coupling device

Method for cohesively connecting a first component of a power semic...

Semiconductor device and optical coupling device

Copper-ceramic bonded body and power module substrate

Bonding interface layer

Electrically conductive paste, and electrically conducive connectio...

Method of bonding with silver paste

Semiconductor device in which an electrode of a semiconductor eleme...

Au-based solder die attachment semiconductor device and method for...

Die warpage control for thin die assembly

Joint material, and jointed body

Mounting method

Process for connecting joining parts

Non-conductive film and non-conductive paste including zinc particl...

Package structure and the method to manufacture thereof

Advanced device assembly structures and methods

Electrically conductive bonding material, method of bonding with th...

Connecting material having metallic particles of an oxygen state ra...

Method and structure for wafer to wafer bonding in semiconductor pa...

No-flow underfill composition and method

No-flow underfill composition and method

Patents Applicationslast 30 patents

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

Dielectric Blocking Layer and Method Forming the Same

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Advanced Device Assembly Structures And Methods

DISPLAY DEVICE

FILLER-CONTAINING FILM

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE

MULTI-LAYERED COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASS...

BONDING INTERFACE LAYER

SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE

COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Joint Material, and Jointed Body

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECT...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE