outside the capillary

Industry

CPC
H01L2224/78307

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78307outside the capillary

Industries

Patents Grantslast 30 patents

Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,566,307
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Yuu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,416,107
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame for improving molding reliability and semiconductor pack...
- Patent number 7,180,161
- Issue date Feb 20, 2007
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding simulation
- Patent number 7,085,699
- Issue date Aug 1, 2006
- Texas Instruments Incorporated
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,966,480
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,595,406
- Issue date Jul 22, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,439,450
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,311,890
- Issue date Nov 6, 2001
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,158,647
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch bonding method using rectangular wire and capillary bore
- Patent number 6,109,508
- Issue date Aug 29, 2000
- Texas Instruments Incorporated
- John Orcutt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch bonding technique using rectangular wire and capillary bore
- Patent number 6,032,850
- Issue date Mar 7, 2000
- Texas Instruments Incorporated
- John Orcutt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an IC device using a single-headed bonder
- Patent number 5,979,743
- Issue date Nov 9, 1999
- Texas Instruments Incorporated
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitch bond enhancement for hard-to-bond materials
- Patent number 5,960,262
- Issue date Sep 28, 1999
- Texas Instruments Incorporated
- Orlando F. Torres
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...
- Publication number 20080242076
- Publication date Oct 2, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20060032888
- Publication date Feb 16, 2006
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead frame for improving molding reliability and semiconductor pack...
- Publication number 20060006505
- Publication date Jan 12, 2006
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding simulation
- Publication number 20050133566
- Publication date Jun 23, 2005
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20040056072
- Publication date Mar 25, 2004
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary
- Publication number 20020134819
- Publication date Sep 26, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary
- Publication number 20020023943
- Publication date Feb 28, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS

outside the capillary

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curtain airbag device mounting structure and curtain airbag deploym...

Manufacturing method of semiconductor device

Semiconductor device

Semiconductor device

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Lead frame for improving molding reliability and semiconductor pack...

Wire bonding simulation

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Concave face wire bond capillary

Concave face wire bond capillary

Concave face wire bond capillary

Fine pitch bonding method using rectangular wire and capillary bore

Fine pitch bonding technique using rectangular wire and capillary bore

Method for making an IC device using a single-headed bonder

Stitch bond enhancement for hard-to-bond materials

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...

Concave face wire bond capillary and method

Lead frame for improving molding reliability and semiconductor pack...

Wire bonding simulation

Concave face wire bond capillary and method

Concave face wire bond capillary

Concave face wire bond capillary