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H01L2224/78319

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78319outside the capillary

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,987,753
- Issue date Apr 27, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,449,627
- Issue date Oct 22, 2019
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra fine pitch wedge for thicker wire
- Patent number 9,543,267
- Issue date Jan 10, 2017
- MICRO POINT PRO LTD.
- Uri Zaks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA FINE PITCH WEDGE FOR THICKER WIRE
- Publication number 20140203065
- Publication date Jul 24, 2014
- Micro Point Pro LTD.
- Uri Zaks
- H01 - BASIC ELECTRIC ELEMENTS