outside the semiconductor or solid-state body

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H01L2224/09104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09104outside the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate, semiconductor package and method of manufacturin...
- Patent number 9,640,503
- Issue date May 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved contact structure
- Patent number 8,860,218
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bump heights and multiple bump...
- Patent number 8,704,371
- Issue date Apr 22, 2014
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...
- Publication number 20160155716
- Publication date Jun 2, 2016
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE BUMP HEIGHTS AND MULTIPLE BUMP...
- Publication number 20130087910
- Publication date Apr 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- RAMLAH BINTE ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT STRUCTURE
- Publication number 20130087909
- Publication date Apr 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- RAMLAH BINTE ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIPS HAVING MULTIPLE SOLDER BUMP GEOMETRIES
- Publication number 20130026630
- Publication date Jan 31, 2013
- ChauChin Low
- H01 - BASIC ELECTRIC ELEMENTS