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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49427outside the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 8,885,356
- Issue date Nov 11, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 8,466,564
- Issue date Jun 18, 2013
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitch bump stacking design for overall package size reduction for...
- Patent number 8,357,563
- Issue date Jan 22, 2013
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bond connection system
- Patent number 8,181,845
- Issue date May 22, 2012
- Robert Bosch GmbH
- Manfred Reinold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,008,785
- Issue date Aug 30, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond and method for bonding two contact surfaces
- Patent number 7,582,832
- Issue date Sep 1, 2009
- Robert Bosch GmbH
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a number of bonding leads and method for...
- Patent number 7,391,121
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 7,285,854
- Issue date Oct 23, 2007
- Denso Corporation
- Katsumi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and method of assembling the same
- Patent number 7,274,092
- Issue date Sep 25, 2007
- Infineon Technologies, AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
- Publication number 20180005979
- Publication date Jan 4, 2018
- CIENA CORPORATION
- Simon Savard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20120153435
- Publication date Jun 21, 2012
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20120155042
- Publication date Jun 21, 2012
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...
- Publication number 20120038059
- Publication date Feb 16, 2012
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
- Publication number 20110147928
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BOND CONNECTION SYSTEM
- Publication number 20110121059
- Publication date May 26, 2011
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond and method for bonding two contact surfaces
- Publication number 20080006437
- Publication date Jan 10, 2008
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method of assembling the same
- Publication number 20070057350
- Publication date Mar 15, 2007
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a number of bonding leads and method for...
- Publication number 20060186554
- Publication date Aug 24, 2006
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and semiconductor device
- Publication number 20050205995
- Publication date Sep 22, 2005
- DENSO Corporation
- Katsumi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device and wire bonding appar...

Enhanced stacked microelectronic assemblies with central contacts a...

Microelectronic assembly with joined bond elements having lowered i...

Enhanced stacked microelectronic assemblies with central contacts a...

Microelectronic assembly with joined bond elements having lowered i...

Stitch bump stacking design for overall package size reduction for...

Electrical bond connection system

Microelectronic assembly with joined bond elements having lowered i...

Bond and method for bonding two contact surfaces

Semiconductor device with a number of bonding leads and method for...

Wire bonding method and semiconductor device

Semiconductor component and method of assembling the same

Patents Applicationslast 30 patents

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

ELECTRICAL BOND CONNECTION SYSTEM

Bond and method for bonding two contact surfaces

Semiconductor component and method of assembling the same

Semiconductor device with a number of bonding leads and method for...

Wire bonding method and semiconductor device